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    • 5. 发明授权
    • Laser light source module
    • 激光光源模块
    • US08233512B2
    • 2012-07-31
    • US12740055
    • 2007-12-21
    • Motoaki TamayaKeiichi FukudaShinichi OeChise NanbaAkira Nakamura
    • Motoaki TamayaKeiichi FukudaShinichi OeChise NanbaAkira Nakamura
    • H01S3/04
    • H01S5/02276H01L2224/48091H01L2224/49175H01S5/0224H01S5/02272H01S5/02492H01S5/4031H01L2924/00014
    • A heat sink is made of a material excellent in thermal conductivity and is mounted on a stem; a sub-mount substrate is made of a material excellent in insulation property and is mounted on the heat sink; a first lead frame made of a material excellent in electric conductivity and thermal conductivity and having a linear expansion coefficient similar to that of a semiconductor laser array, is mounted on the sub-mount substrate, having the semiconductor laser array mounted thereon, and composing a power feeding path of the semiconductor laser array; a second lead frame made of a material excellent in electric conductivity and thermal conductivity, is arranged on the sub-mount substrate side by side with the first lead frame, and composing the power feeding path of the semiconductor laser array; and a wire electrically bonds the semiconductor laser array and the second lead frame.
    • 散热器由导热性优异的材料制成,并安装在杆上; 副安装基板由绝缘性优异的材料制成,并安装在散热片上; 由导电性和导热性优异的材料制成的具有类似于半导体激光器阵列的线性膨胀系数的第一引线框安装在安装有半导体激光器阵列的子安装基板上,并组成 半导体激光器阵列的馈电路径; 由导电性和导热性优异的材料构成的第二引线框架与第一引线框并排配置在副安装基板上,构成半导体激光器阵列的馈电路径; 并且导线将半导体激光器阵列和第二引线框架电连接。
    • 8. 发明申请
    • SEMICONDUCTOR LASER MODULE
    • 半导体激光模块
    • US20120177076A1
    • 2012-07-12
    • US13496147
    • 2010-01-27
    • Motoaki TamayaAkira NakamuraChise Nanba
    • Motoaki TamayaAkira NakamuraChise Nanba
    • H01S5/02
    • H01S5/02212H01L23/10H01L2924/0002H01R4/58H01R13/03H01S5/0222H01S5/02236H01L2924/00
    • A semiconductor laser module includes: a semiconductor laser element which emits light; a package base having a through hole; a lead pin which passes through the through hole and supplies the current to the semiconductor laser element; a glass material which seals the through hole through which the lead pin passes; and a cap which has a window from which light emitted by the semiconductor laser element is taken out and has the semiconductor laser element in the inside thereof, the cap being joined in air sealing relation to the package base. The lead pin is an iron-nickel alloys in which the coefficient of linear expansion is not higher than a predetermined ratio in difference with the glass material, the saturation magneto-striction constant is not higher than a predetermined value, and volume resistivity is not higher than a predetermined rate.
    • 半导体激光器模块包括:发光的半导体激光元件; 具有通孔的封装基座; 引脚,其穿过所述通孔并将电流提供给所述半导体激光元件; 密封引脚通过的通孔的玻璃材料; 以及盖,其具有从该半导体激光元件发出的光被取出并且在其内部具有半导体激光元件的窗口,该盖与封装基座空气密封地接合。 引脚是铁 - 镍合金,其中线膨胀系数不高于与玻璃材料不同的预定比例,饱和磁致伸缩常数不高于预定值,体积电阻率不高 比预定速率。