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1. 发明授权

US07674394B2 Plasma process for inductively coupling power through a gas distribution plate while adjusting plasma distribution 有权
标题翻译：等离子体处理，用于通过气体分布板电感耦合电力，同时调节等离子体分布
公开(公告)号：US07674394B2
公开(公告)日：2010-03-09
申请号：US11679122
申请日：2007-02-26
申请人： Alexander Paterson , Valentin N. Todorov , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland
发明人： Alexander Paterson , Valentin N. Todorov , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland
IPC分类号： G01L21/30 , H01L21/00 , C23F1/00
CPC分类号： H01J37/32082 , C23C16/505 , H01J37/32091 , H01J37/321 , H01J37/3244
摘要： A method of processing a workpiece in the chamber of a plasma reactor includes capacitively coupling plasma source power using a ceiling gas distribution plate as the electrode while inductively coupling plasma source power through the ceiling gas distribution plate, and flowing process gas through the gas distribution plate from a gas input to plural gas injection orifices, distributing the gas flow within the gas distribution plate through a succession of arcuate paths joined at respective junctions, dividing gas flow at each junction from a first respective one of said gas flow paths into a respective pair of said gas flow paths in opposite gas flow directions, and restricting the arcuate length of each of the arcuate paths to less than half-circles.
摘要翻译：在等离子体反应器的室中处理工件的方法包括使用天花板气体分配板作为电极电容耦合等离子体源功率，同时通过天花板气体分配板感应耦合等离子体源功率，并且使处理气体通过气体分配板从气体输入到多个气体注入孔，通过在各个接合处连接的一系列弧形路径将气流分布在气体分布板内，将每个连接处的气流从第一相应的一个气流通道分成相应的对的所述气体流动路径在相反的气体流动方向上，并且将每个弧形路径的弓形长度限制为小于半圈。

2. 发明申请

US20080230008A1 PLASMA SPECIES AND UNIFORMITY CONTROL THROUGH PULSED VHF OPERATION 审中-公开
标题翻译：等离子体物种和通过脉冲甚高频操作的均匀控制
公开(公告)号：US20080230008A1
公开(公告)日：2008-09-25
申请号：US11689405
申请日：2007-03-21
申请人： Alexander Paterson , Theodoros Panagopoulos , Valentin N. Todorov , Brian K. Hatcher , Dan Katz , Edward P. Hammond , John P. Holland
发明人： Alexander Paterson , Theodoros Panagopoulos , Valentin N. Todorov , Brian K. Hatcher , Dan Katz , Edward P. Hammond , John P. Holland
IPC分类号： C23C16/513 , H05H1/24
CPC分类号： H01J37/32146 , H01J37/32091 , H01J37/32165
摘要： An apparatus for processing a substrate has a chamber, a high frequency power source, and a low frequency power source. The chamber has a first and second electrode disposed therein. The high frequency power source is electrically coupled to either the first or second electrode to supply a first RF signal. The low frequency power source electrically coupled to either the first or second electrode to supply a second RF signal. The first RF signal is pulsed on and off so as to enhance electron loss in the chamber.
摘要翻译：用于处理衬底的设备具有腔室，高频电源和低频电源。该室具有设置在其中的第一和第二电极。高频电源电耦合到第一或第二电极以提供第一RF信号。所述低频电源电耦合到所述第一或第二电极以提供第二RF信号。第一RF信号被脉冲打开和关闭，以增强腔室中的电子损失。

