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1. 发明申请

US20100225436A1 MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS 审中-公开
标题翻译：微波电感器与通过六角形
公开(公告)号：US20100225436A1
公开(公告)日：2010-09-09
申请号：US12398942
申请日：2009-03-05
申请人： Alexandros Papavasiliou , Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
发明人： Alexandros Papavasiliou , Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
IPC分类号： H01F5/00 , H01F7/06
CPC分类号： H01F17/03 , H01F17/0013 , H01F2017/0086 , Y10T29/4902 , Y10T29/49073 , Y10T29/49165
摘要： The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral.
摘要翻译：本发明涉及具有贯通晶片通孔的微加工电感器。在一个实施例中，本发明是包括第一晶片，位于第一晶片内的第一多个金属填充物的电感器，以及将第一多个金属填料连接在一起以形成第一螺旋的第一多个金属导体，其具有第一多个绕组。在另一个实施例中，本发明是一种用于制造电感器的方法，包括以下步骤：在第一衬底中形成第一多个通孔，用第一多个金属填充物填充第一衬底中的第一多个通孔，形成第一多个金属导体和第一多个金属填充物的连接对使用第一多个金属导体形成螺旋。

2. 发明申请

US20110131798A1 MICROFABRICATED INDUCTORS WITH THROUGH-WAFER VIAS 有权
标题翻译：微波电感器与通过六角形
公开(公告)号：US20110131798A1
公开(公告)日：2011-06-09
申请号：US13027150
申请日：2011-02-14
申请人： Alexandros Papavasiliou , Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
发明人： Alexandros Papavasiliou , Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
IPC分类号： H01F7/06
CPC分类号： H01F17/03 , H01F17/0013 , H01F2017/0086 , Y10T29/4902 , Y10T29/49073 , Y10T29/49165
摘要： The present invention relates to microfabricated inductors with through-wafer vias. In one embodiment, the present invention is an inductor including a first wafer, a first plurality of metal fillings located within the first wafer, and a first plurality of metal conductors connecting the first plurality of metal fillings together to form a first spiral with a first plurality of windings. In another embodiment, the present invention is a method for producing an inductor including the steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, and connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral.
摘要翻译：本发明涉及具有贯通晶片通孔的微加工电感器。在一个实施例中，本发明是包括第一晶片，位于第一晶片内的第一多个金属填充物的电感器，以及将第一多个金属填料连接在一起以形成第一螺旋的第一多个金属导体，其具有第一多个绕组。在另一个实施例中，本发明是一种用于制造电感器的方法，包括以下步骤：在第一衬底中形成第一多个通孔，用第一多个金属填充物填充第一衬底中的第一多个通孔，形成第一多个金属导体和第一多个金属填充物的连接对使用第一多个金属导体形成螺旋。

3. 发明授权

US08826514B2 Microfabricated inductors with through-wafer vias 有权
标题翻译：带晶圆通孔的微型电感器
公开(公告)号：US08826514B2
公开(公告)日：2014-09-09
申请号：US13027150
申请日：2011-02-14
申请人： Alexandros Papavasiliou , Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
发明人： Alexandros Papavasiliou , Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
IPC分类号： H01F41/04 , H01F41/10 , H01F17/00
CPC分类号： H01F17/03 , H01F17/0013 , H01F2017/0086 , Y10T29/4902 , Y10T29/49073 , Y10T29/49165
摘要： Microfabricated inductors with through-wafer vias and including a first wafer and a second wafer, each wafer having a plurality of metal fillings therein, and a plurality of metal conductors connecting the plurality of metal fillings together to form a spiral. A method for producing an inductor including steps of forming a first plurality of vias in a first substrate, filling the first plurality of vias in the first substrate with a first plurality of metal fillings, forming a first plurality of metal conductors, connecting pairs of the first plurality of metal fillings together using the first plurality of metal conductors to form a spiral, performing the foregoing steps similarly on a second substrate formed with a second plurality of vias filled with a second plurality of metal fillings, and bonding the first substrate with the second substrate.
摘要翻译：具有贯通晶片通孔并且包括第一晶片和第二晶片的微型电感器，每个晶片在其中具有多个金属填充物，以及将多个金属填料连接在一起以形成螺旋的多个金属导体。一种用于制造电感器的方法，包括以下步骤：在第一衬底中形成第一多个通孔，用第一多个金属填充物填充第一衬底中的第一多个通孔，形成第一多个金属导体，第一多个金属填充物一起使用第一多个金属导体形成螺旋，类似地在形成有填充有第二多个金属填充物的第二多个通孔的第二基板上执行上述步骤，以及将第一基板与第二基板。

