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1. 发明申请

US20060014326A1 Method for fabricating a semiconductor component with contacts situated at the underside 审中-公开
标题翻译：用于制造具有位于下侧的触点的半导体部件的方法
公开(公告)号：US20060014326A1
公开(公告)日：2006-01-19
申请号：US11220341
申请日：2005-09-06
申请人： Albert Auburger , Hainz Oswald , Helga Hainz , Dietmar Lang , Rudolf Lehner , Stefan Paulus , Martin Petz , Michael Weber
发明人： Albert Auburger , Hainz Oswald , Helga Hainz , Dietmar Lang , Rudolf Lehner , Stefan Paulus , Martin Petz , Michael Weber
IPC分类号： H01L21/44
CPC分类号： H01L21/568 , H01L23/3107 , H01L23/482 , H01L24/48 , H01L24/49 , H01L25/0655 , H01L25/50 , H01L2224/05599 , H01L2224/48091 , H01L2224/48137 , H01L2224/48247 , H01L2224/48464 , H01L2224/48465 , H01L2224/48475 , H01L2224/4848 , H01L2224/49171 , H01L2224/73265 , H01L2224/85001 , H01L2224/85051 , H01L2224/854 , H01L2924/00014 , H01L2924/01029 , H01L2924/01046 , H01L2924/01057 , H01L2924/01068 , H01L2924/01078 , H01L2924/01079 , H01L2924/12042 , H01L2924/181 , H01L2924/00 , H01L2224/45015 , H01L2924/207 , H01L2224/45099
摘要： A semiconductor component has a housing with a first main area and a second main area opposite to the first main area, which surrounds at least one semiconductor chip. The semiconductor chip has a first metallization layer on a first main side. A second main side of the semiconductor chip borders the second main area of the semiconductor component. The first metallization layer of the semiconductor chip is connected via electrical conductors to contacts that are likewise surrounded by the housing and border the second main area. The semiconductor chip furthermore has, on the second main side, a second metallization layer for carrying signals.
摘要翻译：半导体部件具有壳体，其具有第一主区域和与第一主区域相对的第二主区域，该第一主区域围绕至少一个半导体芯片。半导体芯片在第一主侧具有第一金属化层。半导体芯片的第二主面与半导体部件的第二主要区域相接。半导体芯片的第一金属化层通过电导体连接到同样被壳体包围并与第二主区域相接触的触点。半导体芯片在第二主侧还具有用于承载信号的第二金属化层。

2. 发明授权

US07268436B2 Electronic device with cavity and a method for producing the same 失效
标题翻译：具有腔体的电子器件及其制造方法
公开(公告)号：US07268436B2
公开(公告)日：2007-09-11
申请号：US10795344
申请日：2004-03-09
申请人： Robert Aigner , Albert Auburger , Frank Daeche , Guenter Ehrler , Andreas Meckes , Horst Theuss , Michael Weber
发明人： Robert Aigner , Albert Auburger , Frank Daeche , Guenter Ehrler , Andreas Meckes , Horst Theuss , Michael Weber
IPC分类号： H01L23/12 , H01L23/48 , H01L23/52 , H01L29/40
CPC分类号： H03H9/1085 , H01L23/3107 , H01L23/4951 , H01L2224/32145 , H01L2224/48091 , H01L2224/48465 , H01L2224/73265 , H03H9/0547 , H03H9/105 , H01L2924/00014 , H01L2924/00
摘要： An electronic device can include a top side with circuit structures. The circuit structures form the bottom region of a cavity. Each cavity can be surrounded by a cavity frame made of plastic and can have a cavity cover made of semiconductor material.
摘要翻译：电子设备可以包括具有电路结构的顶侧。电路结构形成空腔的底部区域。每个空腔可以由塑料制成的空腔框架包围，并且可以具有由半导体材料制成的空腔盖。

