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1. 发明授权

US5580471A Apparatus and method for material treatment and inspection using fiber-coupled laser diode 失效
标题翻译：使用光纤耦合激光二极管进行材料处理和检验的装置和方法
公开(公告)号：US5580471A
公开(公告)日：1996-12-03
申请号：US220119
申请日：1994-03-30
申请人： Akira Fukumoto , Paul Laferriere , Abdelkrim Tatah
发明人： Akira Fukumoto , Paul Laferriere , Abdelkrim Tatah
IPC分类号： B23K26/03 , B23K26/04 , B23K26/42 , G02B6/36 , G02B6/42 , B23K26/02 , B23K26/08
CPC分类号： B23K26/032 , B23K26/034 , B23K26/04 , B23K26/702 , G02B6/3636 , G02B6/4249 , G02B6/3652 , G02B6/3676 , G02B6/3692 , G02B6/422
摘要： Apparatus and method for the precision treatment of a material using a semiconductor diode for generating a plurality of laser light beams, optical fibers coupled to the diode for transmitting and combining the light beams, and a scanner for scanning the combined light beams onto the material to be treated. Also, channels micromachined onto a fixture are provided for supporting the fibers in optimum alignment with the diode. Also provided are a camera and a thermal image capturing system for generating optical and thermal images of the material. An image processing unit is provided for receiving and processing the image to generate and transmit control signals to a diode controller to control intensity and timing of the light beams, and to a controller of the scanner to control positioning of the scanner to deflect the laser beam over the material as desired.
摘要翻译：用于使用半导体二极管精密处理产生多个激光束的装置和方法，耦合到用于传输和组合光束的二极管的光纤，以及用于将组合的光束扫描到材料上的扫描仪被处理。此外，微机械加工到夹具上的通道被提供用于支撑与二极管最佳对准的纤维。还提供了用于产生材料的光学和热图像的相机和热图像捕获系统。提供图像处理单元，用于接收和处理图像以产生并发送控制信号到二极管控制器以控制光束的强度和定时，以及扫描仪的控制器，以控制扫描仪的定位以偏转激光束在所需的材料上。

2. 发明授权

US5786560A 3-dimensional micromachining with femtosecond laser pulses 失效
标题翻译：飞秒激光脉冲的三维微加工
公开(公告)号：US5786560A
公开(公告)日：1998-07-28
申请号：US874775
申请日：1997-06-13
申请人： Abdelkrim Tatah , Akira Fukumoto
发明人： Abdelkrim Tatah , Akira Fukumoto
IPC分类号： B23K26/06 , B23K26/067
CPC分类号： B23K26/0057 , B23K26/0604 , B23K26/0613 , B23K26/0624 , B23K26/066 , B23K26/067 , C03C23/0025
摘要： A method of treating a material by generating an ultraviolet wavelength laser beam having femtosecond pulses; splitting the ultraviolet wavelength laser beam into a plurality of separate laser beams having femtosecond pulses; directing the separate laser beams onto a target point within a sample such that the femtosecond pulses of the separate beams overlap to create an intensity sufficient to treat the sample. Apparatus for treating a material that includes an ultraviolet laser for generating an ultraviolet wavelength laser beam having femtosecond pulse and directing that ultraviolet wavelength laser beam onto a beam splitter; a beam splitter for splitting the ultraviolet wave length laser beam into a plurality of separate laser beams having femtosecond pulses; directing the separate laser beams onto a target point within a sample such that the femtosecond pulses of the separate beams overlap to create an intensity sufficient to treat the sample.
摘要翻译：一种通过产生具有飞秒脉冲的紫外线波长激光束来处理材料的方法; 将紫外线波长激光束分裂成具有飞秒脉冲的多个分离的激光束; 将单独的激光束引导到样品内的目标点上，使得分离光束的飞秒脉冲重叠以产生足以处理样品的强度。一种用于处理包括用于产生具有飞秒脉冲的紫外线波长激光束并将紫外线波长激光束引导到分束器上的紫外激光的材料的设备; 用于将紫外线波长激光束分裂为具有飞秒脉冲的多个分离的激光束的分束器; 将单独的激光束引导到样品内的目标点上，使得分离光束的飞秒脉冲重叠以产生足以处理样品的强度。

