专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明授权

US07315070B2 Fingerprint sensor package 有权
标题翻译：指纹传感器包装
公开(公告)号：US07315070B2
公开(公告)日：2008-01-01
申请号：US10960990
申请日：2004-10-12
申请人： Akira Okada , Mitsuru Sato , Hideo Sato
发明人： Akira Okada , Mitsuru Sato , Hideo Sato
IPC分类号： H01L29/84 , G06K9/00
CPC分类号： H01L27/14678 , G06K9/00053 , H01L24/32 , H01L27/14618 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form a curved surface, provided between the LSI chip and the substrate.
摘要翻译：指纹传感器封装包括用于读取指纹的LSI芯片，具有外部连接端子并且LSI芯片被固定的基板，以及用于在LSI芯片变形的状态下固定LSI芯片的芯片固定机构，以便以形成设置在LSI芯片和基板之间的曲面。

2. 发明授权

US07989938B2 Semiconductor device for fingerprint recognition 有权
标题翻译：用于指纹识别的半导体器件
公开(公告)号：US07989938B2
公开(公告)日：2011-08-02
申请号：US12382532
申请日：2009-03-18
申请人： Akira Okada , Mitsuru Sato
发明人： Akira Okada , Mitsuru Sato
IPC分类号： H01L238/48
CPC分类号： G06K9/0002 , H01L2224/05573 , H01L2224/13025 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/1815 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.
摘要翻译：公开了对静电容量原理执行指纹识别的半导体器件。跨越半导体芯片的指纹识别区域的手指提供了正确的指纹识别操作，并提高了可靠性。半导体器件包括具有执行指纹识别的传感器单元的半导体芯片和具有形成在与传感器单元对应的位置的开口的基板。将半导体芯片倒装贴合到基板上，使得传感器单元对应于开口，除了开口的形成位置之外，在半导体芯片和基板之间设置有未填充材料。

3. 发明授权

US07015579B2 Semiconductor device for fingerprint recognition 有权
公开(公告)号：US07015579B2
公开(公告)日：2006-03-21
申请号：US10765999
申请日：2004-01-29
申请人： Akira Okada , Mitsuru Sato
发明人： Akira Okada , Mitsuru Sato
IPC分类号： H01L23/48
CPC分类号： G06K9/0002 , H01L2224/05573 , H01L2224/13025 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/1815 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.

4. 发明申请

US20050263836A1 Fingerprint sensor package 有权
标题翻译：指纹传感器包装
公开(公告)号：US20050263836A1
公开(公告)日：2005-12-01
申请号：US10960990
申请日：2004-10-12
申请人： Akira Okada , Mitsuru Sato , Hideo Sato
发明人： Akira Okada , Mitsuru Sato , Hideo Sato
IPC分类号： G06T1/00 , G06K9/00 , H01L23/12 , H01L29/84 , H04N1/028
CPC分类号： H01L27/14678 , G06K9/00053 , H01L24/32 , H01L27/14618 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/73265 , H01L2924/14 , H01L2924/15311 , H01L2924/181 , H01L2924/1815 , H01L2924/00014 , H01L2924/00
摘要： A fingerprint sensor package includes an LSI chip for reading a fingerprint, a substrate having an external connection terminal and to which the LSI chip is fixed, and a chip fixing mechanism for fixing the LSI chip in a state where the LSI chip is deformed so as to form a curved surface, provided between the LSI chip and the substrate.
摘要翻译：指纹传感器封装包括用于读取指纹的LSI芯片，具有外部连接端子并且LSI芯片被固定的基板，以及用于在LSI芯片变形的状态下固定LSI芯片的芯片固定机构，以便以形成设置在LSI芯片和基板之间的曲面。

5. 发明申请

US20090184408A1 Semiconductor device for fingerprint recognition 有权
标题翻译：用于指纹识别的半导体器件
公开(公告)号：US20090184408A1
公开(公告)日：2009-07-23
申请号：US12382532
申请日：2009-03-18
申请人： Akira Okada , Mitsuru Sato
发明人： Akira Okada , Mitsuru Sato
IPC分类号： H01L23/00 , H01L23/48
CPC分类号： G06K9/0002 , H01L2224/05573 , H01L2224/13025 , H01L2224/16225 , H01L2224/32225 , H01L2224/45144 , H01L2224/48091 , H01L2224/48227 , H01L2224/4824 , H01L2224/73204 , H01L2224/73265 , H01L2924/00014 , H01L2924/1815 , H01L2924/00 , H01L2224/05599
摘要： A semiconductor device is disclosed that performs fingerprint recognition on the electrostatic-capacity principle. A finger sweeping across a fingerprint recognition area of a semiconductor chip provides positive fingerprint recognition operations with improved reliability.The semiconductor device includes the semiconductor chip having a sensor unit that performs fingerprint recognition, and a substrate having an opening formed in the position corresponding to the sensor unit. The semiconductor chip is flip chip bonded to the substrate such that the sensor unit corresponds to the opening, and except for the formed position of the opening, an under-fill material is provided between the semiconductor chip and the substrate.
摘要翻译：公开了对静电容量原理执行指纹识别的半导体器件。跨越半导体芯片的指纹识别区域的手指提供了正确的指纹识别操作，并提高了可靠性。半导体器件包括具有执行指纹识别的传感器单元的半导体芯片和具有形成在与传感器单元对应的位置的开口的基板。将半导体芯片倒装贴合到基板上，使得传感器单元对应于开口，除了开口的形成位置之外，在半导体芯片和基板之间设置有未填充材料。