3. 发明授权

US07727413B2 Dual plasma source process using a variable frequency capacitively coupled source to control plasma ion density 有权
标题翻译：使用可变频电容耦合源的双等离子体源处理来控制等离子体离子密度
公开(公告)号：US07727413B2
公开(公告)日：2010-06-01
申请号：US11410717
申请日：2006-04-24
申请人： Alexander Paterson , Valentin N. Todorow , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland , Alexander Matyushkin
发明人： Alexander Paterson , Valentin N. Todorow , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland , Alexander Matyushkin
IPC分类号： G01L21/30
CPC分类号： H01J37/321 , H01J37/32091 , H01J37/32165
摘要： A method of processing a workpiece in the chamber of a plasma reactor includes introducing a process gas into the chamber, simultaneously (a) capacitively coupling VHF plasma source power into a process region of the chamber that overlies the wafer, and (b) inductively coupling RF plasma source power into the process region, and controlling plasma ion density by controlling the effective frequency of the VHF source power. In a preferred embodiment, the step of coupling VHF source power is performed by coupling VHF source power from different generators having different VHF frequencies, and the step of controlling the effective frequency is performed by controlling the ratio of power coupled by the different generators.
摘要翻译：在等离子体反应器的腔室中处理工件的方法包括将工艺气体引入到腔室中，同时（a）将VHF等离子体源功率电容耦合到覆盖在晶片上的腔室的工艺区域中，以及（b）电感耦合 RF等离子体源功率进入工艺区域，并通过控制VHF源功率的有效频率来控制等离子体离子密度。在优选实施例中，通过耦合具有不同VHF频率的不同发生器的VHF源功率来执行耦合VHF源功率的步骤，并且通过控制由不同发生器耦合的功率比来执行控制有效频率的步骤。

4. 发明授权

US07264688B1 Plasma reactor apparatus with independent capacitive and toroidal plasma sources 失效
标题翻译：具有独立电容和环形等离子体源的等离子体反应器装置
公开(公告)号：US07264688B1
公开(公告)日：2007-09-04
申请号：US11411163
申请日：2006-04-24
申请人： Alexander Paterson , Valentin N. Todorow , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland , Alexander Matyushkin
发明人： Alexander Paterson , Valentin N. Todorow , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland , Alexander Matyushkin
IPC分类号： C23F1/00 , C23C16/00
CPC分类号： H01J37/32935 , H01J37/321
摘要： A plasma reactor includes a toroidal plasma source having an RF power applicator, and RF generator being coupled to the RF power applicator. The reactor further includes a capacitively coupled plasma source power applicator or electrode at the ceiling or the workpiece support, a VHF power generator being coupled to the capacitively coupled source power applicator, a plasma bias power applicator or electrode in the workpiece support and an RF bias power generator coupled to the plasma bias power applicator. A controller adjusts the relative amounts of power simultaneously coupled to plasma in the chamber and conduit by the toroidal plasma source and by the capacitively coupled plasma source power applicator.
摘要翻译：等离子体反应器包括具有RF功率施加器的环形等离子体源，RF发生器耦合到RF功率施加器。反应器还包括在天花板或工件支撑件处的电容耦合的等离子体源功率施加器或电极，耦合到电容耦合的源功率施加器的VHF发电机，工件支架中的等离子体偏置功率施加器或电极，以及RF偏置发电机耦合到等离子体偏置功率施加器。控制器调节通过环形等离子体源和电容耦合的等离子体源功率施加器同时耦合到腔室和管道中的等离子体的功率的相对量。

5. 发明授权

US07645357B2 Plasma reactor apparatus with a VHF capacitively coupled plasma source of variable frequency 有权
标题翻译：具有可变频率的VHF电容耦合等离子体源的等离子体反应器装置
公开(公告)号：US07645357B2
公开(公告)日：2010-01-12
申请号：US11410697
申请日：2006-04-24
申请人： Alexander Paterson , Valentin N. Todorow , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland , Alexander Matyushkin
发明人： Alexander Paterson , Valentin N. Todorow , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland , Alexander Matyushkin
IPC分类号： C23F1/00 , H01L19/00 , H05B31/26
CPC分类号： H01J37/32165 , H01J37/32091 , H01J37/321 , H01J37/32174
摘要： A plasma reactor for processing a workpiece includes a reactor chamber and a workpiece support within the chamber, the chamber having a ceiling facing the workpiece support, a capacitively coupled plasma source power applicator comprising a source power electrode at one of: (a) the ceiling (b) the workpiece support, and plural VHF power generators of different fixed frequencies coupled to the capacitively coupled source power applicator, and a controller for independently controlling the power output levels of the plural VHF generators so as to control an effective VHF frequency applied to the source power electrode. In a preferred embodiment, the reactor further includes a plasma bias power applicator that includes a bias power electrode in the workpiece support and one or more RF bias power generators of different frequencies coupled to the plasma bias power applicator.
摘要翻译：一种用于处理工件的等离子体反应器包括反应室和腔室内的工件支撑件，腔室具有面向工件支撑件的天花板，电容耦合的等离子体源功率施加器，其包括源功率电极，其特征在于：（a）天花板（b）工件支撑件，以及耦合到电容耦合的源功率施加器的不同固定频率的多个甚高频发电机，以及用于独立地控制多个VHF发生器的功率输出电平的控制器，以便控制施加到源极电极。在优选实施例中，反应器还包括等离子体偏置功率施加器，其包括工件支撑件中的偏置功率电极和耦合到等离子体偏置功率施加器的不同频率的一个或多个RF偏置功率发生器。

