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    • 2. 发明申请
    • FLOW CONTROL DEVICE AND COOLED ELECTRONIC SYSTEM EMPOLYING THE SAME
    • 流动控制装置和冷却电子系统
    • US20110128704A1
    • 2011-06-02
    • US12943089
    • 2010-11-10
    • Chris SC ChangEdward YC KungBill KP LamIan YY LinMorgan YL Wu
    • Chris SC ChangEdward YC KungBill KP LamIan YY LinMorgan YL Wu
    • H05K7/20
    • H05K7/20727
    • A flow control device and a related cooled electronic system are provided. The electronic system comprises a first heat dissipation component and a second heat dissipation component. The flow control device controls an amount of an air flow to the first heat dissipation component and the second heat dissipation component. In one illustrative embodiment, the flow control device comprises: a memory metal component coupled to the first heat dissipation component and the second heat dissipation component and a movable component comprising a first end and a second end. The first end is coupled to a point between two ends of the memory metal component and the second end is movable with respect to the first end. In response to a temperature difference between the first heat dissipation component and the second heat dissipation component, the second end approaches the first heat dissipation component or the second heat dissipation component.
    • 提供流量控制装置和相关的冷却电子系统。 电子系统包括第一散热部件和第二散热部件。 流量控制装置控制到第一散热部件和第二散热部件的空气流量。 在一个说明性实施例中,流量控制装置包括:耦合到第一散热部件和第二散热部件的存储金属部件和包括第一端和第二端的可移动部件。 第一端耦合到存储金属部件的两端之间的点,并且第二端可相对于第一端移动。 响应于第一散热部件和第二散热部件之间的温度差,第二端部接近第一散热部件或第二散热部件。