6. 发明授权

US09076820B2 Method for manufacturing semiconductor device and semiconductor device 有权
标题翻译：半导体器件和半导体器件的制造方法
公开(公告)号：US09076820B2
公开(公告)日：2015-07-07
申请号：US13600373
申请日：2012-08-31
申请人： Soichiro Kitazaki , Masaru Kidoh , Mitsuru Sato , Ryota Katsumata , Tadashi Iguchi
发明人： Soichiro Kitazaki , Masaru Kidoh , Mitsuru Sato , Ryota Katsumata , Tadashi Iguchi
IPC分类号： H01L27/115 , H01L29/66 , H01L29/78
CPC分类号： H01L29/66666 , H01L27/11565 , H01L27/11582 , H01L29/7827
摘要： According to one embodiment, a method for manufacturing a semiconductor device includes forming a plurality of insulating isolation sections provided so as to extend in a first direction, isolate the stacked body in a second direction, and have a projection projecting from the stacked body. Each insulating isolation section has a side wall including recessed sections and projected sections repeated along the first direction. The method includes forming a sidewall film on a side wall of the projection of the insulating isolation section, and forming a plurality of first holes surrounded by the sidewall film and isolated by the sidewall film in the first direction, between the plurality of insulating isolation sections. The method includes forming a second hole in the stacked body provided under the first hole by etching with the insulating isolation section and the sidewall film used as a mask.
摘要翻译：根据一个实施例，一种用于制造半导体器件的方法包括形成多个绝缘隔离部分，其被设置为沿第一方向延伸，使堆叠体沿第二方向隔离，并具有从堆叠体突出的突出部。每个绝缘隔离部分具有侧壁，该侧壁包括沿着第一方向重复的凹陷部分和突出部分。该方法包括在绝缘隔离部分的突起的侧壁上形成侧壁膜，并且在多个绝缘隔离部分之间形成由侧壁膜围绕并由第一方向隔离的多个第一孔。该方法包括通过用绝缘隔离部分和用作掩模的侧壁膜进行蚀刻，在设置在第一孔下方的层叠体中形成第二孔。

7. 发明授权

US08867369B2 Input/output connection device, information processing device, and method for inspecting input/output device 有权
标题翻译：输入/输出连接装置，信息处理装置和检测输入/输出装置的方法
公开(公告)号：US08867369B2
公开(公告)日：2014-10-21
申请号：US13047137
申请日：2011-03-14
申请人： Mitsuru Sato
发明人： Mitsuru Sato
IPC分类号： H04L12/26 , G06F13/42 , G06F13/20 , G06F3/00
CPC分类号： G06F13/4295
摘要： An input/output connection device includes a generating section which generates an inspection packet that has a tag that uniquely identifies the packet, a transmitting section which transmits the inspection packet to the input/output device, a receiving section which receives a packet, a first determining section which determines, on the basis of a tag of the packet received by the receiving section, whether or not the received packet is a packet transmitted in response to the inspection packet transmitted by the transmitting section, and a second determining section which analyzes the received packet and determines whether or not the input/output device is normal when the first determining section determines that the received packet is the packet transmitted in response to the inspection packet.
摘要翻译：一种输入/输出连接装置，包括：生成部，其生成具有唯一地识别分组的标签的检查分组;将检查分组发送到输入/输出装置的发送部;接收分组的接收部; 确定部，其基于由所述接收部接收到的分组的标签，确定所接收的分组是否是响应于由所述发送部发送的所述检查分组而发送的分组;以及第二确定部，并且当第一确定部确定接收到的分组是响应于检查分组而发送的分组时，确定输入/输出设备是否正常。