6. 发明授权

US07780864B2 Process using combined capacitively and inductively coupled plasma sources for controlling plasma ion radial distribution 失效
标题翻译：使用组合电容和电感耦合等离子体源来控制等离子体离子径向分布的过程
公开(公告)号：US07780864B2
公开(公告)日：2010-08-24
申请号：US11410780
申请日：2006-04-24
申请人： Alexander Paterson , Valentin N. Todorow , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland , Alexander Matyushkin
发明人： Alexander Paterson , Valentin N. Todorow , Theodoros Panagopoulos , Brian K. Hatcher , Dan Katz , Edward P. Hammond, IV , John P. Holland , Alexander Matyushkin
IPC分类号： G01L21/30 , C23F1/00
CPC分类号： H01J37/32165 , H01J37/32091 , H01J37/321 , H01J37/32174
摘要： A method of processing a workpiece in the chamber of a plasma reactor in which the plasma ion density radial distribution in the process region is controlled by adjusting the ratio between the amounts of the (VHF) capacitively coupled power and the inductively coupled power while continuing to maintain the level of total plasma source power. The method can also include applying independently adjustable LF bias power and HF bias power to the workpiece and adjusting the average value and population distribution of ion energy at the surface of the workpiece by adjusting the proportion between the LF and HF bias powers.
摘要翻译：一种在等离子体反应器的室中处理工件的方法，其中通过调节（VHF）电容耦合功率和电感耦合功率之间的比例来控制处理区域中的等离子体离子密度径向分布，同时继续保持总等离子体源功率的水平。该方法还可以包括对工件应用独立可调的LF偏置功率和HF偏置功率，并通过调整LF和HF偏置功率之间的比例来调节工件表面处离子能量的平均值和总体分布。

7. 发明申请

US20070284344A1 HIGH AC CURRENT HIGH RF POWER AC-RF DECOUPLING FILTER FOR PLASMA REACTOR HEATED ELECTROSTATIC CHUCK 有权
标题翻译：用于等离子体反应器加热静电切割机的高交流电流高频功率AC-RF解码滤波器
公开(公告)号：US20070284344A1
公开(公告)日：2007-12-13
申请号：US11671927
申请日：2007-02-06
申请人： Valentin N. Todorov , Michael D. Willwerth , Alexander Paterson , Brian K. Hatcher , James E. Sammons , John P. Holland
发明人： Valentin N. Todorov , Michael D. Willwerth , Alexander Paterson , Brian K. Hatcher , James E. Sammons , John P. Holland
IPC分类号： B23K9/00
CPC分类号： H05H1/46 , H01J37/32706 , H03H1/0007
摘要： An RF blocking filter isolates a two-phase AC power supply from at least 2 kV p-p of power of an HF frequency that is reactively coupled to a resistive heating element, while conducting several kW of 60 Hz AC power from the two-phase AC power supply to the resistive heating element without overheating, the two-phase AC power supply having a pair of terminals and the resistive heating element having a pair of terminals. The filter includes a pair of cylindrical non-conductive envelopes each having an interior diameter between about one and two inches and respective pluralities of fused iron powder toroids of magnetic permeability on the order of about 10 stacked coaxially within respective ones of the pair of cylindrical envelopes, the exterior diameter of the toroids being about the same as the interior diameter of each of the envelopes. A pair of wire conductors of diameter between 3 mm and 3.5 mm are helically wound around corresponding ones of the pair of envelopes to form respective inductor windings in the range of about 16 to 24 turns for each the envelope, each of the conductors having an input end and an output end. The input end of each one of the conductors is coupled to a corresponding one of the pair of terminals of the two-phase AC power supply, and the output end of each one of the conductors is coupled to a corresponding one of the pair of terminals of the resistive heating element.
摘要翻译： RF阻断滤波器将两相交流电源从反应耦合到电阻加热元件的HF频率的至少2kV pp的功率隔离，同时从两相交流电源进行几kW的60Hz AC电力供给电阻加热元件而不会过热，两相交流电源具有一对端子和电阻加热元件具有一对端子。该过滤器包括一对圆柱形非导电封套，每一个内径均在约一英寸至两英寸之间，并且相应的多个约10层的磁导率的熔融铁粉末环形环共轴同心地位于一对圆柱形封套中环形线圈的外径与每个信封的内径大致相同。直径在3毫米与3.5毫米之间的一对电线导体螺旋缠绕在一对信封的相应的一对信封上，以形成每个封套约16至24匝范围内的相应的电感绕组，每个导体具有一个输入结束和输出结束。每个导体的输入端耦合到两相交流电源的一对端子中的对应的一个，并且每一个导体的输出端耦合到该对端子中相应的一个端子的电阻加热元件。

