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1. 外观设计

USD491725S1 Container for transporting substrates 失效
标题翻译：用于运输基材的容器
公开(公告)号：USD491725S1
公开(公告)日：2004-06-22
申请号：US29152234
申请日：2001-12-19
申请人： Akira Tanaka , Yoko Suzuki , Takashi Kishi
设计人： Akira Tanaka , Yoko Suzuki , Takashi Kishi

2. 发明授权

US06758876B2 Substrate transport apparatus, pod and method 失效
标题翻译：基板运输装置，吊架和方法
公开(公告)号：US06758876B2
公开(公告)日：2004-07-06
申请号：US10000304
申请日：2001-12-04
申请人： Yoko Suzuki , Akira Tanaka , Takashi Kishi
发明人： Yoko Suzuki , Akira Tanaka , Takashi Kishi
IPC分类号： B01D4600
CPC分类号： H01L21/67366 , H01L21/67017 , H01L21/67379 , H01L21/67393 , H01L21/67396 , H01L21/67772 , H01L21/67775
摘要： A method of using a substrate transport pod is provided, which is suitable for manufacturing semiconductor devices with copper wiring and low dielectric insulating film having dielectric constants of less than 3. The method is based on loading the substrates into a pod from an atmosphere of a first process, and circulating a gaseous atmosphere through interior of the pod in such a way to selectively remove at least one contaminant including moisture, particulate substances or chemical substances, and to expose the substrates to a controlled atmosphere intermittently or continually while the substrates are held in the pod before they are unloaded from the pod and introduced into a second process. For a pod that is used to house the substrates for the purpose of retaining or transporting, the pod has a pod main body and a door that provides a hermetic sealing seal, and the pod is made primarily of a materiel that has moisture absorption factor of less than 0.1%, a the pod can contact the substrates directly or indirectly and has a conductive area so as to enable static charges to be guided out of the pod.
摘要翻译：提供了一种使用基板传输盒的方法，其适用于制造具有铜布线的半导体器件和具有小于3的介电常数的低介电绝缘膜。该方法基于将基板从第一工序，并且通过荚的内部循环气体气氛以选择性地去除至少一种包含水分，颗粒物质或化学物质的污染物，并且在保持基板的同时将基板间断地或连续地暴露于可控气氛在pod中，从pod中卸载并引入第二个进程。对于用于容纳基材以保持或运输的荚，荚具有荚主体和提供气密密封的门，荚主要由具有湿气吸收系数的材料制成小于0.1％，荚可以直接或间接接触衬底，并具有导电区域，以使静电荷能够被引导出荚。

3. 发明授权

US06723151B2 Gas removal method and gas removal filter 失效
标题翻译：气体去除方法和气体去除过滤器
公开(公告)号：US06723151B2
公开(公告)日：2004-04-20
申请号：US10254537
申请日：2002-09-26
申请人： Akira Tanaka , Yoko Suzuki , Takashi Kishi
发明人： Akira Tanaka , Yoko Suzuki , Takashi Kishi
IPC分类号： B01D5304
CPC分类号： B01D53/0454
摘要： A gas removal filter has an ion exchanger for adsorbing a gas and at least a pair of electric resistance measuring electrodes disposed on the ion exchanger. By measuring a change in the electric resistance between at least the pair of electric resistance measuring electrodes disposed on the ion exchanger, it is possible to estimate an ion exchange group consumption ratio of the ion exchanger. The ion exchange group consumption ratio of the ion exchanger can be detected in a short period of time, and a remaining adsorption capability of the ion exchanger can be known with ease.
摘要翻译：气体去除过滤器具有用于吸附气体的离子交换器和设置在离子交换器上的至少一对电阻测量电极。通过测量设置在离子交换器上的至少一对电阻测量电极之间的电阻变化，可以估计离子交换组的离子交换组消耗比。可以在短时间内检测离子交换剂的离子交换组消耗比，容易地知道离子交换剂的剩余吸附能力。

4. 外观设计

USD479399S1 Container for transporting substrates 失效
标题翻译：用于运输基材的容器
公开(公告)号：USD479399S1
公开(公告)日：2003-09-09
申请号：US29152233
申请日：2001-12-19
申请人： Akira Tanaka , Yoko Suzuki , Takashi Kishi
设计人： Akira Tanaka , Yoko Suzuki , Takashi Kishi

