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1. 发明授权

US5781022A Substrate having self limiting contacts for establishing an electrical connection with a semiconductor die 失效
标题翻译：衬底具有用于与半导体管芯建立电连接的自限制触点
公开(公告)号：US5781022A
公开(公告)日：1998-07-14
申请号：US717846
申请日：1996-09-23
申请人： Alan G. Wood , Trung Tri Doan , Warren M. Farnworth , Tim J. Corbett
发明人： Alan G. Wood , Trung Tri Doan , Warren M. Farnworth , Tim J. Corbett
IPC分类号： G01R1/04 , G01R3/00 , G01R31/28 , H01L21/60 , H01L21/68 , H01L23/13 , H01L23/498 , H01L23/538 , H05K3/00 , H05K3/42
CPC分类号： H01L23/5386 , G01R1/0466 , G01R31/2893 , H01L21/6835 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L24/75 , H01L24/80 , G01R1/0483 , G01R3/00 , G01R31/2863 , H01L2224/16145 , H01L2224/75 , H01L2225/06562 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01082 , H01L2924/01322 , H01L2924/04941 , H01L2924/14 , H01L2924/15151 , H01L2924/15174 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A die contacting substrate for establishing ohmic contact with the die is formed with raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. In the preferred embodiment, the substrate is formed of semiconductor material, with the raised portion being formed by etching. The arrangement may be used for establishing temporary electrical contact and with a burn-in oven and with a discrete die tester. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. A Z-axis anisotropic conductive interconnect material may be interposed between the die attachment surface and the die.
摘要翻译：用于与模具建立欧姆接触的模具接触衬底在接触构件上形成有凸起部分。凸起部分的尺寸被设计成使得对模具施加到衬底上的压缩力导致接触构件有限地渗透到粘合垫中。在优选实施例中，衬底由半导体材料形成，凸起部分通过蚀刻形成。该装置可以用于建立临时电接触以及使用老化烘箱和离散模具测试器。这允许在组装之前对模具进行表征，从而可以以未包装的形式转移模具。 Z轴各向异性导电互连材料可以插入在模具附接表面和模具之间。

2. 发明授权

US07511520B2 Universal wafer carrier for wafer level die burn-in 失效
标题翻译：用于晶圆级模具老化的通用晶圆载体
公开(公告)号：US07511520B2
公开(公告)日：2009-03-31
申请号：US11841566
申请日：2007-08-20
申请人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
发明人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
IPC分类号： G01R31/02 , G01R31/28
CPC分类号： G01R31/2863
摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
摘要翻译：一个可重复使用的老化/测试夹具，用于测试由半个半部组成的半导体晶圆上的无引脚骰子。测试夹具的前半部分是用于接收晶片的晶片腔板，第二半部分在晶片和电气测试设备之间建立电气连通。刚性基板在其上具有与晶片电接触的导体。在老化和电气测试完成之前，测试夹具不需要打开。在老化应力和电气测试之后，可以将单个裸片或单独的封装裸片与封装裸片之间建立互为独立部件，阵列或簇的互连，或者作为单个部分或阵列。

3. 发明授权

US6087845A Universal wafer carrier for wafer level die burn-in 有权
公开(公告)号：US6087845A
公开(公告)日：2000-07-11
申请号：US186022
申请日：1998-11-04
申请人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
发明人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/60 , H01L21/66 , H01L23/13 , H05K3/00 , H05K3/40 , H05K3/42
CPC分类号： H01L24/80 , G01R1/0483 , G01R1/0491 , G01R31/2855 , G01R31/2863 , G01R31/2867 , G01R31/2886 , G01R31/2889 , G01R31/2893 , H01L22/20 , H01L22/22 , H01L23/13 , H05K3/4007 , G01R1/0466 , G01R1/0735 , G01R3/00 , G01R31/2831 , H01L2224/16145 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

