专利快速检索-快速检索全球专利，免费商用专利数据库-IPRDB

1. 发明申请

US20110089558A1 SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF 审中-公开
标题翻译：半导体器件及其制造方法
公开(公告)号：US20110089558A1
公开(公告)日：2011-04-21
申请号：US12906122
申请日：2010-10-17
申请人： Akira MUTO , Akira Mishima , Takuro Kanazawa , Ochi Kentaro , Tetsuo Iijima , Katsuo Ishizaka
发明人： Akira MUTO , Akira Mishima , Takuro Kanazawa , Ochi Kentaro , Tetsuo Iijima , Katsuo Ishizaka
IPC分类号： H01L23/36 , H01L21/50 , H01L23/50
CPC分类号： H01L25/072 , H01L23/3121 , H01L24/37 , H01L24/40 , H01L25/115 , H01L25/16 , H01L2224/32225 , H01L2224/37147 , H01L2224/40095 , H01L2224/40137 , H01L2224/73221 , H01L2224/83801 , H01L2224/84801 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01019 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01041 , H01L2924/01058 , H01L2924/01074 , H01L2924/01082 , H01L2924/01087 , H01L2924/014 , H01L2924/09701 , H01L2924/12036 , H01L2924/13055 , H01L2924/1306 , H01L2924/15747 , H01L2924/181 , H01L2924/1815 , H01L2924/00 , H01L2924/00012 , H01L2924/00014
摘要： There is provided a technology capable of reducing the mounting burden on the part of a customer which is a recipient of a package. Over a metal board, a single package and another single package are mounted together via an insulation adhesion sheet, thereby to form one composite package. As a result, as compared with the case where six single packages are mounted, the number of packages to be mounted is smaller in the case where three sets of the composite packages are mounted. This can reduce the mounting burden on the part of a customer.
摘要翻译：提供了能够减少作为包装的接收者的顾客的部分的安装负担的技术。在金属板上，单个包装和另一个单一包装通过绝缘粘合片安装在一起，从而形成一个复合包装。结果，与安装六个单个包装件的情况相比，在安装三组复合包装的情况下，要安装的包装件的数量较小。这可以减少客户的安装负担。

2. 发明申请

US20120012978A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20120012978A1
公开(公告)日：2012-01-19
申请号：US13244133
申请日：2011-09-23
申请人： Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人： Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号： H01L23/48
CPC分类号： H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
摘要翻译：提供了通过使用半导体封装形成的半导体器件。半导体器件包括在感应导体上相邻布置的两个半导体封装。两个半导体封装的端子由第三引线连接。第三引线被布置成基本上平行于感应导体。接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。

3. 发明授权

US07872348B2 Semiconductor device 有权
公开(公告)号：US07872348B2
公开(公告)日：2011-01-18
申请号：US12797317
申请日：2010-06-09
申请人： Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人： Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号： H01L23/34
CPC分类号： H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.

4. 发明授权

US08035222B2 Semiconductor device 有权
标题翻译：半导体器件
公开(公告)号：US08035222B2
公开(公告)日：2011-10-11
申请号：US12968534
申请日：2010-12-15
申请人： Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人： Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号： H01L23/34
CPC分类号： H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
摘要翻译：提供了通过使用半导体封装形成的半导体器件。半导体器件包括在感应导体上相邻布置的两个半导体封装。两个半导体封装的端子由第三引线连接。第三引线被布置成基本上平行于感应导体。接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。

5. 发明授权

US08466549B2 Semiconductor device for power conversion 有权
标题翻译：用于电力转换的半导体器件
公开(公告)号：US08466549B2
公开(公告)日：2013-06-18
申请号：US13244133
申请日：2011-09-23
申请人： Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人： Kentaro Ochi , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号： H01L23/34
CPC分类号： H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. The third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
摘要翻译：提供了通过使用半导体封装形成的半导体器件。半导体器件包括在感应导体上相邻布置的两个半导体封装。两个半导体封装的端子由第三引线连接。第三引线被布置成基本上平行于感应导体。接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。

