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1. 发明授权

US5750223A Polyamideimide inner surface-coated metal container 失效
标题翻译：聚酰胺酰亚胺内表面涂层金属容器
公开(公告)号：US5750223A
公开(公告)日：1998-05-12
申请号：US683205
申请日：1996-07-18
申请人： Akira Tada , Toshihiko Hayashi
发明人： Akira Tada , Toshihiko Hayashi
IPC分类号： B65D83/38 , B32B15/088 , B65D1/12 , B65D25/14 , C09D179/08 , B29D22/00
CPC分类号： C09D179/08 , Y10T428/1355
摘要： An inner surface-coated container and, particularly, an aerosol-container exhibiting intimate adhesiveness to a metallic base material of the container, inertness to the content and excellent resistance against the corrosion. A thermosetting polyamideimide coating material and, particularly, a composition of a carboxyl group-containing polyamideimide resin and a curing agent consisting chiefly of an epoxy resin, is applied to the inner surface of a metallic aerosol container, and the imide group/amide group absorbancy ratio R is set to be not smaller than 2.5.
摘要翻译：特别是内表面包覆的容器，特别是对容器的金属基材表现出亲密的粘合性的气溶胶容器，对内容物的惰性和优异的耐腐蚀性。将热固性聚酰胺酰亚胺涂料，特别是含羧基的聚酰胺酰亚胺树脂和主要由环氧树脂组成的固化剂的组合物施加到金属气溶胶容器的内表面，酰亚胺基/酰胺基吸收比率R设定为不小于2.5。

2. 发明申请

US20090184386A1 SOLID-STATE IMAGE PICKUP DEVICE AND FABRICATION METHOD THEREFOR 有权
标题翻译：固态图像拾取器件及其制造方法
公开(公告)号：US20090184386A1
公开(公告)日：2009-07-23
申请号：US12334229
申请日：2008-12-12
申请人： Yusaku KOBAYASHI , Koji Watanabe , Toshihiko Hayashi
发明人： Yusaku KOBAYASHI , Koji Watanabe , Toshihiko Hayashi
IPC分类号： H01L31/02 , H01L31/18
CPC分类号： H01L27/14623 , H01L27/14609 , H01L27/14636 , H01L27/1464
摘要： Disclosed herein is a solid-state image pickup device, including, a light receiving pixel section, a black level reference pixel section, a multi-layer wiring line section, a first light blocking film, a second light blocking film, a third light blocking film, and a fourth light blocking layer.
摘要翻译：这里公开了一种固体摄像装置，包括：受光像素部分，黑电平参考像素部分，多层布线部分，第一遮光膜，第二遮光膜，第三光阻膜和第四遮光层。

3. 发明授权

US4537159A Coolant reserve tank 失效
标题翻译：冷却液储备罐
公开(公告)号：US4537159A
公开(公告)日：1985-08-27
申请号：US664020
申请日：1984-10-23
申请人： Yoshitomi Matsuzaki , Toshihiko Hayashi , Keizou Kushibiki
发明人： Yoshitomi Matsuzaki , Toshihiko Hayashi , Keizou Kushibiki
IPC分类号： F01P11/00 , F01P11/02 , B65D51/16
CPC分类号： F01P11/029
摘要： A coolant reserve tank comprises a disk-shaped splash-guard member horizontally disposed adjacent an inner end of a coolant reserve chamber vent and having in the upper surface thereof a plurality of grooves only through which the vent opens into the coolant reserve chamber, whereby the waves of the coolant in the chamber are mostly dashed against the lower surface of the splash-guard member and prevented from dashing into the vent to leak out therethrough.
摘要翻译：冷却剂备用箱包括与冷却剂储备室通气口的内端相邻的水平设置的盘形防溅件，并且在其上表面上具有多个槽，通气孔通过该多个凹槽通向冷却剂储备室，由此，腔室中的冷却剂波浪大部分被击穿在防溅部件的下表面上，并防止其冲入通风口以从中泄漏出去。