4. 发明授权

US5910640A Electrical contact assembly for use in a multi-die encapsulation device 失效
标题翻译：用于多管芯封装装置的电触点组件
公开(公告)号：US5910640A
公开(公告)日：1999-06-08
申请号：US26786
申请日：1998-02-20
申请人： Warren M. Farnworth , Alan G. Wood , Tim J. Corbett
发明人： Warren M. Farnworth , Alan G. Wood , Tim J. Corbett
IPC分类号： H01R13/24 , H05K7/02 , H01R9/09
CPC分类号： H01R12/57 , H01R12/714 , H01R13/24 , H05K7/023
摘要： A multi-die encapsulation device has a plurality of die chambers. Each of the die chambers has parallel opposing walls, retaining edges which define an insertion void, and a retaining contact in contact with a printed circuit board. Each of the retaining contacts is characterized as having a compliant foot for making contact with a printed circuit board. The encapsulation device comprises a cap with a compression pad for protecting and biasing each of the bare die in its respective chamber.
摘要翻译：多管芯封装装置具有多个管腔。每个模腔具有平行的相对壁，限定插入空隙的保持边缘和与印刷电路板接触的保持触点。每个保持触点的特征在于具有用于与印刷电路板接触的柔性脚。封装装置包括具有压缩垫的盖，用于保护并偏压其相应室中的每个裸模。

5. 发明授权

US5726580A Universal wafer carrier for wafer level die burn-in 失效
标题翻译：用于晶圆级模具老化的通用晶圆载体
公开(公告)号：US5726580A
公开(公告)日：1998-03-10
申请号：US653513
申请日：1996-05-24
申请人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
发明人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/60 , H01L21/66 , H01L23/13 , H05K3/00 , H05K3/40 , H05K3/42
CPC分类号： H01L24/80 , G01R1/0483 , G01R1/0491 , G01R31/2855 , G01R31/2863 , G01R31/2867 , G01R31/2886 , G01R31/2889 , G01R31/2893 , H01L22/20 , H01L22/22 , H01L23/13 , H05K3/4007 , G01R1/0466 , G01R1/0735 , G01R3/00 , G01R31/2831 , H01L2224/16145 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical test, it is possible to establish interconnection between the single die or separate and package the dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
摘要翻译：用于测试半导体晶片上的无引脚骰子的可重复使用的老化/测试夹具由两半组成。测试夹具的前半部分是用于接收晶片的模腔板，并且第二半部分在晶片和电测试设备之间建立电连通。刚性基板在其上具有与晶片电接触的导体。在老化和电气测试完成之前，测试夹具不需要打开。在老化应力和电气测试之后，可以建立单芯片之间的互连或单独的封装，并将裸片封装成分立的部件，阵列或簇，或者作为单个部件或阵列。

6. 发明授权

US5663654A Universal wafer carrier for wafer level die burn-in 失效
标题翻译：用于晶圆级模具老化的通用晶圆载体
公开(公告)号：US5663654A
公开(公告)日：1997-09-02
申请号：US643516
申请日：1996-05-06
申请人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
发明人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/60 , H01L21/66 , H01L23/13 , H05K3/00 , H05K3/40 , H05K3/42
CPC分类号： H01L24/80 , G01R1/0483 , G01R1/0491 , G01R31/2855 , G01R31/2863 , G01R31/2867 , G01R31/2886 , G01R31/2889 , G01R31/2893 , H01L22/20 , H01L22/22 , H01L23/13 , H05K3/4007 , G01R1/0466 , G01R1/0735 , G01R3/00 , G01R31/2831 , H01L2224/16145 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a die cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical test, it is possible to establish interconnection between the single dice or separate and package the dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
摘要翻译：用于测试半导体晶片上的无引脚骰子的可重复使用的老化/测试夹具由两半组成。测试夹具的前半部分是用于接收晶片的模腔板，并且第二半部分在晶片和电测试设备之间建立电连通。刚性基板在其上具有与晶片电接触的导体。在老化和电气测试完成之前，测试夹具不需要打开。在老化应力和电气测试之后，可以建立单个骰子之间的互连，或者将骰子分开并将骰子包装成分立的部分，阵列或簇，作为单个部分或阵列。