6. 发明申请

US20110084359A1 SEMICONDUCTOR DEVICE 有权
标题翻译：半导体器件
公开(公告)号：US20110084359A1
公开(公告)日：2011-04-14
申请号：US12968534
申请日：2010-12-15
申请人： Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
发明人： Kentaro OCHI , Akira Mishima , Takuro Kanazawa , Tetsuo Iijima , Katsuo Ishizaka , Norio Kido
IPC分类号： H01L23/495
CPC分类号： H01L23/3107 , H01L23/49568 , H01L23/49575 , H01L24/33 , H01L25/115 , H01L2224/32245 , H01L2924/1301 , H01L2924/181 , H01L2924/19041 , H01L2924/00 , H01L2924/00012
摘要： A semiconductor device formed by using semiconductor packages is provided. The semiconductor device includes two semiconductor packages adjacently arranged in opposite directions on an inductive conductor. Terminals of the two semiconductor packages are joined by a third lead. the third lead is arranged substantially in parallel to the inductive conductor. Leads at the joint portions have, for example, a bent structure, and the third lead is arranged to be close to the inductive conductor.
摘要翻译：提供了通过使用半导体封装形成的半导体器件。半导体器件包括在感应导体上相邻布置的两个半导体封装。两个半导体封装的端子由第三引线连接。第三引线被布置成基本上平行于感应导体。接头部分处的引线例如具有弯曲结构，并且第三引线布置成靠近感应导体。

7. 发明申请

US20100052449A1 Control Device for Electrically Operated Power Steering System 有权
标题翻译：电动动力转向系统控制装置
公开(公告)号：US20100052449A1
公开(公告)日：2010-03-04
申请号：US12473662
申请日：2009-05-28
申请人： Manabu Hashimoto , Akira Mishima , Kentaro Ochi , Takuro Kanazawa
发明人： Manabu Hashimoto , Akira Mishima , Kentaro Ochi , Takuro Kanazawa
IPC分类号： H02K5/22
CPC分类号： B62D5/0406
摘要： A control device for an electrically operated power steering system includes: a power substrate comprising a plurality of switching elements, that converts DC electrical current to AC electrical current by switching operation of the plurality of switching elements; an output terminal for transmitting the AC electrical current to an electric motor that generates steering torque; a conductor for electrically connecting the power substrate to the output terminal; a metallic chassis that holds the power substrate and the conductor, and supports the output terminal; and a metallic cover that faces the output terminal, and that is connected to the metallic chassis.
摘要翻译：一种用于电动动力转向系统的控制装置，包括：电源基板，包括多个开关元件，通过切换多个开关元件的操作将直流电流转换成交流电流; 用于将AC电流传输到产生转向转矩的电动机的输出端子; 用于将电源基板电连接到输出端子的导体; 金属底盘，其保持电源基板和导体，并支撑输出端子; 以及面向输出端子并且连接到金属底盘的金属盖。

8. 发明申请

US20110221268A1 Power Converter and In-Car Electrical System 审中-公开
标题翻译：电力转换器和车载电气系统
公开(公告)号：US20110221268A1
公开(公告)日：2011-09-15
申请号：US13125514
申请日：2009-10-22
申请人： Takuro Kanazawa , Akira Mishima , Kentaro Ochi
发明人： Takuro Kanazawa , Akira Mishima , Kentaro Ochi
IPC分类号： H05K7/00 , B60L1/00
CPC分类号： H05K1/0263 , H01L25/16 , H01L2924/0002 , H02M7/003 , H05K1/116 , H05K3/325 , H05K2201/09063 , H05K2201/09309 , H05K2201/09481 , H05K2201/0979 , H05K2201/10272 , H05K2201/10409 , H01L2924/00
摘要： Downsizing, cost reduction, and a low inductance of an input/output circuit are to be achieved with a power converter in which a multilayer board having a power semiconductor module 500 and busbars 11, 12 is modularized. The positive busbar 11 and the negative busbar 12 for feeding main circuit current are provided on a surface of the multilayer board 100 on which a control device 10a is mounted. The positive busbar 11 and the negative busbar 12 are formed to be thicker that the metal layer wiring in each layer of the multilayer board 100. The positive busbar 11 is electrically connected to the 2nth layer wiring (n represents a positive integer) from the positive surface wiring of the multilayer board 100, and the negative busbar 12 to the 2n+1th layer wiring opposite to the 2nth layer wiring of the multilayer board 100, through via holes. As a result, current flows into the power semiconductor module 500 in opposite directions through the 2nth layer wiring and the 2n+1th layer wiring. Thus the inductance of the main circuit is reduced, and downsizing and cost reduction of the high-output power converter energized by a large current can be achieved.
摘要翻译：使用具有功率半导体模块500和母线11,12的多层板模块化的功率转换器来实现输入/输出电路的小型化，降低成本和低电感。用于馈送主电路电流的正母线11和负母线12设置在安装有控制装置10a的多层板100的表面上。正母线11和负母线12形成为使得多层板100的每层中的金属层布线更厚。正母线11从正极母线11与第2n层布线（n表示正整数）电连接通过通孔将多层基板100和负母线12的表面布线连接到与多层基板100的第2n层布线相反的2n + 1层布线。结果，电流通过第2n层布线和2n + 1层布线沿相反方向流入功率半导体模块500。因此，主电路的电感减小，并且可以实现由大电流激励的高输出功率转换器的小型化和成本降低。

