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1. 发明授权

US07129507B2 Chip mis-position detection method 失效
标题翻译：芯片误位检测方法
公开(公告)号：US07129507B2
公开(公告)日：2006-10-31
申请号：US11051035
申请日：2005-02-04
申请人： Akira Yamamoto , Konosuke Murakami , Yoshio Niki , Takashi Ishimoto , Yutaka Ueda
发明人： Akira Yamamoto , Konosuke Murakami , Yoshio Niki , Takashi Ishimoto , Yutaka Ueda
IPC分类号： G01N21/00
CPC分类号： H01L21/67259 , H01L21/67144
摘要： The invention is a method for detecting float or peel of semiconductor chips arranged in X and Y axes directions diced and bonded to a dicing tape on a stage. The method includes detecting float or peel of the semiconductor chips in a respective horizontal or longitudinal row arranged in the X or Y axis direction; moving the stage in the X axis direction, the Y axis direction, a Z axis direction, and a rotational direction around the Z axis for aligning the stage with a position detection unit for detecting positions of the semiconductor chips in the X axis direction and the Y axis direction; detecting the positions of abnormal semiconductor chips in the respective horizontal or longitudinal row that includes said abnormal semiconductor chips; and specifying the positions of said abnormal semiconductor chips on the X-Y axes.
摘要翻译：本发明是一种用于检测排列在X和Y轴方向上的半导体芯片的漂浮或剥离的方法，该X和Y轴方向切割并结合到台上的切割带。该方法包括检测沿X或Y轴方向布置的各个水平或纵排中的半导体芯片的浮动或剥离; 在X轴方向，Y轴方向，Z轴方向以及围绕Z轴的旋转方向上移动台，用于使台与用于检测半导体芯片在X轴方向上的位置的位置检测单元对准，并且 Y轴方向; 检测包括所述异常半导体芯片的各个水平或纵向行中的异常半导体芯片的位置; 并且指定所述异常半导体芯片在X-Y轴上的位置。

2. 发明申请

US20050173702A1 Chip mis-position detection method 失效
标题翻译：芯片误位检测方法
公开(公告)号：US20050173702A1
公开(公告)日：2005-08-11
申请号：US11051035
申请日：2005-02-04
申请人： Akira Yamamoto , Konosuke Murakami , Yoshio Niki , Takashi Ishimoto , Yutaka Ueda
发明人： Akira Yamamoto , Konosuke Murakami , Yoshio Niki , Takashi Ishimoto , Yutaka Ueda
IPC分类号： H01L21/66 , G01R31/26 , G01R31/28 , H01L21/00 , H01L21/68 , H01L23/58 , H01L29/10
CPC分类号： H01L21/67259 , H01L21/67144
摘要： The invention includes first detection means (9A) disposed on the side of a stage (2), for detecting float or peel of semiconductor chips (10) inside a horizontal or longitudinal row unit regularly arranged in an X or Y axis direction, and second detection means (9B) disposed above the stage (2), for detecting the positions of the semiconductor chips in a unit horizontal or longitudinal row including the peeling semiconductor chips detected by the first detection means, and specifies the positions of the peeling semiconductor chips on the X-Y coordinate axes among a large number of semiconductor chips regularly arranged in the X and Y axes directions by using the first and second detection means while the stage is being moved in the X and Y axes directions.
摘要翻译：本发明包括设置在平台（2）侧的第一检测装置（9A），用于检测在X或Y轴方向上规则排列的水平或纵排单元内部的半导体芯片（10）的漂浮或剥离，以及设置在所述平台（2）上方的第二检测装置（9B），用于检测包括由第一检测装置检测的剥离半导体芯片的单元水平或纵向行中的半导体芯片的位置，并指定剥离半导体通过使用第一和第二检测装置在X和Y轴方向上移动台阶的同时，在X轴和Y轴方向上规则排列的大量半导体芯片之间的XY坐标轴上的芯片。

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