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1. 发明申请

US20060027479A1 Optical or electronic module and method for its production 审中-公开
标题翻译：光学或电子模块及其生产方法
公开(公告)号：US20060027479A1
公开(公告)日：2006-02-09
申请号：US11191308
申请日：2005-07-28
申请人： Albert Auburger , Hans Hurt , Thomas Lichtenegger , Stefan Paulus , Nikolaus Schunk , Frank Weberpals , Josef Wittl
发明人： Albert Auburger , Hans Hurt , Thomas Lichtenegger , Stefan Paulus , Nikolaus Schunk , Frank Weberpals , Josef Wittl
IPC分类号： B65D65/00
CPC分类号： H01L25/167 , G02B6/4201 , G02B6/4204 , G02B6/4245 , G02B6/4253 , G02B6/4257 , G02B6/426 , G02B6/4274 , H01L23/3135 , H01L23/49575 , H01L24/48 , H01L24/49 , H01L33/54 , H01L2224/48091 , H01L2224/48137 , H01L2224/48235 , H01L2224/48247 , H01L2224/48257 , H01L2224/48472 , H01L2224/49109 , H01L2224/8592 , H01L2924/00014 , H01L2924/01068 , H01L2924/12041 , H01L2924/12043 , H01L2924/14 , H01L2924/181 , H01L2924/1815 , H01L2924/19041 , H01S5/02216 , H01S5/02244 , H01L2924/00 , H01L2924/00012 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： One or more aspects of the invention relate to an optical or electronic module with at least one optical or electronic component and a plastic package within which the component is embedded. The component has an operative region that facilitates operative connection with surroundings. The plastic package has a first region, which comprises a transparent polymer compound, and a second region, which comprises a non-transparent polymer compound. The first region extends such that it borders the operative region of the component.
摘要翻译：本发明的一个或多个方面涉及具有至少一个光学或电子部件的光学或电子模块以及嵌入该部件的塑料封装。该组件具有便于与周围环境的操作连接的操作区域。塑料包装具有包含透明高分子化合物的第一区域和包含不透明聚合物化合物的第二区域。第一区域延伸成使得其与部件的操作区域相邻。

2. 发明申请

US20060049548A1 Method for producing an optical or electronic module provided with a plastic package and an optical or electronic module 审中-公开
标题翻译：具有塑料封装和光学或电子模块的光学或电子模块的制造方法
公开(公告)号：US20060049548A1
公开(公告)日：2006-03-09
申请号：US11216565
申请日：2005-08-31
申请人： Albert Auburger , Hans Hurt , Stefan Paulus , Nikolaus Schunk , Frank Weberpals , Josef Wittl
发明人： Albert Auburger , Hans Hurt , Stefan Paulus , Nikolaus Schunk , Frank Weberpals , Josef Wittl
IPC分类号： B29D11/00 , B29C45/14
CPC分类号： B29C70/72 , B23K26/009 , B23K2101/40 , B23K2103/42 , B23K2103/50 , B29C45/0055 , B29C45/14655 , B29C45/14836 , H01L33/52 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1815 , H01S5/0078 , H01S5/02216 , H01S5/02228 , H01S5/02244 , H01S5/02296 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a method for producing an optical or electronic module provided with a plastic package. The method includes provision of at least one optical or electronic component, the component having an operative region via which it is in operative connection with the surroundings in the finished module, and application to the component of a protective layer which covers at least the operative region of the component. The method further includes encapsulation of the at least one component with at least one polymer compound to form the package, and partial removal of the polymer compound from the outside by a laser ablation device such that the polymer compound between the protective layer of the component and the outer side of the plastic package is removed. The protective layer is, in this case, not transparent with respect to the radiation emitted by the laser ablation device. The invention relates furthermore to an optical or electronic module with at least one optical or electronic component, to which a protective layer is applied.
摘要翻译：本发明涉及一种用于制造具有塑料封装的光学或电子模块的方法。该方法包括提供至少一个光学或电子部件，所述部件具有操作区域，通过该工作区域，其与完成的模块中的周围环境可操作地连接，以及应用于至少覆盖操作区域的保护层的部件的组件。该方法还包括用至少一种聚合物化合物包封至少一种组分以形成包装，以及通过激光烧蚀装置从外部部分去除高分子化合物，使得组分的保护层和去除塑料包装的外侧。在这种情况下，保护层相对于由激光烧蚀装置发射的辐射不透明。本发明还涉及具有至少一个光学或电子部件的光学或电子模块，其上施加有保护层。