8. 发明授权

US07777152B2 High AC current high RF power AC-RF decoupling filter for plasma reactor heated electrostatic chuck 有权
标题翻译：高AC电流高RF功率AC-RF去耦滤波器用于等离子体反应器加热静电卡盘
公开(公告)号：US07777152B2
公开(公告)日：2010-08-17
申请号：US11671927
申请日：2007-02-06
申请人： Valentin N. Todorov , Michael D. Willwerth , Alexander Paterson , Brian K. Hatcher , James E. Sammons, III , John P. Holland
发明人： Valentin N. Todorov , Michael D. Willwerth , Alexander Paterson , Brian K. Hatcher , James E. Sammons, III , John P. Holland
IPC分类号： B23K9/02 , H01P5/08 , C23C16/00
CPC分类号： H05H1/46 , H01J37/32706 , H03H1/0007
摘要： An RF blocking filter isolates a two-phase AC power supply from at least 2 kV p-p of power of an HF frequency that is reactively coupled to a resistive heating element, while conducting several kW of 60 Hz AC power from the two-phase AC power supply to the resistive heating element without overheating, the two-phase AC power supply having a pair of terminals and the resistive heating element having a pair of terminals. The filter includes a pair of cylindrical non-conductive envelopes each having an interior diameter between about one and two inches and respective pluralities of fused iron powder toroids of magnetic permeability on the order of about 10 stacked coaxially within respective ones of the pair of cylindrical envelopes, the exterior diameter of the toroids being about the same as the interior diameter of each of the envelopes. A pair of wire conductors of diameter between 3 mm and 3.5 mm are helically wound around corresponding ones of the pair of envelopes to form respective inductor windings in the range of about 16 to 24 turns for each the envelope, each of the conductors having an input end and an output end. The input end of each one of the conductors is coupled to a corresponding one of the pair of terminals of the two-phase AC power supply, and the output end of each one of the conductors is coupled to a corresponding one of the pair of terminals of the resistive heating element.
摘要翻译： RF阻断滤波器将两相交流电源从反应耦合到电阻加热元件的HF频率的至少2kV pp的功率隔离，同时从两相交流电源进行几kW的60Hz AC电力供给电阻加热元件而不会过热，两相交流电源具有一对端子和电阻加热元件具有一对端子。该过滤器包括一对圆柱形非导电封套，每一个内径均在约一英寸至两英寸之间，并且相应的多个约10层的磁导率的熔融铁粉末环形环共轴同心地位于一对圆柱形封套中环形线圈的外径与每个信封的内径大致相同。直径在3毫米与3.5毫米之间的一对电线导体螺旋缠绕在一对信封的相应的一对信封上，以形成每个封套约16至24匝范围的相应的电感绕组，每个导体具有一个输入结束和输出结束。每个导体的输入端耦合到两相交流电源的一对端子中的对应的一个，并且每一个导体的输出端耦合到该对端子中相应的一个端子的电阻加热元件。