9. 发明授权

US07989997B2 Control device for electrically operated power steering system 有权
标题翻译：电动助力转向系统的控制装置
公开(公告)号：US07989997B2
公开(公告)日：2011-08-02
申请号：US12473662
申请日：2009-05-28
申请人： Manabu Hashimoto , Akira Mishima , Kentaro Ochi , Takuro Kanazawa
发明人： Manabu Hashimoto , Akira Mishima , Kentaro Ochi , Takuro Kanazawa
IPC分类号： H02K11/00
CPC分类号： B62D5/0406
摘要： A control device for an electrically operated power steering system includes: a power substrate comprising a plurality of switching elements, that converts DC electrical current to AC electrical current by switching operation of the plurality of switching elements; an output terminal for transmitting the AC electrical current to an electric motor that generates steering torque; a conductor for electrically connecting the power substrate to the output terminal; a metallic chassis that holds the power substrate and the conductor, and supports the output terminal; and a metallic cover that faces the output terminal, and that is connected to the metallic chassis.
摘要翻译：一种用于电动动力转向系统的控制装置，包括：电源基板，包括多个开关元件，通过切换多个开关元件的操作将直流电流转换成交流电流; 用于将AC电流传输到产生转向转矩的电动机的输出端子; 用于将电源基板电连接到输出端子的导体; 金属底盘，其保持电源基板和导体，并支撑输出端子; 以及面向输出端子并且连接到金属底盘的金属盖。

10. 发明申请

US20140200845A1 Numerical Analysis System 审中-公开
标题翻译：数值分析系统
公开(公告)号：US20140200845A1
公开(公告)日：2014-07-17
申请号：US14239403
申请日：2011-08-24
申请人： Kiyomi Yoshinari , Takuro Kanazawa
发明人： Kiyomi Yoshinari , Takuro Kanazawa
IPC分类号： G01N25/18
CPC分类号： G01N25/18 , G06F17/5018 , G06F2217/80
摘要： It is an object of the present invention to analyze heat transfers with a high degree of precision at a computation cost within a realistic range for a large-scale object such as an entire power-electronic system. In order to solve the problems described above, the present invention provides a numerical analysis system based mainly on a configuration for dividing the analysis area into at least two division areas, for analyzing at least one of the division areas by adoption of a finite element method or a boundary element method and for carrying out an analysis by adoption of a technique based on equivalent circuit approximation for at least one of the other division areas.
摘要翻译：本发明的目的是在诸如整个电力电子系统的大型物体的实际范围内以高精确度的分析热传递。为了解决上述问题，本发明提供一种数值分析系统，其主要基于将分析区域分割为至少两个分割区域的结构，用于通过采用有限元法分析至少一个分割区域或边界元素方法，并且用于通过采用基于对于其他分割区域中的至少一个的等效电路近似的技术进行分析。

你已经成功收藏专利！

检索式保存成功!

IPRDB

热门服务

关于我们

友情链接

联系方式