3. 发明授权

US06347171B1 Method and apparatus for forming a diffraction grating 有权
$Method and apparatus for forming a diffraction grating$
标题翻译：用于形成衍射光栅的方法和装置
公开(公告)号：US06347171B1
公开(公告)日：2002-02-12
申请号：US09281908
申请日：1999-03-31
申请人： Abdelkrim Tatah , Xinbing Liu
发明人： Abdelkrim Tatah , Xinbing Liu
IPC分类号： G02B634
CPC分类号： G02B6/02133 , G02B6/02138
摘要： A method for forming a diffraction grating in an optical fiber. First and second ultrashort laser pulses are generated. The first and second ultrashort laser pulses are directed to intersect and form an interference pattern. The interference pattern includes periodic intensity variations which cause corresponding periodic changes in an index of refraction of the optical fiber. The ultrashort laser pulses and the optical fiber are configured to be self-focused by the cladding and core of the optical fiber.
摘要翻译：一种在光纤中形成衍射光栅的方法。产生第一和第二超短激光脉冲。第一和第二超短激光脉冲指向相交并形成干涉图案。干涉图案包括导致光纤的折射率相应的周期性变化的周期性强度变化。超短激光脉冲和光纤被配置为通过光纤的包层和芯自聚焦。

4. 发明授权

US06355908B1 Method and apparatus for focusing a laser 有权
标题翻译：用于聚焦激光的方法和装置
公开(公告)号：US06355908B1
公开(公告)日：2002-03-12
申请号：US09282722
申请日：1999-03-31
申请人： Abdelkrim Tatah , Xinbing Liu
发明人： Abdelkrim Tatah , Xinbing Liu
IPC分类号： B23K2600
CPC分类号： B23K26/04 , B23K26/0624
摘要： A method for focusing an ultrashort pulse laser relative to a workpiece using the position of a plasma formed by a laser. A laser beam is focused to a focal point. The high peak intensity of the ultrashort pulse laser ionizes air at the focal region to form a plasma. The intensity of the plasma varies as its position relative to the workpiece varies. The intensity of the plasma formed by the focused laser beam is detected. The position of the focal point relative to the workpiece is adjusted responsive to the detected intensity of the plasma.
摘要翻译：使用由激光器形成的等离子体的位置来相对于工件聚焦超短脉冲激光的方法。激光束聚焦到焦点。超短脉冲激光器的高峰值强度使焦点区域的空气电离，形成等离子体。随着其相对于工件的位置变化，等离子体的强度变化。检测由聚焦激光束形成的等离子体的强度。响应于检测到的等离子体的强度来调整焦点相对于工件的位置。

5. 发明授权

US5683601A Laser ablation forward metal deposition with electrostatic assisted bonding 失效
标题翻译：激光消融正向金属沉积与静电辅助键合
公开(公告)号：US5683601A
公开(公告)日：1997-11-04
申请号：US643739
申请日：1996-05-06
申请人： Abdelkrim Tatah
发明人： Abdelkrim Tatah
IPC分类号： C23C14/04 , C23C14/28 , H05K3/14 , B23K26/00
CPC分类号： C23C14/28 , C23C14/048 , H05K3/14
摘要： Apparatus and method for metal line deposition on a substrate. Laser ablation of a metal film coated on a first substrate removes metal ions from the film. The ions travel forward to a surface of a second substrate disposed opposite the metal film on the first substrate and are deposited on the second substrate. A positive electrode on the first substrate, a negative electrode on the second substrate, and a power supply create an electric field that is simultaneously applied across the first and second substrates. The positively charged ions in the second substrate migrate toward the negative electrode of the electric field, leaving a surplus of negatively charged ions at the surface of the second substrate. The negative ions in the second substrate electrostatically bond with the positively charged ablated metal ions, thereby assisting the bonding of metal lines to the substrate. The power of the laser used during ablation and the position of a sample stage on which the second substrate is supported may be controlled by a computer to deposit metal line patterns on the second substrate.
摘要翻译：金属线沉积在基板上的装置和方法。涂覆在第一衬底上的金属膜的激光烧蚀从膜去除金属离子。离子向前行进到与第一基板上的金属膜相对设置的第二基板的表面，并且沉积在第二基板上。第一基板上的正电极，第二基板上的负电极和电源产生同时施加在第一和第二基板上的电场。第二衬底中带正电的离子朝向电场的负极迁移，在第二衬底的表面留下剩余的带负电荷的离子。第二衬底中的负离子与带正电的烧蚀金属离子静电键合，从而有助于金属线与衬底的结合。在消融期间使用的激光的功率和其上支撑第二衬底的样品台的位置可以由计算机控制以在第二衬底上沉积金属线图案。