4. 发明授权

US07261430B1 Thermal and intrinsic stress compensated micromirror apparatus and method 有权
标题翻译：热和内应力补偿微镜装置和方法
公开(公告)号：US07261430B1
公开(公告)日：2007-08-28
申请号：US11360165
申请日：2006-02-22
申请人： Jeffrey F. DeNatale , Philip A. Stupar , Chialun Tsai , Robert L. Borwick, III
发明人： Jeffrey F. DeNatale , Philip A. Stupar , Chialun Tsai , Robert L. Borwick, III
IPC分类号： G02B7/182 , G02B5/132 , G02B26/00
CPC分类号： G02B7/181 , G02B26/0841
摘要： A micromirror apparatus includes a device layer having a recess, a multilayer thin-film dielectric reflector coupled to and structurally supported by the device layer on the opposite side of the device layer from said recess, and a stress compensator seated in the recess, with the stress compensator operable to resist device layer bending moments resulting from intrinsic and thermal mismatch stresses between the multilayer thin-film dielectric reflector and the device layer.
摘要翻译：微镜装置包括具有凹部的器件层，耦合到器件层并在结构上由器件层与所述凹部相反的结构上支撑的多层薄膜电介质反射器和位于凹部中的应力补偿器，应力补偿器可操作以抵抗由多层薄膜电介质反射器和器件层之间的固有和热失配应力引起的器件层弯曲力矩。

5. 发明授权

US06771081B2 Liquid-medium immersed MEMs devices 有权
公开(公告)号：US06771081B2
公开(公告)日：2004-08-03
申请号：US10227141
申请日：2002-08-22
申请人： Robert L. Borwick, III , Philip A. Stupar , Jeffrey F. DeNatale
发明人： Robert L. Borwick, III , Philip A. Stupar , Jeffrey F. DeNatale
IPC分类号： G01R2726
CPC分类号： H01G5/0132
摘要： Micro-electromechanical (MEM) devices having their fixed and movable members immersed in a liquid medium. Movement is effected by applying a stimulus which creates a force that causes the movable member to move with respect to the fixed member. The movable and fixed members are immersed in a liquid medium having desired characteristics. The liquid is preferably selected to have a viscosity which critically damps the motion of the movable member. The liquid may also be chosen to provide a dielectric constant greater than one, which, where applicable, increases the electrostatic force created for a given drive voltage, and the device's capacitance sensing range, over what they would be in air. The liquid medium might also be used to improve the device's thermal dissipation characteristics, or to provide improved isolation between structures.

6. 发明申请

US20100207229A1 NON-PLANAR MICROCIRCUIT STRUCTURE AND METHOD OF FABRICATING SAME 有权
标题翻译：非平面微型结构及其制造方法
公开(公告)号：US20100207229A1
公开(公告)日：2010-08-19
申请号：US12372982
申请日：2009-02-18
申请人： Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
发明人： Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
IPC分类号： H01L29/00 , H05K1/03 , H01L21/00 , H01L21/4763
CPC分类号： H01L23/13 , H01L21/768 , H01L23/5387 , H01L24/63 , H01L27/14601 , H01L27/14625 , H01L27/14643 , H01L27/14683 , H01L27/14685 , H01L29/0657 , H01L2924/14
摘要： A foldable microcircuit is initially a planar semiconductor wafer on which circuitry has been formed. The wafer is segmented into a plurality of tiles, and a plurality of hinge mechanisms are coupled between adjacent pairs of tiles such that the segmented wafer can be folded into a desired non-planar configuration having a high fill-factor and small gaps between tiles. The hinge mechanisms can comprise an organic material deposited on the wafer such that it provides mechanical coupling between adjacent tiles, with metal interconnections between tiles formed directly over the organic hinges, or routed between adjacent tiles via compliant bridges. Alternatively, the interconnection traces between tiles can serve as part or all of a hinge mechanism. The foldable microcircuit can be, for example, a CMOS circuit, with the segmented tiles folded to form, for example, a semi-spherical structure arranged to provide a wide FOV photodetector array.
摘要翻译：可折叠微电路最初是其上形成有电路的平面半导体晶片。晶片被分割成多个瓦片，并且多个铰链机构联接在相邻的瓦片对之间，使得分割的晶片可以折叠成具有高填充因子和瓦片之间的小间隙的期望的非平面构造。铰链机构可以包括沉积在晶片上的有机材料，使得它提供相邻瓦片之间的机械耦合，并且在有机铰链之间直接形成的瓦片之间的金属互连，或者通过柔性桥接件在相邻瓦片之间布线。或者，瓦片之间的互连迹线可以用作铰链机构的一部分或全部。可折叠微电路可以是例如CMOS电路，其中分段瓦片被折叠以形成例如布置成提供宽FOV光电检测器阵列的半球形结构。