3. 发明授权

US07221048B2 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier 有权
标题翻译：多层电路载体，面板，电子器件，以及多层电路载体的制造方法
公开(公告)号：US07221048B2
公开(公告)日：2007-05-22
申请号：US11046892
申请日：2005-02-01
申请人： Frank Daeche , Jochen Dangelmaier , Stefan Paulus , Bernd Stadler , Horst Theuss , Michael Weber
发明人： Frank Daeche , Jochen Dangelmaier , Stefan Paulus , Bernd Stadler , Horst Theuss , Michael Weber
IPC分类号： H01L23/12 , H01L23/48
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/055 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49861 , H01L23/5389 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L31/0203 , H01L2224/05599 , H01L2224/16225 , H01L2224/32013 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01068 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15313 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K1/113 , H05K3/205 , H05K3/4647 , H05K3/4682 , H05K2201/2072 , H05K2203/0733 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.
摘要翻译：多层电路载体，电子器件和面板以及制造多层电路载体的方法包括至少一个半导体芯片，至少一个具有重新布线结构的重新布线层以及具有通道结构的至少一个绝缘层。

4. 发明申请

US20050151246A1 Multilayer circuit carrier, panel, electronic device, and method for producing a multilayer circuit carrier 有权
标题翻译：多层电路载体，面板，电子器件，以及多层电路载体的制造方法
公开(公告)号：US20050151246A1
公开(公告)日：2005-07-14
申请号：US11046892
申请日：2005-02-01
申请人： Frank Daeche , Jochen Dangelmaier , Stefan Paulus , Bernd Stadler , Horst Theuss , Michael Weber
发明人： Frank Daeche , Jochen Dangelmaier , Stefan Paulus , Bernd Stadler , Horst Theuss , Michael Weber
IPC分类号： H01L21/48 , H01L23/055 , H01L23/31 , H01L23/498 , H01L23/538 , H01L27/146 , H01L31/0203 , H05K1/11 , H05K3/20 , H05K3/46 , H01L21/44 , H01L21/50 , H01L23/34
CPC分类号： H01L21/4857 , H01L21/486 , H01L23/055 , H01L23/3121 , H01L23/49805 , H01L23/49811 , H01L23/49822 , H01L23/49827 , H01L23/49833 , H01L23/49861 , H01L23/5389 , H01L24/48 , H01L24/73 , H01L27/14618 , H01L31/0203 , H01L2224/05599 , H01L2224/16225 , H01L2224/32013 , H01L2224/32225 , H01L2224/45099 , H01L2224/48091 , H01L2224/48227 , H01L2224/48465 , H01L2224/73204 , H01L2224/73265 , H01L2224/85399 , H01L2924/00014 , H01L2924/01004 , H01L2924/01013 , H01L2924/01029 , H01L2924/01068 , H01L2924/01077 , H01L2924/01079 , H01L2924/01322 , H01L2924/12041 , H01L2924/14 , H01L2924/15174 , H01L2924/15184 , H01L2924/15311 , H01L2924/15313 , H01L2924/16152 , H01L2924/16195 , H01L2924/181 , H01L2924/30107 , H01L2924/3025 , H05K1/113 , H05K3/205 , H05K3/4647 , H05K3/4682 , H05K2201/2072 , H05K2203/0733 , H01L2924/00 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要： A multilayer circuit carrier, electronic devices and panel, and a method for producing a multilayer circuit carrier include at least one semiconductor chip, at least one rewiring layer with a rewiring structure, and at least one insulation layer, which has passage structures.
摘要翻译：多层电路载体，电子器件和面板以及制造多层电路载体的方法包括至少一个半导体芯片，至少一个具有重新布线结构的重新布线层以及具有通道结构的至少一个绝缘层。

5. 发明申请

US20140292406A1 Signal Predistortion for Non-Linear Amplifier 有权
标题翻译：非线性放大器的信号预失真
公开(公告)号：US20140292406A1
公开(公告)日：2014-10-02
申请号：US14232071
申请日：2011-07-13
申请人： Frank Dechen , Bjoern Jelonnek , Michael Weber
发明人： Frank Dechen , Bjoern Jelonnek , Michael Weber
IPC分类号： H03F1/32
CPC分类号： H03F1/3247 , H03F1/30 , H03F1/3241 , H03F1/3258 , H03F1/3282 , H03F3/195 , H03F3/24 , H03F2200/336 , H03F2200/447 , H03F2200/451 , H03F2201/3209 , H03F2201/3212 , H03F2201/3224 , H03F2201/3227 , H03F2201/3233 , H04L27/368
摘要： A method, apparatus, and computer program for modeling mathematically an effect of a plurality of factors on signal distortion caused by a non-linear amplifier are provided. First, there is computed a global model which incorporates a combined effect of the plurality of factors on signal distortion caused by the non-linear amplifier. Before applying the pre-distorted transmission signal to the non-linear amplifier, a transmission signal is pre-distorted with coefficients derived from the global model thus compensating for the signal distortion caused by the non-linear amplifier.
摘要翻译：提供了一种用于在数学上建模多个因素对由非线性放大器引起的信号失真的影响的方法，装置和计算机程序。首先，计算出一个全局模型，其中包含多个因素对由非线性放大器引起的信号失真的组合影响。在将预失真的发送信号应用于非线性放大器之前，利用从全局模型导出的系数对发送信号进行预失真，从而补偿由非线性放大器引起的信号失真。