4. 发明授权

US07612452B2 Method for manufacturing a semiconductor device and semiconductor device 有权
标题翻译：半导体器件和半导体器件的制造方法
公开(公告)号：US07612452B2
公开(公告)日：2009-11-03
申请号：US11850332
申请日：2007-09-05
申请人： Yoshiyuki Ohba , Toshihiko Hayashi
发明人： Yoshiyuki Ohba , Toshihiko Hayashi
IPC分类号： H01L23/52
CPC分类号： H01L21/76831 , H01L21/76826 , H01L21/76835 , H01L21/76844 , H01L21/76864 , H01L21/76867 , H01L21/76873 , H01L23/53238 , H01L23/53295 , H01L2924/0002 , H01L2924/00
摘要： A method for manufacturing a semiconductor device includes: the first step of forming, in an insulating film provided on a substrate, a recess that is porositized at least at inner walls; the second step of forming an alloy layer made of copper and a metal other than copper so as to cover the inner walls of the recess; the third step of burying a conductive layer made primarily of copper in the recess provided with the alloy layer; the fourth step of subjecting the thus treated substrate to thermal treatment to cause the metal in the alloy layer to react with a constituent component of the insulating film to form a barrier film made of a metal compound having Cu diffusion barrier properties.
摘要翻译：一种制造半导体器件的方法包括：第一步骤，在设置在基板上的绝缘膜中形成至少在内壁形成孔的凹部; 形成由铜和铜以外的金属制成的合金层以覆盖凹部的内壁的第二步骤; 在设置有合金层的凹部中埋设主要由铜制成的导电层的第三步骤; 对经过处理的基板进行热处理以使合金层中的金属与绝缘膜的构成成分反应的第四步骤形成由具有Cu扩散阻挡性的金属化合物制成的阻挡膜。

5. 发明申请

US20060019485A1 Multi-layer wiring structure, semiconductor apparatus having multi-layer wiring structure, and methods of manufacturing them 审中-公开
标题翻译：多层布线结构，具有多层布线结构的半导体装置及其制造方法
公开(公告)号：US20060019485A1
公开(公告)日：2006-01-26
申请号：US11186657
申请日：2005-07-19
申请人： Naoki Komai , Toshihiko Hayashi
发明人： Naoki Komai , Toshihiko Hayashi
IPC分类号： H01L21/4763
CPC分类号： H01L21/76835 , H01L21/76811 , H01L21/76813 , H01L21/76814 , H01L21/76831 , H01L21/76844 , H01L21/76862
摘要： A multi-layer wiring structure including an upper layer wiring (second buried wiring) connected to a buried wiring (first buried wiring) in lower layer wiring grooves (first wiring grooves) through connection conductors, wherein a protective film capable of enduring a cleaning treatment with hydrogen radicals or hydrogen plasma applied to the surface of the first buried wiring at the time of forming the connection conductors is formed on the inside surfaces of the wiring grooves to be filled with he second buried wiring and the wiring connection holes to be filled with the connection conductors which surfaces are liable to be eroded upon exposure to the atmosphere used in the cleaning treatment, whereby erosion of the insulation layers at the time of the cleaning is obviated, sufficient cleaning can be performed, and deterioration of characteristics can be improved.
摘要翻译：一种多层布线结构，包括通过连接导体连接到下层布线槽（第一布线槽）中的埋地布线（第一掩埋布线）的上层布线（第二掩埋布线），其中能够承受清洁处理的保护膜在形成连接导体时，在第一埋地布线的表面上施加氢自由基或氢等离子体形成在布线槽的内表面上，并填充第二掩埋布线和要填充的布线连接孔这些连接导体在暴露于清洁处理中使用的气氛时易于被侵蚀，从而消除了清洁时的绝缘层的腐蚀，可以进行充分的清洁，并且可以提高特性的劣化。

