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1. 发明授权

US06654056B1 Geometric configurations for photosites for reducing Moiré patterns 失效
标题翻译：用于减少莫尔图案的照片的几何配置
公开(公告)号：US06654056B1
公开(公告)日：2003-11-25
申请号：US09211765
申请日：1998-12-15
申请人： Alain E. Perregaux , Jagdish C. Tandon , Paul A. Hosier , Roger L. Triplett , Xiao-Fan Feng
发明人： Alain E. Perregaux , Jagdish C. Tandon , Paul A. Hosier , Roger L. Triplett , Xiao-Fan Feng
IPC分类号： H04N314
CPC分类号： H04N1/03 , H04N1/0308 , H04N5/357 , H04N9/045
摘要： Geometric configurations for photosites found on photosensitive chips for creating electrical signals from an original image, as would be found, for example, in a digital scanner, copier, facsimile machine, or other document generating or reproducing device. The photosensitive chips are mounted on a substrate to form a photosensitive array in a full width scanner or other photosensitive device. The geometric configurations reduce the Moiré patterns to provide a higher quality image.
摘要翻译：例如在数字扫描仪，复印机，传真机或其他文件生成或再现装置中可以找到的用于从原始图像产生电信号的感光芯片上发现的光电子的几何配置。感光芯片安装在基板上以在全宽度扫描仪或其它感光装置中形成光敏阵列。几何配置减少了莫尔图案，以提供更高质量的图像。

2. 发明授权

US06955989B2 Use of a U-groove as an alternative to using a V-groove for protection against dicing induced damage in silicon 失效
标题翻译：使用U形槽作为使用V形槽的替代方案来防止在硅中切割引起的损坏
公开(公告)号：US06955989B2
公开(公告)日：2005-10-18
申请号：US09996681
申请日：2001-11-30
申请人： Alain E. Perregaux , Paul A. Hosier , Josef E. Jedlicka , Nicholas J. Salatino , Jagdish C. Tandon
发明人： Alain E. Perregaux , Paul A. Hosier , Josef E. Jedlicka , Nicholas J. Salatino , Jagdish C. Tandon
IPC分类号： B28D5/02 , H01L21/301 , H01L21/3065 , H01L21/302
CPC分类号： B28D5/022 , H01L21/78
摘要： The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well as the need for stripping the developed photoresist layer. Furthermore, going to a U-groove profile accomplishes additional indirect and greater cost savings resulting from increased process throughput, improved yield, and reduced metal layer defects.
摘要翻译：本公开内容涉及通过将第二蚀刻步骤通过将第二蚀刻步骤修改为干蚀刻而不是湿蚀刻将芯片芯片切割方法修改为U形沟槽轮廓导致通过消除更昂贵的直接成本节省工艺步骤，以及剥离显影的光致抗蚀剂层的需要。此外，进入U形凹槽轮廓可实现额外的间接和更大的成本节省，这是由于加工量增加，产量提高和金属层缺陷减少。

3. 发明授权

US06646248B2 Photosensitive imaging apparatus sensitive to orange light 有权
公开(公告)号：US06646248B2
公开(公告)日：2003-11-11
申请号：US09841279
申请日：2001-04-24
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
IPC分类号： H01L2700
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.

4. 发明授权

US06927381B2 Photosensitive imaging apparatus sensitive to orange light 失效
标题翻译：对橙光敏感的感光成像设备
公开(公告)号：US06927381B2
公开(公告)日：2005-08-09
申请号：US10656622
申请日：2003-09-05
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Gaurav Sharma , Alain E. Perregaux , Robert P. Herloski
IPC分类号： G06T1/00 , H01L27/146 , H04N1/028 , H04N1/191 , H04N5/369 , H04N9/083 , H01L27/00
CPC分类号： H01L27/14645 , H01L27/14621
摘要： A photosensitive imaging device for recording images across the entire visible spectrum includes a set of photosensors which have a peak response around the orange part of the spectrum, about 600 nm. The peak response is obtained by combining responses of, in one case, photosensors associated with a filter which admits red or infrared wavelengths and longer and photosensors associated with a filter which admits orange wavelengths and longer. In another case, the photosensor is structured to attenuate longer wavelengths, which, in combination with a filter which admits orange and longer wavelengths, can simulate a peak behavior around the orange part of the spectrum.
摘要翻译：用于在整个可见光谱上记录图像的光敏成像装置包括一组光敏元件，其在约600nm处具有围绕光谱的橙色部分的峰值响应。峰响应通过组合响应，在一种情况下，与允许红色或红外波长的滤波器相关联的光电传感器以及与允许橙色波长和更长的滤波器相关联的光电传感器的响应。在另一种情况下，光电传感器被构造为衰减更长的波长，其与允许橙色和较长波长的滤波器组合可以模拟在光谱的橙色部分周围的峰值行为。