6. 发明授权

US08443912B2 Hand-held power tool 有权
标题翻译：手持电动工具
公开(公告)号：US08443912B2
公开(公告)日：2013-05-21
申请号：US12069951
申请日：2008-02-13
申请人： Axel Fischer , Roland Meuer , Michael Weber
发明人： Axel Fischer , Roland Meuer , Michael Weber
IPC分类号： B25D17/04
CPC分类号： B25F5/006 , B25D17/24 , B25D2250/121
摘要： A hand-held power tool (2) has a base housing (4) in which there is provided an operational unit (12) movable in a reciprocating manner along a operational axis (A) defining a first spatial axis (z) and spaced from a center of gravity (SP) of the hand-held power tool (2) in direction of a second spatial axis (y) which is perpendicular to the first spatial axis, (z), and further has a cover housing (18) which is held on the base housing (4) by decoupling elements and is fixedly connected to a main handle (24) and to side-handle connection element (28), with the decoupling elements having, in a projection perpendicular to a plane (Eyz) defined by the first spatial axis (z) and the second spatial axis (y), a first support device (19) which is located adjacent to the center of gravity and which holds the cover housing (18) on the base housing (4) so as to be displaceable along and pivotal in direction of the first spatial axis (z).
摘要翻译：手持式电动工具（2）具有基座壳体（4），其中设置有操作单元（12），该操作单元可沿着限定第一空间轴线（z）的操作轴线（A）以往复方式移动，并与所述手持式电动工具（2）的重心（SP）在垂直于所述第一空间轴线（z）的第二空间轴线（y）的方向上，并且还具有盖壳体（18），所述盖壳体通过去耦元件被保持在基座壳体（4）上，并且固定地连接到主手柄（24）和侧手柄连接元件（28），其中去耦元件在垂直于平面（Eyz）的突起中具有，由所述第一空间轴线（z）和所述第二空间轴线（y）限定，第一支撑装置（19），其位于所述重心附近并且将所述盖壳体（18）保持在所述基座壳体（4）上，以便沿着第一空间轴线（z）的方向可移动并在其方向上枢转。

7. 发明申请

US20120308618A1 IC31 NANOPARTICLES 失效
标题翻译： IC31纳米粒子
公开(公告)号：US20120308618A1
公开(公告)日：2012-12-06
申请号：US13578686
申请日：2011-02-21
申请人： Benjamin Wizel , Karin Riedl , Karen Lingnau , Ursula Schlosser , Jürgen Wruss , Robert Schlegl , Michael Weber , Christoph Reinisch , Ljubomir Paucz , Christoph Klade , Jee Loon Look , Christian Ruiz , Robert Seid
发明人： Benjamin Wizel , Karin Riedl , Karen Lingnau , Ursula Schlosser , Jürgen Wruss , Robert Schlegl , Michael Weber , Christoph Reinisch , Ljubomir Paucz , Christoph Klade , Jee Loon Look , Christian Ruiz , Robert Seid
IPC分类号： A61K39/39 , A61P31/14 , A61P31/18 , A61P31/20 , A61P35/00 , A61P33/00 , A61P33/02 , A61P31/04 , A61P31/10 , A61K9/14 , A61P31/22
CPC分类号： A61K39/39 , A61K9/0019 , A61K9/08 , A61K9/10 , A61K9/14 , A61K9/51 , A61K38/00 , A61K39/00 , A61K39/0011 , A61K39/092 , A61K39/118 , A61K39/12 , A61K39/145 , A61K39/40 , A61K39/42 , A61K48/00 , A61K2039/55516 , A61K2039/55555 , A61K2039/55561 , A61K2039/70 , C12N7/00 , C12N2760/16134 , C12N2760/16171 , C12N2760/16234 , Y02A50/386 , Y02A50/388 , Y02A50/39 , Y02A50/394 , Y02A50/396 , Y02A50/401 , Y02A50/412 , Y02A50/47
摘要： The invention discloses pharmaceutical compositions in liquid form comprising a peptide with the amino acid sequence KLKL5KLK and an oligodeoxynucleotide with the nucleic acid sequence (dIdC)13 and wherein the peptide and the oligodeoxynucleotide are present as sterile-filterable nanoparticles in the composition, thereby forming a suspension, characterized in that the mean particle size of the solid particles is less than 1 μm.
摘要翻译：本发明公开了液体形式的药物组合物，其包含具有氨基酸序列KLKL5KLK的肽和具有核酸序列（dIdC）13的寡脱氧核苷酸的肽，并且其中肽和寡脱氧核苷酸作为无菌可过滤纳米粒子存在于组合物中，由此形成悬浮液，其特征在于固体颗粒的平均粒径小于1μm。

