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1. 发明授权

US6046071A Plastic molded semiconductor package and method of manufacturing the same 失效
标题翻译：塑料模制半导体封装及其制造方法
公开(公告)号：US6046071A
公开(公告)日：2000-04-04
申请号：US976603
申请日：1997-11-24
申请人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
发明人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/367 , H01L23/485 , H01L23/498 , H05K3/30 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/568 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3121 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/28 , H01L24/83 , H01L2224/11 , H01L2224/11003 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/17051 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/81207 , H01L2224/83102 , H01L2224/83104 , H01L2224/8319 , H01L2224/8385 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1579 , H01L2924/181 , Y10T29/49169
摘要： A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.
摘要翻译：在半导体芯片的主表面上形成焊盘电极。在半导体芯片的主表面上形成覆盖焊盘电极的表面部分的钝化膜。在焊盘电极的表面部分上形成内部连接导体。半导体芯片被仅暴露内部连接导体顶表面的模制树脂覆盖。外部连接导体形成在内部连接导体的顶表面上。外部连接导体具有基本平坦的顶表面。因此，塑料成型半导体封装可以容易地安装在印刷电路板上，并且可以在印刷电路板上接合之后具有改进的可靠性。

2. 发明授权

US5834340A Plastic molded semiconductor package and method of manufacturing the same 失效
公开(公告)号：US5834340A
公开(公告)日：1998-11-10
申请号：US977666
申请日：1997-11-24
申请人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
发明人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/367 , H01L23/485 , H01L23/498 , H05K3/30 , H01L21/44
CPC分类号： H01L21/568 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3121 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/28 , H01L24/83 , H01L2224/11 , H01L2224/11003 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/17051 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/81207 , H01L2224/83102 , H01L2224/83104 , H01L2224/8319 , H01L2224/8385 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1579 , H01L2924/181 , Y10T29/49169
摘要： A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

3. 发明授权

US5710062A Plastic molded semiconductor package and method of manufacturing the same 失效
公开(公告)号：US5710062A
公开(公告)日：1998-01-20
申请号：US456335
申请日：1995-06-01
申请人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
发明人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/367 , H01L23/485 , H01L23/498 , H05K3/30 , H01L21/28
CPC分类号： H01L21/568 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3121 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/28 , H01L24/83 , H01L2224/11 , H01L2224/11003 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/17051 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/81207 , H01L2224/83102 , H01L2224/83104 , H01L2224/8319 , H01L2224/8385 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1579 , H01L2924/181 , Y10T29/49169
摘要： A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.

4. 发明授权

US5554887A Plastic molded semiconductor package 失效
标题翻译：塑料模制半导体封装
公开(公告)号：US5554887A
公开(公告)日：1996-09-10
申请号：US234808
申请日：1994-04-28
申请人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
发明人： Akiyoshi Sawai , Haruo Shimamoto , Toru Tachikawa , Jun Shibata
IPC分类号： H01L21/56 , H01L21/58 , H01L21/60 , H01L21/68 , H01L23/12 , H01L23/28 , H01L23/31 , H01L23/367 , H01L23/485 , H01L23/498 , H05K3/30
CPC分类号： H01L21/568 , H01L21/563 , H01L21/565 , H01L23/3114 , H01L23/3121 , H01L23/3677 , H01L23/49816 , H01L23/49827 , H01L24/11 , H01L24/13 , H01L24/28 , H01L24/83 , H01L2224/11 , H01L2224/11003 , H01L2224/1147 , H01L2224/13 , H01L2224/13099 , H01L2224/13111 , H01L2224/1403 , H01L2224/16 , H01L2224/17051 , H01L2224/29111 , H01L2224/2919 , H01L2224/73203 , H01L2224/81207 , H01L2224/83102 , H01L2224/83104 , H01L2224/8319 , H01L2224/8385 , H01L2224/92125 , H01L2924/01004 , H01L2924/01005 , H01L2924/01013 , H01L2924/01022 , H01L2924/01024 , H01L2924/01029 , H01L2924/01033 , H01L2924/01049 , H01L2924/0105 , H01L2924/01073 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/0132 , H01L2924/014 , H01L2924/0665 , H01L2924/07802 , H01L2924/1579 , H01L2924/181 , Y10T29/49169
摘要： A pad electrode is formed on a main surface of a semiconductor chip. A passivation film, which covers a surface portion of the pad electrode, is formed on the main surface of the semiconductor chip. An internal connection conductor is formed on a surface portion of the pad electrode. The semiconductor chip is covered with a molding resin which exposes only a top surface of the internal connection conductor. An external connection conductor is formed on a top surface of the internal connection conductor. The external connection conductor has a substantially flat top surface. Thereby, a plastic molded semiconductor package can be easily mounted on a printed board, and can have improved reliability after being joined on the printed board.
摘要翻译：在半导体芯片的主表面上形成焊盘电极。在半导体芯片的主表面上形成覆盖焊盘电极的表面部分的钝化膜。在焊盘电极的表面部分上形成内部连接导体。半导体芯片被仅暴露内部连接导体顶表面的模制树脂覆盖。外部连接导体形成在内部连接导体的顶表面上。外部连接导体具有基本平坦的顶表面。因此，塑料成型半导体封装可以容易地安装在印刷电路板上，并且可以在印刷电路板上接合之后具有改进的可靠性。