5. 发明授权

US06875282B2 Substrate transport container 失效
标题翻译：基材运输容器
公开(公告)号：US06875282B2
公开(公告)日：2005-04-05
申请号：US10145692
申请日：2002-05-16
申请人： Akira Tanaka , Yoko Suzuki , Takashi Kishi
发明人： Akira Tanaka , Yoko Suzuki , Takashi Kishi
IPC分类号： H01L21/673 , C23C16/00
CPC分类号： H01L21/67379 , G03F1/66 , H01L21/67393 , Y10S414/135 , Y10S414/14
摘要： A substrate transport container is used, for example, in the process of manufacturing integrated circuits of less than 0.13 μm line width, can hold the level of contaminants in the interior of the container for at least particles, acidic gases, basic gases, organic substances and humidity at controlled low levels, and has the size and structure to be compatible with automated semiconductor manufacturing plants. The container is provided with a door for loading and unloading substrates on a surface of a container main body and is constructed so as to hold the substrates inside the container main body at a given distance of separation. Air conditioning apparatuses for reducing the levels of particulate and gaseous contaminants are disposed roughly symmetrically on the container main body.
摘要翻译：例如，在制造小于0.13mum线宽的集成电路的过程中使用基板输送容器，可以将至少颗粒，酸性气体，碱性气体，有机物质的容器内部的污染物的水平保持和湿度控制在低水平，并具有与自动半导体制造工厂兼容的尺寸和结构。容器设置有用于在容器主体的表面上装载和卸载基板的门，并且被构造成将基板以给定的间隔保持在容器主体内部。用于降低颗粒状和气态污染物的含量的空气调节装置大致对称地设置在容器主体上。

6. 发明授权

US06547953B2 Substrate container and method of dehumidifying substrate container 失效
标题翻译：底物容器及基体容器除湿方法
公开(公告)号：US06547953B2
公开(公告)日：2003-04-15
申请号：US09769308
申请日：2001-01-26
申请人： Yoko Suzuki , Akira Tanaka , Kazuo Okubo
发明人： Yoko Suzuki , Akira Tanaka , Kazuo Okubo
IPC分类号： B01D5326
CPC分类号： H01L21/67772 , H01L21/67366 , H01L21/67393
摘要： A substrate container includes a container housing having an opening for storing a substrate therethrough and a cover sealingly covering the opening, a fan motor mounted in the container housing for producing a circulating path of air in contact with the substrate in the container housing, and a particle removing filter and a gaseous impurity trapping filter which are disposed in the a portion of the circulating path which extends toward the substrate. A dehumidifying unit for dehumidifying a space in the container housing comprises a solid polymer electrolyte film disposed in the circulating path and voltage applying means for applying a voltage to the solid polymer electrolyte film to decompose water in air flowing in the circulating path thereby to dehumidify a space in the container housing.
摘要翻译：基板容器包括容器壳体，其具有用于存储基板的开口和密封地覆盖开口的盖，安装在容器壳体中的风扇马达，用于产生与容器壳体中的基板接触的空气的循环路径，以及颗粒去除过滤器和气态杂质捕集过滤器，其设置在朝向衬底延伸的循环路径的一部分中。用于除湿容器壳体中的空间的除湿单元包括设置在循环路径中的固体聚合物电解质膜和用于向固体聚合物电解质膜施加电压以分解在循环路径中流动的空气中的水的电压施加装置，从而除湿容器外壳空间。

7. 发明申请

US20050064703A1 Substrate processing method 有权
标题翻译：基板加工方法
公开(公告)号：US20050064703A1
公开(公告)日：2005-03-24
申请号：US10976040
申请日：2004-10-29
申请人： Fumio Kondo , Koji Mishima , Akira Tanaka , Yoko Suzuki , Tetsuji Togawa , Hiroaki Inoue
发明人： Fumio Kondo , Koji Mishima , Akira Tanaka , Yoko Suzuki , Tetsuji Togawa , Hiroaki Inoue
IPC分类号： B65G49/07 , B24B37/04 , B24B49/16 , C23C18/16 , C25D5/00 , C25D5/50 , C25D7/12 , H01L21/00 , H01L21/02 , H01L21/288 , H01L21/304 , H01L21/3205 , H01L21/321 , H01L21/673 , H01L21/677 , H01L21/768 , H01L23/52 , H01L21/4763
CPC分类号： H01L21/67161 , B24B37/005 , B24B37/042 , B24B37/245 , B24B37/345 , B24B41/061 , B24B49/16 , C23C18/1632 , C23C18/1653 , C25D7/123 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67219 , H01L21/6723 , H01L21/67393 , H01L21/67396 , H01L21/67772 , H01L21/7684 , H01L21/76843 , H01L21/76849 , H01L21/76864 , H01L21/76873 , H01L21/76874 , H01L21/76877
摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.
摘要翻译：一种基板处理方法，包括在基板的表面上形成铜膜的步骤。这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异基板的中央部分和周边部分之间的镀膜最小化，并且通过将基板压在抛光表面上来研磨和去除镀膜，其中将基板压在抛光表面上的压力在中心部分和周边部分进行调整。