3. 发明申请

US20060024851A1 Method for producing an optical or electronic module provided with a plastic package 有权
标题翻译：制造具有塑料封装的光学或电子模块的方法
公开(公告)号：US20060024851A1
公开(公告)日：2006-02-02
申请号：US11192444
申请日：2005-07-27
申请人： Albert Auburger , Hans Hurt , Stefan Paulus , Nikolaus Schunk , Frank Weberpals , Josef Wittl
发明人： Albert Auburger , Hans Hurt , Stefan Paulus , Nikolaus Schunk , Frank Weberpals , Josef Wittl
IPC分类号： H01L21/66 , H01L21/50
CPC分类号： H01L31/0203 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.
摘要翻译：一种用于制造具有塑料封装的光学或电子模块的方法，包括：提供至少一个光学或电子部件，所述部件具有操作区域，通过所述操作区域与所述完成模块中的周围环境可操作地连接，封装所述部件与至少一种聚合物化合物形成塑料包装，在封装之前或之后，通过直接测量组分的位置来确定组分的位置，使组分相对于用于部分去除高分子化合物或对准的装置的这种装置相对于部件的位置，允许组件的确定位置允许的对准，并且从外部部分去除聚合物化合物，使得在塑料的操作区域和外侧之间的高分子化合物包装至少部分被去除。

4. 发明授权

US07442559B2 Method for producing an optical or electronic module provided with a plastic package 有权
标题翻译：制造具有塑料封装的光学或电子模块的方法
公开(公告)号：US07442559B2
公开(公告)日：2008-10-28
申请号：US11192444
申请日：2005-07-27
申请人： Albert Auburger , Hans Hurt , Stefan Paulus , Nikolaus Schunk , Frank Weberpals , Josef Wittl
发明人： Albert Auburger , Hans Hurt , Stefan Paulus , Nikolaus Schunk , Frank Weberpals , Josef Wittl
IPC分类号： G01R31/26 , H01L21/66
CPC分类号： H01L31/0203 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2924/1815 , H01L2224/48091 , H01L2924/00014 , H01L2924/00
摘要： A method for producing an optical or electronic module provided with a plastic package including: providing at least one optical or electronic component, the component having an operative region, via which it is in operative connection with the surroundings in the finished module, encapsulating the component with at least one polymer compound to form the plastic package, before or after the encapsulation, ascertaining the position of the component by direct measurement of the position of the component, aligning the component with respect to a device for partially removing the polymer compound or alignment of such a device with respect to the component, the alignment taking place with allowance for the ascertained position of the component, and partial removal of the polymer compound from the outside such that the polymer compound between the operative region and the outer side of the plastic package is at least partially removed.
摘要翻译：一种用于制造具有塑料封装的光学或电子模块的方法，包括：提供至少一个光学或电子部件，所述部件具有操作区域，通过所述操作区域与所述完成模块中的周围环境可操作地连接，封装所述部件与至少一种聚合物化合物形成塑料包装，在封装之前或之后，通过直接测量组分的位置来确定组分的位置，使组分相对于用于部分去除高分子化合物或对准的装置的这种装置相对于部件的位置，允许组件的确定位置允许的对准，并且从外部部分去除聚合物化合物，使得在塑料的操作区域和外侧之间的高分子化合物包装至少部分被去除。

5. 发明授权

US07073957B2 Optoelectronic transmitting and/or receiving module, circuit carrier, module housing, and optical plug 失效
标题翻译：光电发射和/或接收模块，电路载体，模块外壳和光学插头
公开(公告)号：US07073957B2
公开(公告)日：2006-07-11
申请号：US10639397
申请日：2003-08-12
申请人： Nikolaus Schunk , Gottfried Beer , Josef Wittl
发明人： Nikolaus Schunk , Gottfried Beer , Josef Wittl
IPC分类号： G02B6/42 , H04B10/02
CPC分类号： H04B10/801 , G02B6/3893 , G02B6/4204 , G02B6/4246 , H01L31/12 , H01L33/486 , H01L33/54 , H01L33/62 , H01L2224/48091 , H01L2224/48247 , H01L2924/1815 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： An optoelectronic transmitting and/or receiving module and an optical plug include a circuit carrier disposed at least partially in an alignment parallel to the optical axis of the module in a module housing. The circuit carrier forms a tongue-shaped region that protrudes into the continuation. A transmitting device and/or a receiving device is disposed in the continuation, where they are connected to the circuit carrier. The associated axial offsetting of the transmitting device and/or receiving device in the direction of an optical plug to be coupled on permits the provision of plug-in connections with improved protection of the devices and the fiber ends.
摘要翻译：光电发射和/或接收模块和光学插头包括在模块外壳中至少部分地布置为平行于模块的光轴的对准的电路载体。电路载体形成突出到延续部分的舌状区域。发射装置和/或接收装置设置在继续中，在那里连接到电路载体。发射装置和/或接收装置在要耦合的光学插头的方向上相关联的轴向偏移允许提供具有改进的装置和光纤端部保护的插入式连接。