7. 发明授权

US07328604B2 Microelectromechanical (MEM) fluid health sensing device and fabrication method 有权
标题翻译：微机电（MEM）液体健康感测装置及制造方法
公开(公告)号：US07328604B2
公开(公告)日：2008-02-12
申请号：US11234015
申请日：2005-09-22
申请人： Jeffrey F. DeNatale , Robert L. Borwick, III , Philip A. Stupar , Martin W. Kendig
发明人： Jeffrey F. DeNatale , Robert L. Borwick, III , Philip A. Stupar , Martin W. Kendig
IPC分类号： G01N11/00
CPC分类号： G01N33/2888 , G01N11/16
摘要： A microelectromechanical (MEM) fluid health sensing device comprises a viscosity sensor which provides an output that varies with the viscosity of a fluid in which it is immersed, and at least one other sensor which provides an output that varies with another predetermined parameter of the fluid. The viscosity sensor is preferably a MEM device fabricated by means of a “deep etch” process. The sensors are preferably integrated together on a common substrate, though they might also be fabricated separately and packaged together to form a hybrid device. A data processing means may be included which receives the sensor outputs and provides one or more outputs indicative of the health of the fluid. Sensor types which may be part of the present device include, for example, a temperature sensor, a MEM electrochemical sensor, a MEM accelerometer, a MEM contact switch lubricity sensor, and/or an inductive metallic wear sensor.
摘要翻译：微机电（MEM）流体健康感测装置包括粘度传感器，该粘度传感器提供随着浸入其中的流体的粘度而变化的输出，以及提供随流体的另一预定参数而变化的输出的至少一个其它传感器。粘度传感器优选是通过“深蚀刻”工艺制造的MEM器件。传感器优选地集成在公共基板上，尽管它们也可以单独制造并且封装在一起以形成混合装置。可以包括接收传感器输出并提供指示流体健康的一个或多个输出的数据处理装置。可以是本装置的一部分的传感器类型包括例如温度传感器，MEM电化学传感器，MEM加速度计，MEM接触开关润滑性传感器和/或感应金属磨损传感器。

8. 发明授权

US08080736B2 Non-planar microcircuit structure and method of fabricating same 有权
标题翻译：非平面微电路结构及其制造方法
公开(公告)号：US08080736B2
公开(公告)日：2011-12-20
申请号：US12372982
申请日：2009-02-18
申请人： Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
发明人： Jeffrey F. DeNatale , Philip A. Stupar , Robert L. Borwick, III
IPC分类号： H05K1/00
CPC分类号： H01L23/13 , H01L21/768 , H01L23/5387 , H01L24/63 , H01L27/14601 , H01L27/14625 , H01L27/14643 , H01L27/14683 , H01L27/14685 , H01L29/0657 , H01L2924/14
摘要： A foldable microcircuit is initially a planar semiconductor wafer on which circuitry has been formed. The wafer is segmented into a plurality of tiles, and a plurality of hinge mechanisms are coupled between adjacent pairs of tiles such that the segmented wafer can be folded into a desired non-planar configuration having a high fill-factor and small gaps between tiles. The hinge mechanisms can comprise an organic material deposited on the wafer such that it provides mechanical coupling between adjacent tiles, with metal interconnections between tiles formed directly over the organic hinges, or routed between adjacent tiles via compliant bridges. Alternatively, the interconnection traces between tiles can serve as part or all of a hinge mechanism. The foldable microcircuit can be, for example, a CMOS circuit, with the segmented tiles folded to form, for example, a semi-spherical structure arranged to provide a wide FOV photodetector array.
摘要翻译：可折叠微电路最初是其上形成有电路的平面半导体晶片。晶片被分割成多个瓦片，并且多个铰链机构联接在相邻的瓦片对之间，使得分割的晶片可以折叠成具有高填充因子和瓦片之间的小间隙的期望的非平面构造。铰链机构可以包括沉积在晶片上的有机材料，使得它提供相邻瓦片之间的机械耦合，并且在有机铰链之间直接形成的瓦片之间的金属互连，或者通过柔性桥接件在相邻瓦片之间布线。或者，瓦片之间的互连迹线可以用作铰链机构的一部分或全部。可折叠微电路可以是例如CMOS电路，其中分段瓦片被折叠以形成例如布置成提供宽FOV光电检测器阵列的半球形结构。

