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1. 发明专利

JP2007087679A Connecting element 审中-公开
标题翻译：连接元件
公开(公告)号：JP2007087679A
公开(公告)日：2007-04-05
申请号：JP2005273120
申请日：2005-09-21
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： SOEDA KAORU
IPC分类号： H01R13/24 , G01R1/067 , G01R1/073 , H01R13/03 , H01R33/76
CPC分类号： H01R13/2414 , H01R13/6599 , H05K3/326
摘要： PROBLEM TO BE SOLVED: To provide a connecting member with improved vibration-damping properties as compared with the prior art. SOLUTION: The connecting member 10 is composed of an elastic contact 12 and a pedestal 11. The pedestal 11 is constituted of a substrate 13, a sheet member 14, fixed contact 15 or the like. At least either the substrate 13, the sheet member 14, or the fixed contact 15 is formed equipped with a vibration-damping alloy. With this, even if vibration is transmitted to the connecting member 10, it can be appropriately absorbed by the pedestal 11 to appropriately prevent shut-off, coming-off of the connecting member 10, or the like. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：与现有技术相比，提供具有改进的减振性能的连接构件。解决方案：连接构件10由弹性接触件12和基座11构成。基座11由基板13，片状构件14，固定接点15等构成。至少衬底13，片状构件14或固定接点15中的至少一个形成有防振合金。由此，即使振动传递到连接部件10，也可以适当地防止连接部件10的切断，脱落等。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2006302642A Contact module and its manufacturing method, and member with contact using above contact module and its manufacturing method 审中-公开
标题翻译：接触模块及其制造方法，以及使用上述接触模块及其制造方法接触的部件
公开(公告)号：JP2006302642A
公开(公告)日：2006-11-02
申请号：JP2005122234
申请日：2005-04-20
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： SOEDA KAORU
IPC分类号： H01R13/24 , H01L21/60 , H01R43/16
摘要： PROBLEM TO BE SOLVED: To provide a contact module and its manufacturing method easier to mount on an electronic component, a mother board, or the like than conventional one, and also to provide a member with a contact using the above contact module and its manufacturing method.
SOLUTION: The contact module 1 comprising a spiral contactor 2 and a bump 3 under the spiral contactor 2 is inserted into a through-hole 11 formed on the mother board 10, and the bump 3 is caulked from a rear-face 10a of the mother board 10. With this, the contact module 1 is easily and appropriately fixed to and held by the mother board 10.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种比常规的更容易安装在电子部件，母板等上的接触模块及其制造方法，并且还使用上述接触模块来提供具有接触的部件及其制造方法。解决方案：包括螺旋接触器2和螺旋接触器2下方的凸起3的接触模块1插入到形成在母板10上的通孔11中，并且凸块3从背面10a铆接由此，接触模块1容易且适当地固定到母板10并由母板10固定。版权所有：（C）2007，JPO＆INPIT

