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    • 1. 发明申请
    • Encapsulating OLED devices
    • 封装OLED器件
    • US20050248270A1
    • 2005-11-10
    • US10839513
    • 2004-05-05
    • Amalkumar GhoshMichael BorosonFridrich VazanJoseph YokajtyGeorge Olin
    • Amalkumar GhoshMichael BorosonFridrich VazanJoseph YokajtyGeorge Olin
    • H01L27/32H01L51/00H01L51/52H05B33/00H05B33/04
    • H01L51/5259H01L27/3297H01L51/524H01L51/5253H01L51/5262
    • An encapsulated OLED device includes a substrate having a predetermined glass seal area and defining a sealed region and one or more OLED unit(s) provided over the substrate, each OLED unit having a light-emitting portion including at least one first electrode, at least one second electrode spaced from the first electrode, and an organic EL media layer provided between the first and second electrodes, wherein the light-emitting portion is provided within the sealed region. The device also includes an inorganic protection layer provided over the glass seal area and over at least a portion of the sealed region, a cover provided over the substrate and OLED unit(s), and sintered glass frit seal material provided in the glass seal area and in contact with both the cover and the inorganic protection layer to bond the cover to the inorganic protection layer and provide sealing against moisture penetration into the sealed region.
    • 封装的OLED器件包括具有预定玻璃密封区域并限定密封区域的衬底和设置在衬底上的一个或多个OLED单元,每个OLED单元至少包括至少一个第一电极的发光部分 与第一电极间隔开的一个第二电极和设置在第一和第二电极之间的有机EL介质层,其中发光部分设置在密封区域内。 该装置还包括设置在玻璃密封区域上方以及至少一部分密封区域的无机保护层,设置在基板和OLED单元上的盖,以及设置在玻璃密封区域中的烧结玻璃料密封材料 并且与盖和无机保护层接触以将盖粘合到无机保护层并提供密封以防止湿气渗透到密封区域中。