6. 发明授权

US6060127A Mechanically restricted laser deposition 失效
标题翻译：机械限制激光沉积
公开(公告)号：US6060127A
公开(公告)日：2000-05-09
申请号：US52773
申请日：1998-03-31
申请人： Abdelkrim Tatah , Makoto Ishizuka
发明人： Abdelkrim Tatah , Makoto Ishizuka
IPC分类号： C23C14/04 , C23C14/28 , H01L21/3205 , H05K3/04 , H05K3/20 , H05B7/00
CPC分类号： H05K3/046 , C23C14/048 , C23C14/28 , H01L21/32051 , H05K3/20
摘要： An apparatus for metal line deposition and a method for metal line deposition using the apparatus. A donor plate has a donor substrate transparent to a focused coherent light beam and a donor surface. The donor surface of the donor plate has a channel formed therein. The channel is coated with a metallic material. A deposition substrate onto which the metal line is to be deposited is disposed adjacent the donor surface of the donor plate. The focused coherent light beam is directed through the donor substrate of the donor plate and onto the metallic coating in the channel. The focused coherent light beam causes the metallic material to ablate from the channel by discharging ions of the metallic material away from the channel and onto the deposition substrate to form the metal line.
摘要翻译：一种用于金属线沉积的装置和使用该装置的金属线沉积方法。供体板具有对聚焦的相干光束和供体表面透明的施主衬底。供体板的供体表面具有形成在其中的通道。通道涂有金属材料。将要沉积金属线的沉积基板设置在供体板的供体表面附近。聚焦的相干光束被引导通过供体板的供体衬底和通道中的金属涂层。聚焦的相干光束使得金属材料通过将金属材料的离子排出离开通道并沉积到沉积基板上而形成金属线，从而从通道中消融。

7. 发明授权

US5935462A Repair of metal lines by electrostatically assisted laser ablative deposition 失效
标题翻译：通过静电辅助激光烧蚀沉积修复金属线
公开(公告)号：US5935462A
公开(公告)日：1999-08-10
申请号：US741479
申请日：1996-10-30
申请人： Abdelkrim Tatah
发明人： Abdelkrim Tatah
IPC分类号： C23C14/32 , C23C14/04 , C23C14/28 , H05K3/14 , H05K3/22 , H05K3/24 , B23K26/00
CPC分类号： C23C14/048 , C23C14/04 , C23C14/28 , H05K3/14 , H05K3/225 , H05K2203/0528 , H05K2203/105 , H05K2203/173 , H05K3/146 , H05K3/244
摘要： Apparatus and method for metal line deposition on a substrate. Laser ablation of a metal film coated on a first substrate removes metal ions from the film. The ions travel forward to a surface of a second substrate disposed opposite the metal film on the first substrate and are deposited on the second substrate. A positive electrode on the first substrate, a negative electrode on the second substrate, and a power supply create an electric field that is simultaneously applied across the first and second substrates to bond the metal ions to the second substrate. Bonding is enhanced by repeated reflecting a laser beam through the second substrate to heat the second substrate. The laser beam is reflected between a reflector and the deposited metal line. Also provided is a method and apparatus for repairing or augmenting metal lines on a first substrate by disposing a second substrate having a metal coating on its surface in spaced relation to the first substrate such that the metal line on the first substrate is adjacent the surface of the second substrate having the metal coating. The metal coating is ablated to discharge ions of the metal coating. An electric field is applied across the second substrate and the metal line to drive the ions to the metal line and to electrostatically bond the metal ions to the metal line.
摘要翻译：金属线沉积在基板上的装置和方法。涂覆在第一衬底上的金属膜的激光烧蚀从膜去除金属离子。离子向前行进到与第一基板上的金属膜相对设置的第二基板的表面，并且沉积在第二基板上。第一基板上的正电极，第二基板上的负电极和电源产生同时施加在第一和第二基板上以将金属离子接合到第二基板的电场。通过重复反射激光束通过第二基板来加热第二基板来增强粘合。激光束在反射器和沉积的金属线之间被反射。还提供了一种用于通过在其表面上以与第一基板隔开的关系布置具有金属涂层的第二基板来修复或增加第一基板上的金属线的方法和装置，使得第一基板上的金属线邻近第一基板的表面所述第二基板具有所述金属涂层。金属涂层被消融以排出金属涂层的离子。跨越第二基板和金属线施加电场以将离子驱动到金属线并将金属离子静电粘合到金属线上。