5. 发明授权

US07471327B2 Image sensor array with variable resolution and high-speed output 有权
标题翻译：具有可变分辨率和高速输出的图像传感器阵列
公开(公告)号：US07471327B2
公开(公告)日：2008-12-30
申请号：US10762120
申请日：2004-01-21
申请人： Paul A. Hosier , Scott L. TeWinkle , Roger L. Triplett , Jagdish C. Tandon
发明人： Paul A. Hosier , Scott L. TeWinkle , Roger L. Triplett , Jagdish C. Tandon
IPC分类号： H04N3/14 , H04N5/335 , H04N1/46
CPC分类号： H04N5/3692 , H04N5/347
摘要： A photosensitive imaging apparatus has a linear array of groups of photosensors. In a low-resolution scanning mode, all of the photosensors in each group act together as one large photosensor. In a high-resolution scanning mode, each photosensor in a group acts outputs image-based signals independently. In either mode, the signals output by the photosensors are transferred to one of two output lines, such as for “odd-” and “even-” positioned photosensors or groups of photosensors. The signals on the two lines can then be multiplexed to a single output line. The dual output lines enable fast signal output in either resolution mode.
摘要翻译：光敏成像装置具有一组光电传感器的线性阵列。在低分辨率扫描模式下，每个组中的所有光电传感器一起作为一个大光电传感器。在高分辨率扫描模式下，组中的每个光电传感器可以独立地输出基于图像的信号。在任一模式下，由光电传感器输出的信号被传送到两个输出线之一，例如“奇数”和“偶数”位置的光电传感器或光电传感器组。然后可以将两条线上的信号复用到单个输出线。双输出线可以在任一分辨率模式下实现快速信号输出。

6. 发明授权

US6014160A Image scanning array having independently addressable photosensor chips 失效
标题翻译：图像扫描阵列具有可独立寻址的光电传感器芯片
公开(公告)号：US6014160A
公开(公告)日：2000-01-11
申请号：US50272
申请日：1998-03-30
申请人： Scott L. Tewinkle , Paul A. Hosier , Jagdish C. Tandon
发明人： Scott L. Tewinkle , Paul A. Hosier , Jagdish C. Tandon
IPC分类号： H04N1/191 , H04N1/193 , H04N1/40 , H04N5/369 , H04N1/19
CPC分类号： H04N1/1934 , H04N1/193 , H04N1/40 , H04N3/1581 , H04N3/1593
摘要： An image sensor array includes a plurality of photosensor chips, which are butted end-to-end to form a single linear array of photosensors. Each individual chip in the array is provided with an independently-addressable output enable line and video output line. This configuration allows individual chips to be addressed to output image data at specific times and in a specific manner suitable for any kind of downstream circuitry.
摘要翻译：图像传感器阵列包括多个光电传感器芯片，它们被端对端对接以形成光电传感器的单个线性阵列。阵列中的每个芯片都提供独立可寻址的输出使能线和视频输出线。这种配置允许单独的芯片被寻址以在特定时间和以适合于任何种类的下游电路的特定方式输出图像数据。

7. 发明授权

US5696626A Photosensitive silicon chip having a ridge near an end photosite 失效
标题翻译：感光硅芯片具有靠近端部光泽的脊
公开(公告)号：US5696626A
公开(公告)日：1997-12-09
申请号：US542247
申请日：1995-10-12
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Brian T. Ormond
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Brian T. Ormond
IPC分类号： H01L31/0216 , H04N1/04
CPC分类号： H01L31/02162
摘要： A photosensitive chip, such as used in a scanner or facsimile, defines a linear array of photosites, each photosite being covered with a filter formed from a cured translucent liquid. At the critical ends of the chip, between the end photosite in the array and the edge of the chip, there is provided a ridge which protrudes over the thickness of the filter. This ridge maintains the physical integrity of the filter.
摘要翻译：诸如用于扫描仪或传真机中的感光芯片限定了一种线性阵列的光斑，每个光斑都被由固化的半透明液体形成的过滤器覆盖。在芯片的临界端，在阵列中的端部闪光和芯片的边缘之间，设置有突出于过滤器厚度的脊。该脊保持过滤器的物理完整性。