3. 发明专利

JP2006292727A Semiconductor transfer tray, burn-in board using the same, inspection apparatus for burn-in test, burn-in test method, and semiconductor manufacturing method 审中-公开
标题翻译：半导体传输托盘，使用其的烧录板，用于烧录测试的检查装置，烧结测试方法和半导体制造方法
公开(公告)号：JP2006292727A
公开(公告)日：2006-10-26
申请号：JP2006049924
申请日：2006-02-27
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： SOEDA KAORU , UCHIDA SUSUMU
IPC分类号： G01R31/26
CPC分类号： G01R31/2865
摘要： PROBLEM TO BE SOLVED: To provide a semiconductor transfer tray for tests capable of collectively handling a plurality of semiconductors (IC packages etc. ) during the tests and provide a burn-in board using the same, an inspection apparatus for burn-in tests, a burn-in test method, and a semiconductor manufacturing method.
SOLUTION: By mounting the semiconductor transfer tray 40 on a housing part 27 of a housing 25 of the burn-in board 22 and closing a lid body, it is possible to mount a large number of semiconductors 10 onto the burn-in board 22. By placing the burn-in board 22 in this state in the burn-in test apparatus, it is possible to collectively test the plurality of semiconductors 10. Since the need for one-to-one correspondence between the semiconductors 10 and pairs of sockets for holding the same as before is eliminated, it is possible to inspect a larger number of semiconductors 10 at once than before.
COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于在测试期间能够共同处理多个半导体（IC封装等）的测试的半导体传输托盘，并提供使用该半导体的老化板的烧录板，在测试中，老化测试方法和半导体制造方法。解决方案：通过将半导体传输托盘40安装在老化板22的壳体25的壳体部分27上并闭合盖体，可以将大量的半导体10安装到老化通过将老化板22置于老化测试装置中，可以集中测试多个半导体10.由于半导体10和对之间需要一对一的对应关系用于保持与之前相同的插座，可以比以前一次检查更多数量的半导体10。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006208062A Contact member, contact sheet using contact member, contact substrate, and electronic equipment unit 审中-公开
标题翻译：联系会员，联系方式使用联系人，联系人和电子设备单元
公开(公告)号：JP2006208062A
公开(公告)日：2006-08-10
申请号：JP2005017611
申请日：2005-01-26
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： OKAMOTO YASUSHI , SOEDA KAORU
IPC分类号： G01R1/067 , G01R1/073 , H01H1/06 , H01L23/32 , H01R13/24
摘要： PROBLEM TO BE SOLVED: To provide a contact member and the like, capable of stabilizing an electric characteristic when joining an electrical component to the contact member by soldering, and capable of preventing damages or the like of the contact member, by limiting the formation areas of an Au plating layer, in particular, formed on the surface of a spiral contact.
SOLUTION: The Au plating layer 41 is provided only in the tip region 36b of a deformed part of the spiral contact. The tip area 36b is thereby solder-jointed to a terminal part of the electrical component via the Au plating layer 41, and the fused solder stays only in the tip region 36b of the spiral contact, and will not flow along a support 35 direction of the spiral contact 34. Contact resistance, when made to be solder-jointed to the terminal part tends to be stabilized, as compared with conventional types. The solder-jointed part or the like between the tip region 36b of the deformed part 36 and the connection terminal is appropriately prevented from being damaged by vibration or impact.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种接触构件等，当通过焊接将电气部件接合到接触构件时能够稳定电特性，并且能够防止接触构件的损坏等，通过限制特别是形成在螺旋接触面的Au镀层的形成区域。解决方案：Au镀层41仅设置在螺旋形触头的变形部分的尖端区域36b中。因此，尖端区域36b通过Au镀层41焊接到电气部件的端子部分，并且熔融焊料仅保持在螺旋接触件的尖端区域36b中，并且不会沿着支撑件35的方向流动螺旋接触34.与常规类型相比，接触电阻当被焊接到端子部时趋向于稳定。适当地防止变形部36的前端区域36b与连接端子之间的焊接部等被振动或冲击破坏。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2014200712A 廃棄物の処理方法有权
标题翻译：处理废物的方法
公开(公告)号：JP2014200712A
公开(公告)日：2014-10-27
申请号：JP2013076854
申请日：2013-04-02
申请人：アルプス電気株式会社 , Alps Electric Co Ltd
发明人： YAMAMOTO YUTAKA , SOEDA KAORU , TERADA TOMOHISA , HANADA SHIGERU
IPC分类号： B09B3/00 , G21F9/30 , G21F9/36
摘要：【目的】特に、従来に比べて、放射性廃棄物の飛散を防止しかつ長期間の保管を安定して確保することが可能になる廃棄物の処理方法を提供することを目的としている。【解決手段】本発明における放射性廃棄物の物の処理方法は、放射性廃棄物1の表面を第1のガラス3で覆う工程、第1のガラス3の表面を第2のガラス5で覆う工程、を有し、第1のガラス3には第2のガラス5よりも低いガラス転移点を有する材料を用い、第2のガラス5には第1のガラス3よりも耐食性に優れた材料を用いて、ガラス固化体を形成することを特徴とする。【選択図】図1
摘要翻译：要解决的问题：提供一种处理废弃物的方法，特别是能够防止放射性废物的散射，并且与常规方法相比长期地稳定地确保储存。解决方案：一种处理放射性废物的方法，包括：具有第一玻璃3的放射性废物1的表面; 以及用第二玻璃5覆盖第一玻璃3的表面的步骤。通过使用具有比第一玻璃3的第二玻璃5的玻璃化转变点低的材料并使用材料形成固化玻璃体其耐蚀性比第二玻璃5的第一玻璃3的耐蚀性更优异。