6. 发明授权

US06869232B2 Receiving and coupling part for opto-electronic transmission and/or reception element 有权
标题翻译：用于光电传输和/或接收元件的接收和耦合部分
公开(公告)号：US06869232B2
公开(公告)日：2005-03-22
申请号：US10667260
申请日：2003-09-19
申请人： Nikolaus Schunk , Josef Wittl
发明人： Nikolaus Schunk , Josef Wittl
IPC分类号： G02B6/42
CPC分类号： G02B6/4277 , G02B6/4201 , G02B6/4204 , G02B6/4292 , H01L2224/48091 , H01L2224/48247 , H01L2924/3025 , H01L2924/00014 , H01L2924/00
摘要： The invention relates to a receiving and coupling part for an optoelectronic transmission and/or reception element having an opening for inserting a carrier on which the transmission and/or reception element is disposed, having a casting material that surrounds the transmission and/or reception element, and having a coupling region for the coupling of an optical fiber. The receiving and coupling part includes a cylindrical recess, one end of which contains the transmission and/or reception element, and the other end of which serves for the receiving and coupling of an optical fiber. The receiving and coupling part makes possible the arranging of the transmission and/or reception element in a transparent casting compound and the coupling of an optical fiber in a simple manner and exhibits a high degree of stability with respect to temperature fluctuations.
摘要翻译：本发明涉及一种用于光电传输和/或接收元件的接收和耦合部件，其具有用于插入其上布置有传输和/或接收元件的载体的开口，具有包围传输和/或接收元件的铸造材料并且具有用于耦合光纤的耦合区域。接收和耦合部分包括一个圆柱形凹槽，其一端包含传输和/或接收元件，另一端用于光纤的接收和耦合。接收和耦合部分使传输和/或接收元件在透明铸塑料中的布置成为可能，并且以简单的方式耦合光纤并且相对于温度波动表现出高度的稳定性。

7. 发明申请

US20060072881A1 Optoelectronic transceiver 有权
标题翻译：光电收发器
公开(公告)号：US20060072881A1
公开(公告)日：2006-04-06
申请号：US11133782
申请日：2005-05-20
申请人： Nikolaus Schunk
发明人： Nikolaus Schunk
IPC分类号： G02B6/36
CPC分类号： G02B6/305 , G02B6/02033 , G02B6/3885 , G02B6/421 , G02B6/4246 , H05K1/0203 , H05K1/147 , H05K2201/10045 , H05K2201/10121 , H05K2201/1056
摘要： An opto-electronic transceiver having: a transmitting component for converting electrical signals into optical signals; a first circuitry module for the transmitting component; a receiving component for converting optical signals into electrical signals; a second circuitry module for the receiving component; a printed circuitboard with conductor tracks, on which the transmitting component, the receiving component, the first circuitry module and the second circuitry module are arranged; and a transceiver housing including a nonconductive material and has a connector receptacle for receiving and coupling an optical connector. The transmitting component, the first circuitry module, the receiving component and the second circuitry module form at least one subassembly, the subassembly having: an encapsulation composition, in which the components of the subassembly are embedded, and a wiring layer embodied using thin-film technology, the wiring layer providing an electrical contact connection between the subassembly components and to associated contacts of the printed circuit board.
摘要翻译：一种光电收发器，具有：用于将电信号转换为光信号的发送部件; 用于所述发射部件的第一电路模块; 用于将光信号转换成电信号的接收部件; 用于所述接收部件的第二电路模块; 具有导体轨迹的印刷电路板，其上布置有发射部件，接收部件，第一电路模块和第二电路模块; 以及收发器壳体，其包括非导电材料并且具有用于接收和耦合光学连接器的连接器插座。发射部件，第一电路模块，接收部件和第二电路模块形成至少一个子组件，该子组件具有：嵌入组件的部件的封装组合物，以及使用薄膜实现的布线层技术，布线层提供子组件部件之间的电接触连接和印刷电路板的相关联的接触。