8. 发明授权

US06521007B1 Clean box 失效
标题翻译：清洁箱
公开(公告)号：US06521007B1
公开(公告)日：2003-02-18
申请号：US09555798
申请日：2000-07-24
申请人： Akira Tanaka , Kazuo Ohkubo , Yoko Suzuki , Hideaki Sekiguchi
发明人： Akira Tanaka , Kazuo Ohkubo , Yoko Suzuki , Hideaki Sekiguchi
IPC分类号： B65D8500
CPC分类号： H01L21/67393
摘要： A cleanbox that can prevent contamination from not only external sources but also from within the cleanbox from such sources as substrates and internal components of the cleanbox, includes a casing container (18) formed by a container main body (12) and a lid member (14) for hermetically sealing a top opening section of the container main body; a dividing wall (20) for forming circulation paths having an upstreaming path and a downstreaming paths within the casing container; a substrate holding section (24) disposed in the upstreaming path for holding broad surfaces of substrates (W) approximately parallel to the upstreaming path; an air filter (26) and a gas removal filter (28) disposed upstream in relation to the substrate holding section in the upstreaming path; and a motor-driven fan (30) housed in the casing container for producing air streams circulating in the circulating paths.
摘要翻译：可以防止不仅来自外部来源的污染物，而且可以防止来自诸如基材和清洁箱的内部部件的清洁箱内的污染物的清洁箱包括由容器主体（12）和盖构件（12）形成的容器（18） 14），用于密封容器主体的顶部开口部分; 用于形成循环路径的分隔壁（20），其具有在所述套管容器内的上游路径和下游路径; 设置在所述上游路径中的用于保持大致平行于所述上游路径的基板（W）的宽表面的基板保持部（24）空气过滤器（26）和气体去除过滤器（28），其相对于所述上游路径中的所述衬底保持部分上游设置; 以及容纳在所述壳体容器中的用于产生在所述循环路径中循环的空气流的电动风扇（30）。

9. 发明授权

US07223690B2 Substrate processing method 有权
标题翻译：基板加工方法
公开(公告)号：US07223690B2
公开(公告)日：2007-05-29
申请号：US10976040
申请日：2004-10-29
申请人： Fumio Kondo , Koji Mishima , Akira Tanaka , Yoko Suzuki , Tetsuji Togawa , Hiroaki Inoue
发明人： Fumio Kondo , Koji Mishima , Akira Tanaka , Yoko Suzuki , Tetsuji Togawa , Hiroaki Inoue
IPC分类号： H01L21/4763 , H01L21/44 , H01L21/48 , H01L21/50
CPC分类号： H01L21/67161 , B24B37/005 , B24B37/042 , B24B37/245 , B24B37/345 , B24B41/061 , B24B49/16 , C23C18/1632 , C23C18/1653 , C25D7/123 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67219 , H01L21/6723 , H01L21/67393 , H01L21/67396 , H01L21/67772 , H01L21/7684 , H01L21/76843 , H01L21/76849 , H01L21/76864 , H01L21/76873 , H01L21/76874 , H01L21/76877
摘要： A substrate processing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.
摘要翻译：一种基板处理方法，包括在基板的表面上形成铜膜的步骤。这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异基板的中心部分和周边部分之间的镀膜最小化，并且通过将基板压在研磨表面上来研磨和去除镀膜，其中将基板压在抛光表面的压力在中心部分和周边部分进行调整。

10. 发明授权

US06828225B2 Substrate processing method 有权
标题翻译：基板加工方法
公开(公告)号：US06828225B2
公开(公告)日：2004-12-07
申请号：US10787218
申请日：2004-02-27
申请人： Fumio Kondo , Koji Mishima , Akira Tanaka , Yoko Suzuki , Tetsuji Togawa , Hiroaki Inoue
发明人： Fumio Kondo , Koji Mishima , Akira Tanaka , Yoko Suzuki , Tetsuji Togawa , Hiroaki Inoue
IPC分类号： H01L214763
CPC分类号： H01L21/67161 , B24B37/005 , B24B37/042 , B24B37/245 , B24B37/345 , B24B41/061 , B24B49/16 , C23C18/1632 , C23C18/1653 , C25D7/123 , H01L21/02074 , H01L21/02087 , H01L21/0209 , H01L21/288 , H01L21/2885 , H01L21/3212 , H01L21/67167 , H01L21/67173 , H01L21/67184 , H01L21/67219 , H01L21/6723 , H01L21/67393 , H01L21/67396 , H01L21/67772 , H01L21/7684 , H01L21/76843 , H01L21/76849 , H01L21/76864 , H01L21/76873 , H01L21/76874 , H01L21/76877
摘要： A substrate procesing method comprising steps for forming a copper film on a surface of a substrate. These steps includes the step of filling a first metal in the trenches so as to form a plated film of the first metal on an entire surface of the substrate by electroplating, wherein the electromagnetic field is adjusted by the virtual anode so that differences of thickness of the plated film between the central portion and the peripheral portion of the substrate being minimized, and polishing and removing the plated film by pressing the substrate to the polishing surface, wherein the pressures pressing the substrate to the polishing surface at a central portion and a peripheral portion are adjusted.
摘要翻译：一种基板处理方法，包括在基板的表面上形成铜膜的步骤。这些步骤包括在沟槽中填充第一金属以便通过电镀在基板的整个表面上形成第一金属的镀膜的步骤，其中电磁场由虚拟阳极调节，使得厚度差异基板的中心部分和周边部分之间的镀膜最小化，并且通过将基板压在研磨表面上来研磨和去除镀膜，其中将基板压在抛光表面的压力在中心部分和周边部分进行调整。

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