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    • 7. 发明授权
    • Method and apparatus for determining photomask alignment
    • 用于确定光掩模对准的方法和装置
    • US4399205A
    • 1983-08-16
    • US325942
    • 1981-11-30
    • Albert S. Bergendahl
    • Albert S. Bergendahl
    • H01L21/68G03F7/20H01L21/027H01L21/66H01L23/544G03C5/06
    • H01L22/34G03F7/70633H01L22/12
    • This describes a method for electrically evaluating the overlay error of a photolithographic tool. In this process a reusable substrate bearing a fixed reference mark has a photolithographic tool defined metal liftoff pattern formed thereon to provide a pair of conductive lines by measuring the relative resistance of the lines with respect to one another the alignment of the tool defined pattern with regard to the reference mark may be determined and thus the overlay error of the tool established.The reference mask is formed of an L-shaped recess in a substrate so that when a metal structure is deposited on the surface of the substrate across the mask it will be made discontinuous by the mark. To form the metal structure photoresist is applied to the substrate and is exposed and developed in a L-shaped liftoff mask pattern larger than the reference mark and arranged on both sides of the mask so that when a conductive layer is deposited over the exposed and developed photoresist the remaining photoresist and overlying conductor subsequently removed, there will remain on the substrate surface a pair of conductive lines. One reference edge of this conductive line is defined by the recess forming the reference mask and the second edge is defined by the lifting off of the developed photoresist created by the photo tool defined liftoff pattern. By measuring the resistance of predetermined segments of the deposited metal remaining on the substrate the difference in line width caused by misalignment of the photo tool with respect to the reference mask can be determined. Any such difference in linewidth represents the overlay mismatch caused by the tool. After measurements are completed the conductive lines can be stripped from the substrate and the substrate reused.
    • 这描述了一种用于电学评估光刻工具的覆盖误差的方法。 在该过程中,具有固定参考标记的可重复使用的基板具有形成在其上的光刻工具限定的金属剥离图案,以通过相对于彼此测量相对于工具限定图案的对准来提供一对导电线 可以确定参考标记,从而建立工具的重叠错误。 参考掩模由衬底中的L形凹部形成,使得当金属结构沉积在衬底的表面上并穿过掩模时,其将被标记不连续。 为了形成金属结构,将光致抗蚀剂施加到基板上,并以大于参考标记的L形剥离掩模图案曝光和显影,并且布置在掩模的两侧,使得当导电层沉积在暴露和显影 光致抗蚀剂剩余的光致抗蚀剂和上覆导体随后被去除,在衬底表面上将保留一对导电线。 该导电线的一个参考边缘由形成参考掩模的凹槽限定,并且第二边缘由通过照相工具限定的剥离图案产生的显影光致抗蚀剂的剥离来限定。 通过测量残留在基板上的沉积金属的预定段的电阻,可以确定由于照相工具相对于参考掩模的未对准而导致的线宽的差异。 线宽中的任何这种差异表示由工具引起的重叠不匹配。 测量完成后,导电线可以从衬底剥离,衬底重新使用。
    • 8. 发明授权
    • Process for increasing resolution of photolithographic images
    • 提高光刻图像分辨率的方法
    • US4394437A
    • 1983-07-19
    • US305056
    • 1981-09-24
    • Albert S. BergendahlMark C. HakeyJohn P. Wilson
    • Albert S. BergendahlMark C. HakeyJohn P. Wilson
    • G03F7/26G03F7/095G03F7/20H01L21/027G03C5/00
    • G03F7/095
    • The present invention describes conformable masking techniques which can be successfully made and used in a practical manufacturing environment while providing increased resolution of photolithographic images while eliminating all manner of defects that might presently be encountered in the masks currently used in the semiconductor industry.In the present invention a body is first coated with a positive photoresist overcoated with a conformable mask which is exposed through a fixed mask and developed to define a replica of the fixed mask, together with all its defects. The underlying photoresist is then exposed to light through developed openings in the conformable mask. The conformable mask is then stripped and a new conformable mask laid down. This new conformable mask is now exposed through a second fixed mask having the same image as the first fixed mask, but presumably with different defects and developed to define a replica of the second mask. The underlying photoresist is again exposed through the second conformable mask and developed. As a result of using two independently defined conformable masks clear image defects in the fixed masks are prevented from being reproduced in the underlying photoresist and are not doubly exposed. Only desired regions in the underlying photoresist are doubly exposed.
    • 本发明描述了可以在实际制造环境中成功制造和使用的适形掩蔽技术,同时提供增加的光刻图像分辨率,同时消除目前在半导体工业中使用的掩模中目前可能遇到的各种缺陷。 在本发明中,首先用正光致抗蚀剂涂覆正型光致抗蚀剂,其中涂覆有适形掩模,其通过固定掩模曝光并显影以限定固定掩模的复制品及其所有缺陷。 然后将底层光致抗蚀剂通过适形掩模中的显影开口曝光。 然后将适形的面膜剥离,并铺设新的合适的面膜。 这种新的适形掩模现在通过具有与第一固定掩模相同的图像的第二固定掩模曝光,但是可能具有不同的缺陷并且显影以限定第二掩模的复制品。 底层光致抗蚀剂再次通过第二适形掩模曝光并显影。 作为使用两个独立定义的适形掩模的结果,防止固定掩模中的清晰图像缺陷在下面的光致抗蚀剂中再现,并且不会被双重曝光。 只有底层光致抗蚀剂中的所需区域被双重曝光。