8. 发明授权

US07217043B2 Optoelectronic transceiver 有权
标题翻译：光电收发器
公开(公告)号：US07217043B2
公开(公告)日：2007-05-15
申请号：US11133782
申请日：2005-05-20
申请人： Nikolaus Schunk
发明人： Nikolaus Schunk
IPC分类号： G02B6/43 , H04B10/00
CPC分类号： G02B6/305 , G02B6/02033 , G02B6/3885 , G02B6/421 , G02B6/4246 , H05K1/0203 , H05K1/147 , H05K2201/10045 , H05K2201/10121 , H05K2201/1056
摘要： An opto-electronic transceiver having: a transmitting component for converting electrical signals into optical signals; a first circuitry module for the transmitting component; a receiving component for converting optical signals into electrical signals; a second circuitry module for the receiving component; a printed circuitboard with conductor tracks, on which the transmitting component, the receiving component, the first circuitry module and the second circuitry module are arranged; and a transceiver housing including a nonconductive material and has a connector receptacle for receiving and coupling an optical connector. The transmitting component, the first circuitry module, the receiving component and the second circuitry module form at least one subassembly, the subassembly having: an encapsulation composition, in which the components of the subassembly are embedded, and a wiring layer embodied using thin-film technology, the wiring layer providing an electrical contact connection between the subassembly components and to associated contacts of the printed circuit board.
摘要翻译：一种光电收发器，具有：用于将电信号转换为光信号的发送部件; 用于所述发射部件的第一电路模块; 用于将光信号转换成电信号的接收部件; 用于所述接收部件的第二电路模块; 具有导体轨迹的印刷电路板，其上布置有发射部件，接收部件，第一电路模块和第二电路模块; 以及收发器壳体，其包括非导电材料并且具有用于接收和耦合光学连接器的连接器插座。发射部件，第一电路模块，接收部件和第二电路模块形成至少一个子组件，该子组件具有：嵌入组件的部件的封装组合物，以及使用薄膜实现的布线层技术，布线层提供子组件部件之间的电接触连接和印刷电路板的相关联的接触。

9. 发明申请

US20050018977A1 Optoelectronic module with transmitter chip and connecting piece for the module with respect to an optical fiber and with respect to a circuit board, and methods for producing the same 有权
标题翻译：具有变送器芯片的光电模块和相对于光纤相对于电路板的模块的连接件及其制造方法
公开(公告)号：US20050018977A1
公开(公告)日：2005-01-27
申请号：US10890258
申请日：2004-07-14
申请人： Gottfried Beer , Nikolaus Schunk
发明人： Gottfried Beer , Nikolaus Schunk
IPC分类号： G02B6/42 , G02B6/36
CPC分类号： G02B6/4292 , G02B6/4246 , H01L21/568 , H01L24/19 , H01L24/96 , H01L2224/05001 , H01L2224/05008 , H01L2224/05024 , H01L2224/05026 , H01L2224/05548 , H01L2224/05569 , H01L2224/12105 , H01L2224/24137 , H01L2224/24195 , H01L2924/00014 , H01L2924/12042 , H01L2924/12043 , H01L2924/181 , H01L2924/00 , H01L2224/05599 , H01L2224/05099
摘要： An optoelectronic module and a connecting piece for the module with respect to an optical fiber and with respect to a circuit board can have a semiconductor chip in the form of an optical transmitter chip, which has a light-wave-emitting top side and has a rear side contact as a cathode on its rear side. Further semiconductor chips are embedded in a plastics composition with the optical transmitter chip in such a way that a coplanar overall top side is formed from the plastics composition and the active top side.
摘要翻译：相对于光纤并相对于电路板的光电模块和用于模块的连接件可以具有光发射器芯片形式的半导体芯片，该发射器芯片具有发光的顶侧，并且具有后侧接触件作为其后侧的阴极。另外的半导体芯片以这样的方式嵌入到具有光发射机芯片的塑料组合物中，使得由塑料组合物和有源顶侧形成共面整体顶侧。

10. 发明授权

US06735023B2 Optoelectronic module and method for its production 有权
标题翻译：光电模块及其生产方法
公开(公告)号：US06735023B2
公开(公告)日：2004-05-11
申请号：US10271264
申请日：2002-10-15
申请人： Nikolaus Schunk
发明人： Nikolaus Schunk
IPC分类号： G02B702
CPC分类号： G02B6/4251 , G02B6/4204 , G02B6/424 , G02B6/4244 , G02B6/4255 , H01L31/0203 , H01L31/02325 , H01L33/483 , H01L33/58
摘要： An optoelectronic module includes a transmitting and/or receiving element, a support on which the transmitting and/or receiving element is disposed, and a module housing having an opening for introducing the support and a coupling region for the coupling attachment of a component to be coupled on. The module housing is filled with a molding of a translucent, moldable material. A separate coupling lens for coupling light between the transmitting and/or receiving element and the component to be coupled on is provided, which lens is disposed adjacent to the molding in or just before the coupling region in the module housing. The invention also relates to several methods for producing such a module.
摘要翻译：光电子模块包括发射和/或接收元件，其上设置有发射和/或接收元件的支撑件和具有用于引入支撑件的开口的模块壳体和用于将元件的耦合附接的耦合区域再加上模块壳体填充有半透明的可模制材料的模制件。提供了用于在发射和/或接收元件和待耦合的元件之间耦合光的单独的耦合透镜，该透镜在模块壳体中的耦合区域内或紧邻模块壳体内的耦合区域附近设置。本发明还涉及用于生产这种模块的几种方法。

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