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    • 5. 发明授权
    • Method of fabricating a semiconductor device using quantum dots or wires
    • 使用量子点或导线制造半导体器件的方法
    • US5532184A
    • 1996-07-02
    • US523829
    • 1995-09-06
    • Yoshimine Kato
    • Yoshimine Kato
    • H01L21/265H01L21/335H01L29/06H01L29/775H01L29/80H01L21/20
    • B82Y10/00H01L29/66469H01L29/775Y10S438/962
    • An undoped GaAs layer is epitaxially grown on a substrate in a crystal growth device. An undoped Al.sub.x Ga.sub.1-x As layer is then epitaxially grown to form an undoped hetero-junction structure. After this, a sample is transferred to a focused ion beam (FIB) apparatus. A dopant ion beam is focused and implanted into the Al.sub.x Ga.sub.1-x As layer in a dot-like or wire-like pattern so that it does not extend to the undoped GaAs layer or channel layer, and a zero- or one-dimensional carrier gas 8 is generated in the channel layer. The invention allows maskless ion implantation, and makes the fabrication process much easier because quantum wires and dots are drawn, patterned or formed directly by ion implantation. In addition, no etching process is required, so quantum wires and quantum dots can be fabricated precisely. Furthermore, since there is no influence of the impurity scattering and damage by ion implantation in the channel where electrons and holes are transported, high mobility is obtained and a high-speed device can be fabricated. The invention overcomes the problem of crystal damage in prior processes that required chemical etching and ion implantation.
    • 在晶体生长装置中的衬底上外延生长未掺杂的GaAs层。 然后外延生长未掺杂的Al x Ga 1-x As层以形成未掺杂的异质结结构。 之后,将样品转移到聚焦离子束(FIB)装置。 掺杂剂离子束以点状或线状图案被聚焦并注入到Al x Ga 1-x As层中,使得它不延伸到未掺杂的GaAs层或沟道层,并且零或一维载气8 在通道层中产生。 本发明允许无掩模离子注入,并且使得制造过程更容易,因为量子线和点被直接通过离子注入来绘制,图案化或形成。 此外,不需要蚀刻工艺,因此可以精确地制造量子线和量子点。 此外,由于在输送电子和空穴的通道中不存在杂质散射和离子注入损伤的影响,因此可以获得高迁移率,并且可以制造高速器件。 本发明克服了以前需要化学蚀刻和离子注入的工艺中晶体损伤的问题。
    • 6. 发明授权
    • Semiconductor device having a channel for a zero-or one-dimensional
carrier gas
    • 具有用于零或一维载气的通道的半导体器件
    • US5479027A
    • 1995-12-26
    • US172446
    • 1993-12-22
    • Yoshimine Kato
    • Yoshimine Kato
    • H01L21/265H01L21/335H01L29/06H01L29/775H01L29/80H01L27/12
    • B82Y10/00H01L29/66469H01L29/775Y10S438/962
    • An undoped GaAs layer is epitaxially grown on a substrate in a crystal growth device. An undoped Al.sub.x Ga.sub.1-x As layer is then epitaxially grown to form an undoped hetero-junction structure. After this, a sample is transferred to a focused ion beam (FIB) apparatus. A dopant ion beam is focused and implanted into the Al.sub.x Ga .sub.1-x As layer in a dot-like or wire-like pattern so that it does not extend to the undoped GaAs layer or channel layer, and a zero- or one-dimensional carrier gas 8 is generated in the channel layer. The invention allows maskless ion implantation, and makes the fabrication process much easier because quantum wires and dots are drawn, patterned or formed directly by ion implantation. In addition, no etching process is required, so quantum wires and quantum dots can be fabricated precisely. Furthermore, since there is no influence of the impurity scattering and damage by ion implantation in the channel where electrons and holes are transported, high mobility is obtained and a high-speed device can be fabricated. The invention overcomes the problem of crystal damage in prior processes that required chemical etching and ion implantation.
    • 在晶体生长装置中的衬底上外延生长未掺杂的GaAs层。 然后外延生长未掺杂的Al x Ga 1-x As层以形成未掺杂的异质结结构。 之后,将样品转移到聚焦离子束(FIB)装置。 掺杂剂离子束以点状或线状图案聚焦并注入到Al x Ga 1-x As层中,使得其不延伸到未掺杂的GaAs层或沟道层,并且零或一维载气 8在通道层中产生。 本发明允许无掩模离子注入,并且使得制造过程更容易,因为量子线和点被直接通过离子注入来绘制,图案化或形成。 此外,不需要蚀刻工艺,因此可以精确地制造量子线和量子点。 此外,由于在输送电子和空穴的通道中不存在杂质散射和离子注入损伤的影响,因此可以获得高迁移率,并且可以制造高速器件。 本发明克服了以前需要化学蚀刻和离子注入的工艺中晶体损伤的问题。