5. 发明授权

US5309021A Semiconductor device having particular power distribution interconnection arrangement 失效
标题翻译：具有特定配电互连装置的半导体装置
公开(公告)号：US5309021A
公开(公告)日：1994-05-03
申请号：US961352
申请日：1992-10-15
申请人： Haruo Shimamoto , Jun Shibata , Toru Tachikawa , Tetsuya Ueda , Hiroshi Seki
发明人： Haruo Shimamoto , Jun Shibata , Toru Tachikawa , Tetsuya Ueda , Hiroshi Seki
IPC分类号： H01L21/60 , H01L23/28 , H01L23/495 , H01L23/50 , H05K1/02 , H05K3/34 , H01L39/02 , H01L23/58 , H01L23/12 , H01L23/48
CPC分类号： H01L23/49527 , H01L23/49517 , H05K3/341 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L24/45 , H01L24/48 , H01L2924/00014 , H01L2924/01078 , H01L2924/01079 , H01L2924/14 , H01L2924/1532 , H01L2924/181 , H01L2924/30107 , H05K1/0263 , H05K2201/10659 , H05K2201/10689 , H05K3/3426 , Y02P70/613
摘要： A semiconductor device according to the present invention has reduced inductance on a power supply line, a grounding line, and signal lines. In this invention, to reduce the length of the power supply connection and that of the grounding connection, a power supply metal post and a grounding metal post are respectively provided on a power supply lead of a semiconductor chip and grounding lead of the semiconductor chip perpendicular to the leads. The metal posts protrude from the resin encapsulating the chip and are connected to lands or a conductive circuit pattern on a printed circuit board. Furthermore, a planar conductor commonly connecting the power supply or grounding potentials is provided.
摘要翻译：根据本发明的半导体器件具有减小电源线，接地线和信号线上的电感。在本发明中，为了减小电源连接的长度和接地连接的长度，分别在半导体芯片的电源引线和半导体芯片的接地引线垂直地设置电源金属柱和接地金属柱到线索金属柱从封装芯片的树脂突出，并连接到印刷电路板上的焊盘或导电电路图案。此外，提供通常连接电源或接地电位的平面导体。

6. 发明授权

US5327010A IC card having adhesion-preventing sheets 失效
标题翻译：具有防粘接片的IC卡
公开(公告)号：US5327010A
公开(公告)日：1994-07-05
申请号：US553459
申请日：1990-07-17
申请人： Takeshi Uenaka , Jun Ohbuchi , Shigeo Onoda , Makoto Omori , Hajime Maeda , Toru Tachikawa
发明人： Takeshi Uenaka , Jun Ohbuchi , Shigeo Onoda , Makoto Omori , Hajime Maeda , Toru Tachikawa
IPC分类号： G06K19/077 , H01L23/538 , H01L25/10 , H05K3/28 , H01L23/02 , G06K19/00 , H01L23/12
CPC分类号： H05K3/284 , G06K19/07745 , H01L23/5388 , H01L25/105 , H01L2225/1005 , H01L2225/1029 , H01L2225/107 , H01L2924/0002 , H01L2924/1627 , H01L2924/3511
摘要： An IC card includes a substrate, semiconductor devices mounted on at least one of the major surfaces of the substrate and a casing in which the substrate with the semiconductor devices mounted on it is housed. The casing includes a frame and panels bonded to the frame on the opposite sides of the frame by means of adhesive layers. The semiconductor devices are prevented from being bonded to the panel via the adhesive layers at locations on the adhesive layers facing the semiconductor devices.
摘要翻译： IC卡包括基板，安装在基板的至少一个主表面上的半导体器件和安装有安装有半导体器件的基板的壳体。壳体包括框架和通过粘合剂层在框架的相对侧上结合到框架的面板。防止半导体器件在面向半导体器件的粘合剂层上的位置处经由粘合剂层粘合到面板上。

7. 发明授权

US5299940A IC card 失效
标题翻译： IC卡
公开(公告)号：US5299940A
公开(公告)日：1994-04-05
申请号：US913042
申请日：1992-07-14
申请人： Takeshi Uenaka , Hajime Maeda , Yasumori Ikeda , Toru Tachikawa , Shigeo Onoda
发明人： Takeshi Uenaka , Hajime Maeda , Yasumori Ikeda , Toru Tachikawa , Shigeo Onoda
IPC分类号： G06K19/077 , H05K5/02 , H01R7/10
CPC分类号： H05K5/0269 , G06K19/077
摘要： An IC card is disclosed which would not be deformed, and hence, which maintains its quality reliability. A frame is provided to house a substrate which mounts ICs. Panels for protecting the ICs are fixed to the frame by first adhesive material layers. A connector is disposed, in contact with the substrate, between the panels. The connector is fixed to the frame by a second adhesive material layer. This prohibits that external force which acts on the connector at insertion and detachment of the IC card into and from external equipment from acting on the first adhesive material layers. Hence, insertion and detachment of the IC card do not cause deterioration in adhesion between the panels and the frame. Thus, deformation of the ICs due to the external force is prevented, thereby the quality reliability of the IC card being better maintained.
摘要翻译：公开了不会变形的IC卡，因此保持其质量可靠性。提供了一个框架来容纳安装IC的基板。用于保护IC的面板通过第一粘合材料层固定在框架上。连接器设置在面板之间与基板接触。连接器通过第二粘合材料层固定到框架。这就禁止在将IC卡插入和从外部设备插入和拆卸时作用在连接器上的外力作用在第一粘合材料层上。因此，IC卡的插入和拆卸不会导致面板和框架之间的粘附性降低。因此，防止了由于外力引起的IC的变形，从而更好地保持了IC卡的质量可靠性。