8. 发明授权

US07975345B2 Interdental brush 有权
标题翻译：齿间刷
公开(公告)号：US07975345B2
公开(公告)日：2011-07-12
申请号：US11919052
申请日：2006-04-28
申请人： Michael Weber
发明人： Michael Weber
IPC分类号： A46B9/04
CPC分类号： A46B7/04 , A46B2200/108
摘要： Interdental brush with an elongate brush body (12) which comprises an elastically compressible coupling member (19) for snapping-in in a receiving opening (18) of a brush handle (13); wherein the coupling member (19) comprises at least two expanding arms (27, 28) which are elastically movable towards each other; the coupling member (19), on its outer side, comprises a snap-in depression (26) in the region of the expanding arms (27, 28) for a positive-locking fit in the receiving opening (18) of the brush handle (13), the depression being delimited by shoulders (29) extending at right angles to the longitudinal axis of the brush body.
摘要翻译：齿间刷具有细长的刷体（12），其包括用于卡入到刷柄（13）的接收开口（18）中的可弹性压缩的联接构件（19）。其中所述联接构件（19）包括能够彼此弹性移动的至少两个扩展臂（27,28）; 联接构件（19）在其外侧上包括在扩展臂（27,28）的区域中的卡扣式凹陷（26），用于在刷柄的接收开口（18）中正向锁定配合（13），所述凹陷由与所述刷体的纵向轴线成直角延伸的肩部（29）限定。

9. 发明授权

US07772695B2 Semiconductor component of semiconductor chip size with flip-chip-like external contacts 有权
公开(公告)号：US07772695B2
公开(公告)日：2010-08-10
申请号：US11608981
申请日：2006-12-11
申请人： Helmut Kiendl , Horst Theuss , Michael Weber
发明人： Helmut Kiendl , Horst Theuss , Michael Weber
IPC分类号： H01L23/52 , H01L23/48
摘要： A semiconductor component and a method for its production in semiconductor chip size, can have a semiconductor chip, which has external contacts of the semiconductor component that are arranged in the manner of a flip-chip on its active upper side. The semiconductor chip can be encapsulated by a plastic compound at least on its rear side and its side edges. The outer contacts, which can be arranged on external contact connecting areas, can project from the active upper side.

10. 发明申请

US20100192055A1 APPARATUS, METHOD AND ARTICLE TO INTERACT WITH SOURCE FILES IN NETWORKED ENVIRONMENT 审中-公开
标题翻译：与网络环境中的源文件交互的设备，方法和文章
公开(公告)号：US20100192055A1
公开(公告)日：2010-07-29
申请号：US12685940
申请日：2010-01-12
申请人： Motti Shaked , Michael Weber , Michael Benezra , Assaf Koren
发明人： Motti Shaked , Michael Weber , Michael Benezra , Assaf Koren
IPC分类号： G06F15/16 , G06F17/30 , G06F17/00 , G06F3/048
CPC分类号： G06F16/951 , G06F16/313
摘要： A subject of a file's content which is stored on a physical storage medium at a logical address in a networked system may be determined and used to identify the file to facilitate retrieval and/or the provision of information about the file, for example via forums or messages.
摘要翻译：可以确定存储在联网系统中的逻辑地址处的物理存储介质上的文件内容的主题，并且用于识别该文件以便于例如通过论坛或者通过论坛或/ 消息。

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