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    • 1. 发明授权
    • Lithographic template and method of formation and use
    • 光刻模板及其形成和使用方法
    • US07083880B2
    • 2006-08-01
    • US10222734
    • 2002-08-15
    • Albert Alec TalinJeffrey H. BakerWilliam J. DauksherAndy HooperDouglas J. Resnick
    • Albert Alec TalinJeffrey H. BakerWilliam J. DauksherAndy HooperDouglas J. Resnick
    • G03F1/00G03C5/00
    • B82Y10/00B82Y40/00C23C14/086G03F7/0002G03F7/0017G03F7/093
    • This invention relates to semiconductor devices, microelectronic devices, micro electro mechanical devices, microfluidic devices, photonic devices, and more particularly to a lithographic template, a method of forming the lithographic template and a method for forming devices with the lithographic template. The lithographic template (10) is formed having a substrate (12), a transparent conductive layer (16) formed on a surface (14) of the substrate (12) by low pressure sputtering to a thickness that allows for preferably 90% transmission of ultraviolet light therethrough, and a patterning layer (20) formed on a surface (18) of the transparent conductive layer (16). The template (10) is used in the fabrication of a semiconductor device (30) for affecting a pattern in device (30) by positioning the template (10) in close proximity to semiconductor device (30) having a radiation sensitive material formed thereon and applying a pressure to cause the radiation sensitive material to flow into the relief image present on the template. Radiation is then applied through the template so as to cure portions of the radiation sensitive material and define the pattern in the radiation sensitive material. The template (10) is then removed to complete fabrication of semiconductor device (30).
    • 本发明涉及半导体器件,微电子器件,微电子机械器件,微流体器件,光子器件,更具体地涉及光刻模板,形成光刻模板的方法和用光刻模板形成器件的方法。 光刻模板(10)形成为具有基板(12),通过低压溅射形成在基板(12)的表面(14)上的透明导电层(16)至允许优选90%透射率的厚度 紫外光,以及形成在透明导电层(16)的表面(18)上的图形层(20)。 模板(10)用于通过将模板(10)定位成紧邻其上形成有辐射敏感材料的半导体器件(30)而影响器件(30)中的图案的半导体器件(30)的制造,以及 施加压力以使辐射敏感材料流入存在于模板上的浮雕图像。 然后通过模板施加辐射,以便固化辐射敏感材料的部分并限定辐射敏感材料中的图案。 然后移除模板(10)以完成半导体器件(30)的制造。
    • 2. 发明授权
    • Lithographic template and method of formation and use
    • 光刻模板及其形成和使用方法
    • US07432024B2
    • 2008-10-07
    • US11423621
    • 2006-06-12
    • Albert Alec TalinJeffrey H. BakerWilliam J. DauksherAndy HooperDouglas J. Resnick
    • Albert Alec TalinJeffrey H. BakerWilliam J. DauksherAndy HooperDouglas J. Resnick
    • G03F1/00G03C5/00
    • B82Y10/00B82Y40/00C23C14/086G03F7/0002G03F7/0017G03F7/093
    • This invention relates to semiconductor devices, microelectronic devices, micro electro mechanical devices, microfluidic devices, photonic devices, and more particularly to a lithographic template, a method of forming the lithographic template and a method for forming devices with the lithographic template. The lithographic template (10) is formed having a substrate (12), a transparent conductive layer (16) formed on a surface (14) of the substrate (12) by low pressure sputtering to a thickness that allows for preferably 90% transmission of ultraviolet light therethrough, and a patterning layer (20) formed on a surface (18) of the transparent conductive layer (16). The template (10) is used in the fabrication of a semiconductor device (30) for affecting a pattern in device (30) by positioning the template (10) in close proximity to semiconductor device (30) having a radiation sensitive material formed thereon and applying a pressure to cause the radiation sensitive material to flow into the relief image present on the template. Radiation is then applied through the template so as to cure portions of the radiation sensitive material and define the pattern in the radiation sensitive material. The template (10) is then removed to complete fabrication of semiconductor device (30).