6. 发明专利

JP2006331651A Connection structure of electronic function elements 审中-公开
标题翻译：电子功能元件的连接结构
公开(公告)号：JP2006331651A
公开(公告)日：2006-12-07
申请号：JP2005148874
申请日：2005-05-23
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： YOSHIDA MAKOTO , SOEDA KAORU
IPC分类号： H01R33/76
摘要： PROBLEM TO BE SOLVED: To provide a connection structure of electronic function elements capable of appropriately reducing delay of signal, electric reflection, radiation noise or the like. SOLUTION: An MPU 28 housed in an MPU socket 21 is connected to electronic function elements 64 housed in a north bridge 22 and a south bridge 23 through relay members 24, 25, and the shape of a wiring part 47 formed on the relay members 24, 25 in plane view is formed into a linear shape. By the above, the length of a path can be shortened, the speed of a signal can be promoted, and the radiation noise or the like can be appropriately reduced. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供能够适当地减少信号延迟，电反射，辐射噪声等的电子功能元件的连接结构。解决方案：容纳在MPU插座21中的MPU 28通过中继构件24,25连接到容纳在北桥22和南桥23中的电子功能元件64，并且形成在平面图中的中继构件24,25形成为直线状。通过上述，可以缩短路径的长度，可以促进信号的速度，并且可以适当地减少辐射噪声等。版权所有（C）2007，JPO＆INPIT

7. 发明专利

JP2006261566A Holder and holding sheet for electronic component, electronic module using them, laminate of electronic module, and manufacturing method and inspecting method for electronic module 审中-公开
标题翻译：电子元件的持有人和电子元件的电子模块，电子模块的层压板，电子模块的制造方法和检查方法
公开(公告)号：JP2006261566A
公开(公告)日：2006-09-28
申请号：JP2005079904
申请日：2005-03-18
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： SOEDA KAORU
IPC分类号： H01L21/60
CPC分类号： H05K3/326 , G01R1/0483 , H01L25/0652 , H01L25/18 , H01L2224/16 , H01L2224/16225 , H01L2224/81193 , H01L2224/81899 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01033 , H01L2924/01075 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/14 , H01L2924/15153 , H01L2924/15165 , H01L2924/15311 , H01L2924/19041 , H01L2924/19043 , H01L2924/3011 , H01L2924/351 , H05K3/305 , H05K3/4092 , H05K2201/10674 , H05K2201/10977 , H05K2203/162 , Y10T29/49004 , Y10T29/49126 , Y10T29/4913 , Y10T29/49169 , Y10T29/49208 , H01L2924/00
摘要： PROBLEM TO BE SOLVED: To provide a holder and a holding sheet for an electronic component that enable the electronic component to be detached in an inspection stage, and also enable only an electronic component having passed an examination to be fixed as it is, and to provide an electronic module etc., using them. SOLUTION: A plurality of spiral contactors 40 and an adhesive member 19 which has a thermosetting property are provided in a recess 12A formed on the holder 11. Various inspections are carried out while a bare chip 20A is put in the recess 12A, and respective spherical contactors 21 of the bare chip 20A are elastically pressed against the respective spiral contactors 40. When the inspections are passed, the whole holder is heated to thermally cure the adhesive member 19, and the bare chip 20A and holder 11 can be fixed while being held in an excellent connection state. If the inspections are rejected, only the bare chip 20A is detached and replaced with a new bare chip. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种用于电子部件的保持器和保持片，使得电子部件能够在检查台中拆卸，并且也使得只有通过检查的电子部件才能固定为原样，并提供使用它们的电子模块等。解决方案：具有热固性的多个螺旋接触器40和粘合部件19设置在形成在保持器11上的凹部12A中。在将裸芯片20A放入凹部12A中的同时进行各种检查，并且裸芯片20A的各个球形接触器21弹性地压靠在各螺旋接触器40上。当通过检查时，整个保持器被加热以使粘合构件19热固化，并且裸芯片20A和保持器11可以被固定同时保持良好的连接状态。如果检查被拒绝，则只有裸芯片20A被分离并且被新的裸芯片替代。版权所有（C）2006，JPO＆NCIPI

8. 发明专利

JP2005340177A Connection structure between substrate and component and its manufacturing method 审中-公开
标题翻译：基板与元件之间的连接结构及其制造方法
公开(公告)号：JP2005340177A
公开(公告)日：2005-12-08
申请号：JP2005113557
申请日：2005-04-11
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： TAKAI DAISUKE , SOEDA KAORU
IPC分类号： H01R33/76 , H01R12/00 , H01R13/24 , H05K1/18 , H05K3/32
CPC分类号： H01R13/2435 , H05K3/325 , H05K2201/0311 , H05K2201/10628
摘要： PROBLEM TO BE SOLVED: To provide a connection structure between a substrate and a component, whereby the electronic component can be mounted to an electronic component with a simple connection structure in comparison with a conventional structure, the connection structure can be miniaturized, and the electronic component can be fixed and held on the substrate after electrically inspecting the electronic component, and its manufacturing method. SOLUTION: Connector members 3, 7 have fixed parts 3a, 7a and arm portions 3b, 7b, and the electronic component 2 is fixed and held on the substrate 1 by deforming the arm portions 3b, 7 so as to rise upward from the fixed parts 3a, 7a, and sandwiching the electronic component 2 between the arm portions 3b, 7b of the connector members 3, 7 to fix and hold the electronic component 2 on the substrate 1. By this structure, the connection structure can be miniaturized in comparison with the case in which an IC socket or the like is used, and the electronic component 2 can be surely and simply mounted to the substrate 1. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供基板和部件之间的连接结构，由此与常规结构相比，电子部件可以以简单的连接结构安装到电子部件，可以使连接结构小型化，并且电子部件可以在电气检查电子部件之后固定并保持在基板上及其制造方法。
解决方案：连接器构件3,7具有固定部分3a，7a和臂部分3b，7b，并且电子部件2通过使臂部3b，7变形而被固定并保持在基板1上，以便从固定部分3a，7a，并且将电子部件2夹在连接器部件3,7的臂部3b，7b之间，以将电子部件2固定并保持在基板1上。通过这种结构，连接结构可以小型化与使用IC插座等的情况相比，电子部件2能够可靠且简单地安装到基板1上。（C）2006年，JPO＆NCIPI