9. 发明授权

US07287415B2 Microelectromechanical system (MEMS) viscosity sensor for fluid health monitoring 有权
标题翻译：用于流体健康监测的微机电系统（MEMS）粘度传感器
公开(公告)号：US07287415B2
公开(公告)日：2007-10-30
申请号：US10956229
申请日：2004-09-30
申请人： Robert L. Borwick, III , Philip A. Stupar , Jeffrey F. DeNatale
发明人： Robert L. Borwick, III , Philip A. Stupar , Jeffrey F. DeNatale
IPC分类号： G01N11/00
CPC分类号： G01N33/30 , G01N11/16
摘要： Embodiments of the present invention are directed to a MEM viscosity sensor that is configured to be operated submerged in a liquid. The MEMS viscosity sensor comprises a MEMS variable capacitor comprising a plurality of capacitor plates capable of being submerged in a liquid. An actuator places a driving force on the variable capacitor which causes relative movement between the plates, where the movement creates a shear force between each moving plate and the liquid, which damps the movement of the plate and increases the capacitor's response time to the applied force in accordance with the liquid's viscosity. To determine the actual viscosity of the liquid, a sensor is coupled to the variable capacitor for sensing the response time of the plates as an indicator of the liquid's viscosity.
摘要翻译：本发明的实施例涉及一种MEM粘度传感器，其被配置为操作浸没在液体中。 MEMS粘度传感器包括MEMS可变电容器，其包括能够浸没在液体中的多个电容器板。致动器在可变电容器上施加驱动力，其引起板之间的相对运动，其中运动在每个移动板和液体之间产生剪切力，其阻止板的移动并增加电容器对所施加的力的响应时间根据液体的粘度。为了确定液体的实际粘度，传感器耦合到可变电容器，用于感测板的响应时间作为液体粘度的指示。

10. 发明授权

US08319156B2 System for heating a vapor cell 有权
标题翻译：用于加热蒸汽池的系统
公开(公告)号：US08319156B2
公开(公告)日：2012-11-27
申请号：US12645427
申请日：2009-12-22
申请人： Robert L. Borwick, III , Jeffrey F. DeNatale , Chialun Tsai , Philip A. Stupar , Ya-Chi Chen
发明人： Robert L. Borwick, III , Jeffrey F. DeNatale , Chialun Tsai , Philip A. Stupar , Ya-Chi Chen
IPC分类号： H05B3/02
CPC分类号： H05B3/00 , G04F5/14 , H05B2214/04
摘要： A vapor cell includes an interrogation cell in a substrate, the interrogation cell having an entrance window and an exit window, and a first transparent thin-film heater in thermal communication with the entrance window. The transparent thin-film heater has a first layer in communication with a first pole contact at a proximal end of the heater and a layer coupler contact at a distal end, a second layer in communication with a second pole contact at the proximal end, and the second layer electrically coupled to the layer coupler contact at the distal end. An insulating layer is sandwiched between the first and second layers. The insulating layer has an opening at the distal end to admit the layer coupler contact and to insulate the remainder of the second layer from the first layer. The first and second pole contacts are available to complete an electric circuit at the proximal end, with magnetic fields for each of the first and second layers oriented in opposing directions when a current is applied through the circuit.
摘要翻译：蒸汽池包括在基板中的询问单元，询问单元具有入口窗口和出口窗口，以及与入口窗口热连通的第一透明薄膜加热器。透明薄膜加热器具有与加热器的近端处的第一极触点连通的第一层和在远端处的层耦合器触点，在近端与第二极触点连通的第二层，以及第二层在远端电耦合到层耦合器接触。绝缘层夹在第一层和第二层之间。绝缘层在远端具有开口，以允许层耦合器接触并使第二层的其余部分与第一层绝缘。第一和第二极触点可用于在近端完成电路，当通过电路施加电流时，磁场中的第一和第二层中的每一个以相反的方向取向。

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