7. 发明授权

US5585282A Process for forming a raised portion on a projecting contact for electrical testing of a semiconductor 失效
标题翻译：用于在半导体的电气测试的突出接触件上形成凸起部分的工艺
公开(公告)号：US5585282A
公开(公告)日：1996-12-17
申请号：US406637
申请日：1995-03-20
申请人： Alan G. Wood , Trung T. Doan , Warren M. Farnworth , Tim J. Corbett
发明人： Alan G. Wood , Trung T. Doan , Warren M. Farnworth , Tim J. Corbett
IPC分类号： G01R1/04 , G01R1/067 , G01R3/00 , G01R31/28 , H01L21/60 , H01L21/66 , H01L21/68 , H01L23/13 , H01L23/498 , H05K3/00 , H05K3/40 , H05K3/42 , H01L21/28 , H01L21/308
CPC分类号： H05K3/4007 , G01R1/0466 , H01L21/6835 , H01L22/20 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L24/80 , G01R3/00 , H01L2224/13012 , H01L2224/13019 , H01L2224/16145 , H01L2224/16225 , H01L2224/16227 , H01L2224/81192 , H01L2224/81345 , H01L2224/83192 , H01L2225/06562 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/01032 , H01L2924/01033 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/14 , H01L2924/15151 , H01L2924/15174 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A process for forming die contacting substrate for establishing ohmic contact with the die is formed with raised portions on contact members. The raised portions are dimensioned so that a compression force applied to the die against the substrate results in a limited penetration of the contact member into the bondpads. In the preferred embodiment, the substrate is formed of semiconductor material, with the raised portions being formed by etching. The arrangement may be used for establishing temporary electrical contact with a burn-in oven and with a discrete die tester. This permits the die to be characterized prior to assembly, so that the die may then be transferred in an unpackaged form. A Z-axis anisotropic conductive interconnect material may be interposed between the die attachment surface and the die.
摘要翻译：用于与模具建立欧姆接触的用于形成模具接触衬底的方法在接触构件上形成有凸起部分。凸起部分的尺寸被设计成使得对模具施加到基板上的压缩力导致接触构件有限地渗透到粘合垫中。在优选实施例中，衬底由半导体材料形成，凸起部分通过蚀刻形成。该装置可用于与老化烘箱和分立模具测试仪建立临时电接触。这允许在组装之前对模具进行表征，从而可以以未包装的形式转移模具。 Z轴各向异性导电互连材料可以插入在模具附接表面和模具之间。

8. 发明授权

US5859539A Universal wafer carrier for wafer level die burn-in 失效
标题翻译：用于晶圆级模具老化的通用晶圆载体
公开(公告)号：US5859539A
公开(公告)日：1999-01-12
申请号：US909227
申请日：1997-08-11
申请人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
发明人： Alan G. Wood , Tim J. Corbett , Warren M. Farnworth
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/26 , G01R31/28 , H01L21/60 , H01L21/66 , H01L23/13 , H05K3/00 , H05K3/40 , H05K3/42
CPC分类号： H01L24/80 , G01R1/0483 , G01R1/0491 , G01R31/2855 , G01R31/2863 , G01R31/2867 , G01R31/2886 , G01R31/2889 , G01R31/2893 , H01L22/20 , H01L22/22 , H01L23/13 , H05K3/4007 , G01R1/0466 , G01R1/0735 , G01R3/00 , G01R31/2831 , H01L2224/16145 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/14 , H01L2924/1433 , H01L2924/15151 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consists of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical test equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical test are completed. After burn-in stress and electrical test, it is possible to establish interconnection between the single die or separate and package the dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.
摘要翻译：用于测试半导体晶片上的无引脚骰子的可重复使用的老化/测试夹具由两半组成。测试夹具的前半部分是用于接收晶片的晶片腔板，第二半部分在晶片和电气测试设备之间建立电气连通。刚性基板在其上具有与晶片电接触的导体。在老化和电气测试完成之前，测试夹具不需要打开。在老化应力和电气测试之后，可以在单个裸片之间建立互连或单独的封装，并将裸片封装成分立的部件，阵列或簇，或者作为单个部件或阵列。