6. 发明授权

US4612977A Drain device of automotive radiator 失效
标题翻译：汽车散热器排水装置
公开(公告)号：US4612977A
公开(公告)日：1986-09-23
申请号：US765820
申请日：1985-08-15
申请人： Toshihiko Hayashi , Yoshitomi Matsuzaki
发明人： Toshihiko Hayashi , Yoshitomi Matsuzaki
IPC分类号： B60K11/04 , F01P11/02 , F28F9/00 , F28F9/02 , F16K5/00
CPC分类号： B60K11/04 , F28F2265/06
摘要： A collar member disposed about a drain bore in the radiator. A drain cock is received within the collar member and has a portion which enters the drain hose is fixed to a drain bore of the radiator and seals the drain bore when tightened. An axial groove in the drain cock places the interior of the radiator in communication with a chamber within the collar when the drain cock is loosened, so that fluid may be drained from the radiator through the chamber and the drain hose. A hose holder is connected to a fan shroud to hold a portion of the drain hose in place.
摘要翻译：围绕散热器中的排水孔设置的轴环构件。排水旋塞容纳在轴环构件内并且具有进入排水软管的部分固定到散热器的排水孔并在拧紧时密封排水孔。当排放旋塞松开时，排水旋塞中的轴向凹槽使散热器的内部与轴环内的腔连通，使得流体可以通过腔室和排水软管从散热器排出。软管支架连接到风扇罩以将排水软管的一部分固定到位。

7. 发明授权

US4428494A Easily-openable heat seal lid 失效
标题翻译：易于开启的热封盖
公开(公告)号：US4428494A
公开(公告)日：1984-01-31
申请号：US434726
申请日：1982-10-18
申请人： Kazumi Hirota , Yotaro Tsutsumi , Senji Itoh , Tadahiko Katsura , Kikuo Matsuoka , Ichiro Hori , Toshihiko Hayashi
发明人： Kazumi Hirota , Yotaro Tsutsumi , Senji Itoh , Tadahiko Katsura , Kikuo Matsuoka , Ichiro Hori , Toshihiko Hayashi
IPC分类号： B65D17/28 , B65D20060101 , B65D17/34 , B65D17/347 , B65D17/353 , B65D17/40 , B65D17/42 , B65D17/50 , B65D65/32 , B65D77/30 , B65D85/72
CPC分类号： B65D17/163
摘要： Disclosed is an easily openable heat seal lid for sealing a vessel proper by forming a heat-sealed portion between the lid and the vessel proper, which comprises a laminate comprising at least an inner face member composed of a thermoplastic resin and a metal foil, wherein scores defining a portion to be opened are formed on the side inner than the portion to be heat-sealed so that the scores extend to the midway of the thickness direction of the metal foil, an opening tab is formed on the portion of the lid to be opened through a bonding fulcrum portion composed of a thermoplastic resin hot adhesive so that the push-tearing top end of the opening tab is located on the scores, and the peel strength between the opening tab and the lid in said bonding portion is at least 0.4 Kg/5 mm.
摘要翻译：公开了一种用于通过在盖和容器本体之间形成热密封部分来适当地密封容器的容易打开的热封盖，其包括至少包括由热塑性树脂和金属箔构成的内表面构件的层压体，其中在被热封部分的一侧形成有要打开的部分的分数，使得分数延伸到金属箔的厚度方向的中间，在盖的部分上形成开口凸片，通过由热塑性树脂热粘合剂构成的接合支点部分打开，使得开口舌片的推拉顶端位于刻痕上，并且所述接合部分中的开口接片和盖子之间的剥离强度至少为 0.4公斤/ 5毫米。