8. 发明授权

US08368002B2 In-line image sensor in combination with linear variable filter based spectrophotometer 有权
标题翻译：联机图像传感器与线性可变滤波器分光光度计相结合
公开(公告)号：US08368002B2
公开(公告)日：2013-02-05
申请号：US12580028
申请日：2009-10-15
申请人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Paul S. Bonino
发明人： Paul A. Hosier , Jagdish C. Tandon , Josef E. Jedlicka , Paul S. Bonino
IPC分类号： G01J3/50 , G01J3/42
CPC分类号： G01J3/2803 , G01J3/12 , G01J3/26 , G01J3/51 , G01J3/513 , G01J2003/1234
摘要： A photosensitive apparatus including a full width array of photosensors and a first photosensor chip. The first photosensor chip including a linear array of photosensors having a plurality of pixels arranged in a long direction and a linear variable filter adapted to transmit at least ten unique bandwidths of wavelengths of light along a length of the linear variable filter where the linear variable filter is fixedly secured to the linear array. Each respective pixel receives a unique bandwidth of wavelengths of light as a light passes through the linear variable filter and the length is aligned with the long direction. The full width array of photosensors is arranged perpendicular to a process direction of a printing device.
摘要翻译：一种感光装置，包括全光束传感器阵列和第一光电传感器芯片。第一光传感器芯片包括具有沿长方向布置的多个像素的光电传感器的线性阵列和适于沿着线性可变滤波器的长度传输至少十个唯一的波长波长的线性可变滤波器，其中线性可变滤波器固定地固定在线性阵列上。当光线通过线性可变滤波器并且长度与长方向对准时，每个像素接收光的波长的唯一带宽。光传感器的全宽阵列垂直于打印装置的处理方向布置。

9. 发明授权

US07528997B2 Systems and methods for streak detection in image array scanning 失效
标题翻译：图像阵列扫描中条纹检测的系统和方法
公开(公告)号：US07528997B2
公开(公告)日：2009-05-05
申请号：US10740493
申请日：2003-12-22
申请人： Donald J. Gusmano , Jagdish C. Tandon , Paul A. Hosier
发明人： Donald J. Gusmano , Jagdish C. Tandon , Paul A. Hosier
IPC分类号： H04N1/04 , G06K15/00
CPC分类号： H04N1/4097 , H04N1/00002 , H04N1/00013 , H04N1/00023 , H04N1/00029 , H04N1/0005 , H04N1/00063 , H04N1/1215 , H04N1/193
摘要： In a system and method for streak detection in a fixed imaging array digital scanning system, redundant information regarding individual lines of a scanned image collected by multiple discrete rows or sets of scanning sensors in the imaging array are compared. Stationary obstructions in the field of view of the imaging array are detected through this comparison which would otherwise appear repeatedly reproduced as streaks or lines in the reproduced output image.
摘要翻译：在用于固定成像阵列数字扫描系统中的条纹检测的系统和方法中，比较了由成像阵列中的多个离散行或多组扫描传感器收集的扫描图像的各行的冗余信息。通过该比较来检测成像阵列的视场中的固定障碍物，否则其将以再现的输出图像中的条纹或线条重复再现。

10. 发明授权

US06528336B2 Method for fabrication of a silicon photosensor array on a wafer and testing the same 有权
标题翻译：在晶片上制造硅光电传感器阵列并进行测试的方法
公开(公告)号：US06528336B2
公开(公告)日：2003-03-04
申请号：US09829117
申请日：2001-04-09
申请人： Paul A. Hosier , Jagdish C. Tandon
发明人： Paul A. Hosier , Jagdish C. Tandon
IPC分类号： H01L2166
CPC分类号： H01L27/1463 , G01R31/2831 , H01L27/14632
摘要： A method of fabricating and a wafer having a plurality of photosensor Arrays thereon. And, a method of testing the wafer before the wafer is diced and assembled to form a Silicon photosensor Array which may be combined with other like photosensor arrays to form a full page width image sensor bar. The invention allows checking of every V-groove on every chip. An implanted or diffused region is placed across the V-groove, with electrical connections on both ends of the diffusion. If the V-groove is formed, the diffused region will be broken and the electrical path will be open. A deeper diffusion can be also used to check for incomplete V-grooves. If one end of the electrical path is tied to an existing I/O pad on the chip and the other end to ground, this path will have no effect on the input resistance if the V-groove is formed. There will be a small, but acceptable, increase in input capacitance. If the V-groove is not formed, the connection will appear as a short or high leakage on the chip input, which will fail the DC test on that I/O. Thus, existing DC tests can be used to check normal I/O integrity and V-groove process completion.
摘要翻译：一种制造方法和在其上具有多个光电传感器阵列的晶片。而且，在将晶片切割和组装之前测试晶片的方法以形成硅光电传感器阵列，其可以与其它类似的光电传感器阵列组合以形成全页宽度的图像传感器条。本发明允许在每个芯片上检查每个V形槽。植入或扩散区域横跨V形槽放置，扩散两端具有电连接。如果形成V形槽，则扩散区域将被破坏并且电路径将被打开。更深的扩散也可用于检查不完整的V形槽。如果电路的一端连接到芯片上的现有I / O焊盘，另一端连接到地，则如果形成V形槽，该路径对输入电阻没有影响。输入电容的增加将会很小但可以接受。如果没有形成V形槽，则连接将在芯片输入端显示为短路或高电流泄漏，这将导致该I / O的直流测试失败。因此，可以使用现有的直流测试来检查正常的I / O完整性和V槽工艺的完成。

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