    • 本发明涉及半导体器件,微电子器件,微电子机械器件,微流体器件,光子器件,更具体地涉及光刻模板,形成光刻模板的方法和用光刻模板形成器件的方法。 光刻模板(10)形成为具有基板(12),通过低压溅射形成在基板(12)的表面(14)上的透明导电层(16)至允许优选90%透射率的厚度 紫外光,以及形成在透明导电层(16)的表面(18)上的图形层(20)。 模板(10)用于通过将模板(10)定位成紧邻其上形成有辐射敏感材料的半导体器件(30)而影响器件(30)中的图案的半导体器件(30)的制造,以及 施加压力以使辐射敏感材料流入存在于模板上的浮雕图像。 然后通过模板施加辐射,以便固化辐射敏感材料的部分并限定辐射敏感材料中的图案。 然后移除模板(10)以完成半导体器件(30)的制造。
    • 5. 发明授权
    • Field emission device and method for the conditioning thereof
    • 场致发射装置及其调理方法
    • US06573642B1
    • 2003-06-03
    • US09491357
    • 2000-01-26
    • Paul VonAllmenBernard F. CollAlbert Alec Talin
    • Paul VonAllmenBernard F. CollAlbert Alec Talin
    • H01J1304
    • H01J1/3044H01J2201/30426
    • A field emission device (100) includes an electron emitter structure (105) having a deuteride layer (108), which defines a surface (109) of electron emitter structure (105). Deuteride layer (108) is disposed upon an electron emitter (106), which is made from a metal. Deuteride layer (108) is a deuteride of the metal from which electron emitter (106) is made. A method for conditioning field emission device (100) includes the step of providing a contaminated cathode structure (137), which has a contaminated emitter structure (138). The method further includes the step of causing deuterium to react with a metal oxide layer (140) of emitter structure (138), so that the deuterium replaces the oxygen of metal oxide layer (140).
    • 场发射器件(100)包括具有限定电子发射器结构(105)的表面(109)的氘化层(108)的电子发射器结构(105)。 氘化层(108)设置在由金属制成的电子发射器(106)上。 氘化层(108)是制造电子发射体(106)的金属的氘化物。一种用于调节场发射装置(100)的方法包括提供污染的阴极结构(137)的步骤,该污染阴极结构具有污染的发射体结构 (138)。 该方法还包括使氘与发射极结构(138)的金属氧化物层(140)反应的步骤,使得氘代替金属氧化物层(140)的氧。
    • 8. 发明授权
    • Vitreous carbon mask substrate for X-ray lithography
    • 用于X射线光刻的玻璃碳掩模基板
    • US07608367B1
    • 2009-10-27
    • US11192797
    • 2005-07-28
    • Georg AigeldingerDawn M. SkalaStewart K. GriffithsAlbert Alec TalinMatthew W. LoseyChu-Yeu Peter Yang
    • Georg AigeldingerDawn M. SkalaStewart K. GriffithsAlbert Alec TalinMatthew W. LoseyChu-Yeu Peter Yang
    • G03F1/00
    • G03F1/22
    • The present invention is directed to the use of vitreous carbon as a substrate material for providing masks for X-ray lithography. The new substrate also enables a small thickness of the mask absorber used to pattern the resist, and this enables improved mask accuracy. An alternative embodiment comprised the use of vitreous carbon as a LIGA substrate wherein the VC wafer blank is etched in a reactive ion plasma after which an X-ray resist is bonded. This surface treatment provides a surface enabling good adhesion of the X-ray photoresist and subsequent nucleation and adhesion of the electrodeposited metal for LIGA mold-making while the VC substrate practically eliminates secondary radiation effects that lead to delamination of the X-ray resist form the substrate, the loss of isolated resist features, and the formation of a resist layer adjacent to the substrate that is insoluble in the developer.
    • 本发明涉及玻璃碳作为基片材料用于提供用于X射线光刻的掩模的用途。 新的基板还能够使用用于图案化抗蚀剂的掩模吸收体的小的厚度,并且这使得能够改善掩模精度。 一个替代实施例包括使用玻璃碳作为LIGA衬底,其中VC晶片坯料在反应离子等离子体中被蚀刻,之后结合X射线抗蚀剂。 该表面处理提供了表面,使得能够良好地粘附X射线光致抗蚀剂并且随后的成核和用于LIGA模制的电沉积金属的粘附,而VC衬底实际上消除了导致X射线抗蚀剂分层的二次辐射效应 衬底,孤立的抗蚀剂特征的损失以及与基底相邻的抗蚀剂层的形成,其不溶于显影剂。