9. 发明授权

US06962644B2 Tandem etch chamber plasma processing system 有权
标题翻译：串联腐蚀室等离子体处理系统
公开(公告)号：US06962644B2
公开(公告)日：2005-11-08
申请号：US10241653
申请日：2002-09-10
申请人： Alexander Paterson , Valentin N. Todorov , Jon McChesney , Gerhard M. Schneider , David Palagashvili , John P. Holland , Michael S. Barnes
发明人： Alexander Paterson , Valentin N. Todorov , Jon McChesney , Gerhard M. Schneider , David Palagashvili , John P. Holland , Michael S. Barnes
IPC分类号： H01L21/00 , C23F1/00 , C23C16/00 , H01L21/306
CPC分类号： H01L21/67069 , H01J37/32082 , H01J37/32458
摘要： A method and apparatus for processing wafers including a chamber defining a plurality of isolated processing regions. The isolated processing regions have an upper end and a lower end. The chamber further includes a plurality of plasma generation devices each disposed adjacent the upper end of each isolated processing region, and one of a plurality of power supplies connected to each plasma generation device. The output frequency of the plurality of power supplies are phase and/or frequency locked together. Additionally, the chamber includes a plurality of gas distribution assemblies. Each gas distribution assembly is disposed within each isolated processing region. A movable wafer support is disposed within each isolated processing region to support a wafer for plasma processing thereon. The movable wafer support includes a bias electrode coupled to a bias power supply configured to control the bombardment of plasma ions toward the movable wafer support.
摘要翻译：一种用于处理晶片的方法和装置，包括限定多个隔离处理区域的腔室。隔离处理区域具有上端和下端。所述室还包括多个等离子体产生装置，每个等离子体产生装置邻近每个隔离处理区域的上端设置，并且连接到每个等离子体产生装置的多个电源中的一个。多个电源的输出频率是相位和/或频率锁定在一起的。另外，腔室包括多个气体分配组件。每个气体分配组件设置在每个隔离的处理区域内。可移动的晶片支撑件设置在每个隔离的处理区域内以支撑用于等离子体处理的晶片。可移动晶片支撑件包括耦合到偏置电源的偏置电极，偏置电源被配置为控制等离子体离子朝向可移动晶片支撑件的轰击。

10. 发明申请

US20070247074A1 Process using combined capacitively and inductively coupled plasma sources for controlling plasma ion radial distribution 失效
标题翻译：使用组合电容和电感耦合等离子体源来控制等离子体离子径向分布的过程
公开(公告)号：US20070247074A1
公开(公告)日：2007-10-25
申请号：US11410780
申请日：2006-04-24
申请人： Alexander Paterson , Valentin Todorow , Theodoros Panagopoulos , Brian Hatcher , Dan Katz , Edward Hammond , John Holland , Alexander Matyushkin
发明人： Alexander Paterson , Valentin Todorow , Theodoros Panagopoulos , Brian Hatcher , Dan Katz , Edward Hammond , John Holland , Alexander Matyushkin
IPC分类号： H01J7/24
CPC分类号： H01J37/32165 , H01J37/32091 , H01J37/321 , H01J37/32174
摘要： A method of processing a workpiece in the chamber of a plasma reactor includes introducing a process gas into the chamber, capacitively coupling VHF plasma source power into a process region of the chamber that overlies the wafer while inductively coupling RF plasma source power into the process region. A particular plasma ion density level is established by maintaining the total amount of plasma source power inductively and capacitively coupled into the process region at a level that provides the desired plasma ion density. The plasma ion density radial distribution in the process region is controlled by adjusting the ratio between the amounts of the (VHF) capacitively coupled power and the inductively coupled power while continuing to maintain the level of total plasma source power. The method can also include applying independently adjustable LF bias power and HF bias power to the workpiece and adjusting the average value and population distribution of ion energy at the surface of the workpiece by adjusting the proportion between the LF and HF bias powers. The VHF capacitively coupled power may be applied from the ceiling or from the wafer support.
摘要翻译：在等离子体反应器的腔室中处理工件的方法包括将工艺气体引入室中，将VHF等离子体源功率电容耦合到层叠在晶片上的室的处理区域，同时将RF等离子体源功率感应耦合到工艺区域。通过将等离子体源功率的总量以感应和电容耦合到处理区域中的水平提供期望的等离子体离子密度来建立特定的等离子体离子密度水平。通过调节（VHF）电容耦合功率和电感耦合功率之间的比例来控制处理区域中的等离子体离子密度径向分布，同时继续保持总等离子体源功率的水平。该方法还可以包括对工件应用独立可调的LF偏置功率和HF偏置功率，并通过调整LF和HF偏置功率之间的比例来调节工件表面处离子能量的平均值和总体分布。 VHF电容耦合功率可以从天花板或从晶片支架施加。

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