8. 发明授权

US08598640B2 Solid-state imaging device 有权
标题翻译：固态成像装置
公开(公告)号：US08598640B2
公开(公告)日：2013-12-03
申请号：US13211362
申请日：2011-08-17
申请人： Yoshiaki Kitano , Hideshi Abe , Jun Kuroiwa , Kiyoshi Hirata , Hiroaki Ohki , Nobuhiro Karasawa , Ritsuo Takizawa , Mitsuru Yamashita , Mitsuru Sato , Katsunori Kokubun
发明人： Yoshiaki Kitano , Hideshi Abe , Jun Kuroiwa , Kiyoshi Hirata , Hiroaki Ohki , Nobuhiro Karasawa , Ritsuo Takizawa , Mitsuru Yamashita , Mitsuru Sato , Katsunori Kokubun
IPC分类号： H01L31/113 , H01L27/146
CPC分类号： H01L27/14601 , H01L27/14689 , H01L27/14806 , H04N5/335
摘要： A solid-state imaging device with a structure such that an electrode for reading a signal charge is provided on one side of a light-receiving sensor portion constituting a pixel; a predetermined voltage signal V is applied to a light-shielding film formed to cover an image pickup area except the light-receiving sensor portion; a second-conductivity-type semiconductor area is formed in the center on the surface of a first-conductivity-type semiconductor area constituting a photo-electric conversion area of the light-receiving sensor portion; and areas containing a lower impurity concentration than that of the second-conductivity-type semiconductor area is formed on the surface of the first-conductivity-type semiconductor area at the end on the side of the electrode and at the opposite end on the side of a pixel-separation area.
摘要翻译：具有这样一种结构的固态成像装置，该结构使得用于读取信号电荷的电极设置在构成像素的光接收传感器部分的一侧; 将预定的电压信号V施加到形成为覆盖除了光接收传感器部分之外的图像拾取区域的遮光膜; 第二导电型半导体区域形成在构成光接收传感器部分的光电转换区域的第一导电型半导体区域的表面上的中心; 并且在第一导电型半导体区域的电极侧的端部的表面上形成比第二导电型半导体区域的杂质浓度低的区域，像素分离区域。

9. 发明授权

US08558208B2 Resistance random access memory including variable-resistance layers 有权
标题翻译：电阻随机存取存储器包括可变电阻层
公开(公告)号：US08558208B2
公开(公告)日：2013-10-15
申请号：US13097375
申请日：2011-04-29
申请人： Ryota Fujitsuka , Masahiro Kiyotoshi , Katsuyuki Sekine , Mitsuru Sato
发明人： Ryota Fujitsuka , Masahiro Kiyotoshi , Katsuyuki Sekine , Mitsuru Sato
IPC分类号： H01L29/02
CPC分类号： H01L45/146 , G11C11/5685 , G11C13/0007 , G11C2213/72 , H01L45/1233
摘要： According to one embodiment, there are provided a first electrode, a second electrode, first and second variable-resistance layers that are arranged between the first electrode and the second electrode, and at least one non variable-resistance layer that is arranged so that positions of the first and second variable-resistance layers between the first electrode and the second electrode are symmetrical to each other.
摘要翻译：根据一个实施例，提供了布置在第一电极和第二电极之间的第一电极，第二电极，第一和第二可变电阻层，以及至少一个非可变电阻层，其被布置成使得位置在第一电极和第二电极之间的第一和第二可变电阻层彼此对称。

10. 发明授权

US08517519B2 Liquid droplet ejection head and liquid droplet ejection apparatus 有权
标题翻译：液滴喷射头和液滴喷射装置
公开(公告)号：US08517519B2
公开(公告)日：2013-08-27
申请号：US13104268
申请日：2011-05-10
申请人： Mitsuru Sato , Takatoshi Yamamoto
发明人： Mitsuru Sato , Takatoshi Yamamoto
IPC分类号： B41J2/045
CPC分类号： B41J2/1433 , B41J2/14274 , B41J2/1612 , B41J2/162 , B41J2/1623 , B41J2/1645 , B41J2/1646
摘要： An ink jet type recording head includes a substrate, a nozzle plate having nozzles, and a sealing sheet, and the substrate and the nozzle plate are bonded to each other through a bonding film, and the substrate and the sealing sheet are bonded to each other through a bonding film. These bonding films are each obtained by drying and/or curing a liquid material containing an epoxy-modified silicone material. Further, by applying energy to each bonding film, the surface thereof is activated, and therefore, each bonding film exhibits a bonding property. By this bonding property, the substrate is bonded to the nozzle plate and to the sealing sheet.
摘要翻译：喷墨型记录头包括基板，具有喷嘴的喷嘴板和密封片，并且基板和喷嘴板通过接合膜彼此接合，并且基板和密封片彼此接合通过粘合膜。这些接合膜各自通过干燥和/或固化含有环氧改性的有机硅材料的液体材料而获得。此外，通过向每个接合膜施加能量，其表面被激活，因此每个接合膜都具有接合性。通过这种粘合特性，将基板粘合到喷嘴板和密封片上。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式