8. 发明授权

US5278445A Semiconductor device card having a plurality of self-locking pawls 失效
标题翻译：具有多个自锁爪的半导体器件卡
公开(公告)号：US5278445A
公开(公告)日：1994-01-11
申请号：US588158
申请日：1990-09-26
申请人： Shunichi Uemura , Toru Tachikawa , Shigeo Onoda
发明人： Shunichi Uemura , Toru Tachikawa , Shigeo Onoda
IPC分类号： B42D15/10 , G06K19/077 , H01L23/04 , H01L23/32 , H05K5/02 , H01L23/02 , H01L23/12
CPC分类号： H05K5/0269 , H01L23/04 , H01L23/32 , H01L2924/16195 , H01L2924/1627 , Y10S257/922 , Y10S439/946
摘要： A semiconductor device card includes an electric circuit board, at least one panel having self-locking pawls formed at several places along the edge thereof, and a frame having engagement surfaces for engaging the pawls.
摘要翻译：半导体器件卡包括电路板，至少一个面板，其沿着其边缘在多个位置形成有自锁爪，以及具有用于接合爪的接合表面的框架。

9. 发明授权

US5025307A Modular semiconductor device 失效
标题翻译：模块化半导体器件
公开(公告)号：US5025307A
公开(公告)日：1991-06-18
申请号：US501276
申请日：1990-03-29
申请人： Tetsuya Ueda , Toru Tachikawa , Masataka Takehara
发明人： Tetsuya Ueda , Toru Tachikawa , Masataka Takehara
IPC分类号： H05K7/20 , H01L23/467 , H01L23/50 , H01L25/00 , H01L25/10 , H01L25/11 , H01L25/18 , H05K1/14 , H05K7/02 , H05K7/14
CPC分类号： H05K1/145 , H01L25/117 , H05K7/023 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H05K2201/09709 , H05K2201/10946
摘要： A modular semiconductor device includes a pair of generally parallel electronic circuit boards and a plurality of IC packages mounted between the electronic circuit boards. Two or more modular semiconductor devices may be stacked on each other so that memory capacity can be readily enlarged and the function level can be readily improved. A heating, radiating fin of planar or honeycomb structure may be provided in near contact with an IC package.
摘要翻译：模块化半导体器件包括一对大体上平行的电子电路板和安装在电子电路板之间的多个IC封装。两个或更多个模块化半导体器件可以彼此堆叠，使得可以容易地扩大存储器容量并且可以容易地改善功能水平。可以提供与IC封装近接触的平面或蜂窝结构的加热散热片。

10. 发明授权

US5173841A Semiconductor device card and method of manufacturing the same 失效
标题翻译：半导体器件卡及其制造方法
公开(公告)号：US5173841A
公开(公告)日：1992-12-22
申请号：US674167
申请日：1991-03-25
申请人： Takeshi Uenaka , Jun Ohbuchi , Hajime Maeda , Toru Tachikawa , Shigeo Onoda
发明人： Takeshi Uenaka , Jun Ohbuchi , Hajime Maeda , Toru Tachikawa , Shigeo Onoda
IPC分类号： B42D15/10 , B42D15/00 , G06K19/077 , H05K5/02 , H05K7/14
CPC分类号： H05K7/1417 , H05K5/0256 , Y10S439/946
摘要： A semiconductor device card and a method of manufacturing the card. A frame includes an integral spacer which fills a dead space on a circuit board to eliminate the need for positioning a separate spacer in the dead space on the circuit board and fixing the spacer in place with a bonding sheet or the like. In a semiconductor device card in which a spacer for filling a dead space on the circuit board is bonded to a corresponding panel, a recess is formed on the surface of the spacer bonded to the obverse or reverse panel to reduce undulations occurring in the panel surface.
摘要翻译：半导体器件卡和制造该卡的方法。框架包括一个整体间隔件，其填充电路板上的死空间，以消除将电路板上的死空间中的单独间隔件定位并且用隔离片等固定隔离件的需要。在将用于填充电路板上的死空间的间隔物接合到相应面板的半导体器件卡中，在与正面或反面板接合的间隔物的表面上形成凹部，以减少在面板表面中发生的起伏。

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