8. 发明授权

US08669602B2 Solid-state imaging device, manufacturing method thereof, and electronic apparatus 有权
标题翻译：固态成像装置及其制造方法以及电子装置
公开(公告)号：US08669602B2
公开(公告)日：2014-03-11
申请号：US13362758
申请日：2012-01-31
申请人： Toshihiko Hayashi
发明人： Toshihiko Hayashi
IPC分类号： H01L31/062
CPC分类号： H01L27/14636 , H01L27/1461 , H01L27/14623 , H01L27/14625 , H01L27/14634 , H01L27/1464 , H01L27/14645 , H01L27/14685 , H01L27/1469
摘要： Disclosed herein is a solid-state imaging device including: a laminated semiconductor chip configured to be obtained by bonding two or more semiconductor chip sections to each other and be obtained by bonding at least a first semiconductor chip section in which a pixel array and a multilayer wiring layer are formed and a second semiconductor chip section in which a logic circuit and a multilayer wiring layer are formed to each other in such a manner that the multilayer wiring layers are opposed to each other and are electrically connected to each other; and a light blocking layer configured to be formed by an electrically-conductive film of the same layer as a layer of a connected interconnect of one or both of the first and second semiconductor chip sections near bonding between the first and second semiconductor chip sections. The solid-state imaging device is a back-illuminated solid-state imaging device.
摘要翻译：本文公开了一种固态成像装置，其包括：层叠半导体芯片，其被配置为通过将两个或更多个半导体芯片部彼此接合而获得，并且可以通过至少接合第一半导体芯片部分获得，所述第一半导体芯片部分中的像素阵列和多层形成布线层，其中以多层布线层彼此相对并彼此电连接的方式彼此形成逻辑电路和多层布线层的第二半导体芯片部分; 以及遮光层，被配置为由与第一和第二半导体芯片部分之间接近接合的第一和第二半导体芯片部分之一或两者的连接互连层的相同层的导电膜形成。固态成像装置是背照式固态成像装置。

9. 发明授权

US08564033B2 Solid-state imaging device and method for manufacturing the same 有权
公开(公告)号：US08564033B2
公开(公告)日：2013-10-22
申请号：US12345876
申请日：2008-12-30
申请人： Toshihiko Hayashi , Yoshiharu Kudoh
发明人： Toshihiko Hayashi , Yoshiharu Kudoh
IPC分类号： H01L31/0216
CPC分类号： H01L27/14636 , H01L27/14623 , H01L27/14625 , H01L27/14687 , H01L27/14689 , H01L31/0216 , H01L31/0232 , H01L31/18
摘要： A solid-state imaging device includes: a light-receiving pixel part configured to be formed on a semiconductor substrate; a black-level reference pixel part configured to be formed on the semiconductor substrate; and a multilayer interconnect part configured to be provided over the semiconductor substrate. The multilayer interconnect part includes an insulating layer formed over the semiconductor substrate and metal interconnect layers formed as a plurality of layers in the insulating layer. The multilayer interconnect part has a first light-blocking film formed above an area between first metal interconnects of a first metal interconnect layer as one of the metal interconnect layers above the black-level reference pixel part, and a second light-blocking film that is connected to the first light-blocking film and is formed of a second metal interconnect layer over the first metal interconnect layer.

10. 发明授权

US08373786B2 Solid-state imaging device, manufacturing method thereof, and electronic device 失效
标题翻译：固态成像装置及其制造方法以及电子装置
公开(公告)号：US08373786B2
公开(公告)日：2013-02-12
申请号：US12434340
申请日：2009-05-01
申请人： Yoichi Otsuka , Yoshiyuki Enomoto , Kazunori Nagahata , Tadayuki Kimura , Toshihiko Hayashi , Kenichi Aoyagi , Kiyotaka Tabuchi , Iwao Sugiura , Kensaku Maeda
发明人： Yoichi Otsuka , Yoshiyuki Enomoto , Kazunori Nagahata , Tadayuki Kimura , Toshihiko Hayashi , Kenichi Aoyagi , Kiyotaka Tabuchi , Iwao Sugiura , Kensaku Maeda
IPC分类号： H04N5/335 , H04N9/083 , H01L31/113 , H01L21/311
CPC分类号： H01L27/14625 , G02B5/201 , G02B5/223 , H01L27/14621 , H01L27/14685
摘要： A solid-state imaging device has: an imaging region in which a plurality of pixels each having a photoelectric conversion element are arranged, and a color filter. The color filter includes: filter components of a first color (2G), filter components of a second color (2R) formed by self-alignment and each being surrounded by the filter components of the first color (2G), and filter components of a third color (2B) formed by self-alignment and each being surrounded by the filter components of the first color (2G).
摘要翻译：固态成像装置具有：配置有各自具有光电转换元件的多个像素的成像区域和滤色器。滤色器包括：第一颜色（2G）的滤色镜部件，通过自对准形成的并且由第一颜色（2G）的滤光片部件包围的第二颜色（2R）的滤色镜部件，以及第三颜色（2B）通过自对准形成，并且每个由第一颜色（2G）的滤光器部件包围。

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