9. 发明授权

US5767443A Multi-die encapsulation device 失效
标题翻译：多芯片封装器件
公开(公告)号：US5767443A
公开(公告)日：1998-06-16
申请号：US353769
申请日：1994-12-12
申请人： Warren M. Farnworth , Alan G. Wood , Tim J. Corbett
发明人： Warren M. Farnworth , Alan G. Wood , Tim J. Corbett
IPC分类号： H01R13/24 , H05K7/02 , H01R9/09
CPC分类号： H01R12/57 , H01R12/714 , H01R13/24 , H05K7/023
摘要： Disclosed is an encapsulation device for bare die. The encapsulation device includes chambers having parallet walls, an insertion void, and a spring retention electrical contact having a compliant foot and comprises a cap having a compression pad. The encapsulation device of the invention provides a reliable contact between the die and a mounting board via the compliant foot. The insertion void allows for a safe insertion of a die into a chamber of the encapsulation device. The compression pad and the spring retention electrical contact provide positive retainment of the bare die within the encapsulation device.
摘要翻译：公开了一种用于裸芯片的封装装置。封装装置包括具有旁路壁的腔室，插入空隙和具有柔性脚部的弹簧保持电触点，并且包括具有压缩垫的盖。本发明的封装装置通过柔性脚提供了管芯与安装板之间的可靠接触。插入孔允许将管芯安全插入到封装装置的腔室中。压缩垫和弹簧保持电接触提供了裸片在封装装置内的正面保持。

10. 发明授权

US6091251A Discrete die burn-in for nonpackaged die 失效
标题翻译：用于非封装模具的离散模具老化
公开(公告)号：US6091251A
公开(公告)日：2000-07-18
申请号：US888448
申请日：1997-07-07
申请人： Alan G. Wood , Tim J. Corbett , Gary L. Chadwick , Chender Huang , Larry D. Kinsman
发明人： Alan G. Wood , Tim J. Corbett , Gary L. Chadwick , Chender Huang , Larry D. Kinsman
IPC分类号： G01R1/04 , G01R1/067 , G01R1/073 , G01R3/00 , G01R31/28 , H01L21/60 , H01L21/66 , H01L21/68 , H01L23/13 , H01L23/498 , H05K3/00 , H05K3/40 , H05K3/42
CPC分类号： G01R31/2893 , G01R1/0466 , G01R1/0483 , H01L21/6835 , H01L22/20 , H01L23/13 , H01L23/49816 , H01L23/49838 , H01L24/80 , H05K3/4007 , G01R3/00 , G01R31/2863 , H01L2224/16145 , H01L2225/06562 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01033 , H01L2924/01075 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/14 , H01L2924/15151 , H01L2924/15174 , H01L2924/15787 , H05K2201/0133 , H05K2201/0347 , H05K2201/0367 , H05K2201/0394 , H05K2201/09481 , H05K2201/09563 , H05K2203/0307 , H05K2203/0723 , H05K3/0058 , H05K3/0067 , H05K3/423
摘要： A reusable burn-in/test fixture for discrete TAB die consists of two halves. The first half of the test fixture contains cavity in which die is inserted. When the two halves are assembled, the fixture establishes electrical contact with the die and with a burn-in oven. The test fixture need not be opened until the burn-in and electrical test are completed. The fixture permits the die to be characterized prior to assembly.
摘要翻译：用于离散TAB模具的可重复使用的老化/测试夹具由两半组成。测试夹具的前半部分包含插入模具的腔体。当组装两个半部时，夹具与模具建立电接触，并与老化烘箱连接。在老化和电气测试完成之前，测试夹具不需要打开。夹具允许在组装之前对模具进行表征。

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