9. 发明专利

JP2005302705A Base board 审中-公开
标题翻译：基板
公开(公告)号：JP2005302705A
公开(公告)日：2005-10-27
申请号：JP2005061961
申请日：2005-03-07
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： OKAMOTO YASUSHI , SOEDA KAORU
IPC分类号： H01R12/06 , H01R12/16
摘要： PROBLEM TO BE SOLVED: To provide a connector capable of downsizing by reducing a mounting area of the connector and having a good high frequency property. SOLUTION: For the base board 3, a plurality of spiral contacts 20 are formed on an upper surface 3a as a first surface, and a plurality of connection terminals 40 are formed on a lower surface 3b as a first surface, the spiral contacts 20 and the connection terminals 40 electrically connected. Since the spiral contacts 20 are arranged plurally in a flat matrix on the upper surface 3a as the first surface, many spiral contacts 20 can be provided on the base board, and a connector 1 can be substantially downsized. And also, a high-frequency property can be improved by the spiral contacts 20. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：通过减小连接器的安装面积并具有良好的高频特性来提供能够减小尺寸的连接器。解决方案：对于基板3，在作为第一表面的上表面3a上形成有多个螺旋形接触件20，并且在作为第一表面的下表面3b上形成有多个连接端子40，螺旋触点20和连接端子40电连接。由于螺旋接触件20在作为第一表面的上表面3a上以平面矩阵的形式多个布置，所以可以在基板上设置许多螺旋接触件20，并且连接器1可以基本上小型化。而且，通过螺旋触点20可以改善高频特性。（C）2006，JPO＆NCIPI

10. 发明专利

JP2005302689A Facing type connector 有权
标题翻译： FACING型连接器
公开(公告)号：JP2005302689A
公开(公告)日：2005-10-27
申请号：JP2004255739
申请日：2004-09-02
申请人： Alps Electric Co Ltd , アルプス電気株式会社
发明人： OKAMOTO YASUSHI , YOSHIDA MAKOTO , SOEDA KAORU
IPC分类号： H01R13/24 , H01R12/32
摘要： PROBLEM TO BE SOLVED: To provide a connector capable of enlarging a mounting area, downsizing, and having a good high-frequency property. SOLUTION: A substrate 3 and an insertion-coupling member 10 fixing a flexible printed wiring board 4 are inserted to be lapped into an insertion-coupling part 2c formed on a housing 2. Spiral contacts 20 are formed in a flat matrix and arranged in a plurality of rows on an upper surface 3a as a first surface on the substrate 3, and electrically connected to a connection terminal 40 formed on a lower surface 3b as a second surface. A plurality of outer part connection parts 4e are formed on a lower surface 4a2 of the wiring board 4, and when the substrate 3 and the wiring board 4 are inserted and coupled in the housing 2, the spiral contacts 20 and the outer part connection parts 4e are faced, pressure-welded, and electrically connected. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供一种能够扩大安装面积，缩小尺寸并具有良好高频特性的连接器。解决方案：将固定柔性印刷电路板4的基板3和插入耦合部件10插入到形成在壳体2上的插入联接部分2c中。螺旋触点20形成为平坦的矩阵，并且在作为基板3的第一面的上表面3a上排列成多列，并与形成在作为第二面的下表面3b的连接端子40电连接。多个外部连接部分4e形成在布线板4的下表面4a2上，并且当基板3和布线板4插入并联接在壳体2中时，螺旋触点20和外部连接部分 4e面对，压焊和电连接。版权所有（C）2006，JPO＆NCIPI

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