8. 发明授权

US5567336A Laser ablation forward metal deposition with electrostatic assisted bonding 失效
标题翻译：激光消融正向金属沉积与静电辅助键合
公开(公告)号：US5567336A
公开(公告)日：1996-10-22
申请号：US414930
申请日：1995-03-31
申请人： Abdelkrim Tatah
发明人： Abdelkrim Tatah
IPC分类号： C23C14/04 , C23C14/28 , H05K3/14 , B23K26/00
CPC分类号： C23C14/048 , C23C14/28 , H05K3/14
摘要： Apparatus and method for metal line deposition on a substrate. Laser ablation of a metal film coated on a first substrate removes metal ions from the film. The ions travel forward to a surface of a second substrate disposed opposite the metal film on the first substrate and are deposited on the second substrate. A positive electrode on the first substrate, a negative electrode on the second substrate, and a power supply create an electric field that is simultaneously applied across the first and second substrates to bond the metal ions to the second substrate. Bonding is enhanced by repeated reflecting a laser beam through the second substrate to heat the second substrate. The laser beam is reflected between a reflector and the deposited metal line.
摘要翻译：金属线沉积在基板上的装置和方法。涂覆在第一衬底上的金属膜的激光烧蚀从膜去除金属离子。离子向前行进到与第一基板上的金属膜相对设置的第二基板的表面，并且沉积在第二基板上。第一基板上的正电极，第二基板上的负电极和电源产生同时施加在第一和第二基板上以将金属离子接合到第二基板的电场。通过重复反射激光束通过第二基板来加热第二基板来增强粘合。激光束在反射器和沉积的金属线之间被反射。

9. 发明授权

US5519724A Multiwavelength and multibeam diffractive optics system for material processing 失效
$Multiwavelength and multibeam diffractive optics system for material processing$
标题翻译：用于材料加工的多波长和多波束衍射光学系统
公开(公告)号：US5519724A
公开(公告)日：1996-05-21
申请号：US284828
申请日：1994-08-02
申请人： Abdelkrim Tatah
发明人： Abdelkrim Tatah
IPC分类号： B23K26/06 , B23K26/067 , G02F1/37 , H01S3/00 , H01S3/08
CPC分类号： B23K26/0673 , B23K26/06 , B23K26/0604 , B23K26/064 , B23K26/0643 , B23K26/0648 , B23K26/0665 , B23K26/067 , G02F1/37 , H01S3/005
摘要： A laser apparatus having a laser that generates at least one laser beam of a fundamental wavelength, a diffractive optical element that converts the laser beam into a plurality of light beams at the fundamental wavelength, and a harmonic crystal that converts the plurality of light beams at the fundamental wavelength into respective light beams having respective wavelengths which are harmonically related to the fundamental wavelength. By splitting the laser beam into a plurality of beams before converting to harmonic wavelengths using the harmonic crystal, the crystal volume is more efficiently used and the thermal stress on the crystal is reduced. In an alternative embodiment, the invention provides for the use of a plurality of harmonic crystals in series to convert the wavelength to shorter harmonics. The apparatus employs a method of generating a plurality of laser light beams at a plurality of wavelengths comprising by generating at least one laser light beam at a fundamental wavelength, converting that laser light beam into a plurality of light beams at the fundamental wavelength using a diffractive optical element, and converting the plurality of light beams at the fundamental wavelength into a plurality of light beams which are harmonically related to the fundamental wavelength using a harmonic crystal.
摘要翻译：一种具有产生至少一个基本波长的激光束的激光器的激光装置，将激光束转换成基本波长的多个光束的衍射光学元件以及将多个光束转换成基波长的谐波晶体，具有与基本波长谐波相关的各波长的各光束的基本波长。通过在使用谐波晶体转换成谐波波长之前将激光束分割成多个光束，可以更有效地使用晶体体积，并且降低晶体上的热应力。在替代实施例中，本发明提供串联的多个谐波晶体的使用以将波长转换成较短的谐波。该装置采用以多个波长产生多个激光束的方法，包括通过产生基波长的至少一个激光束，使用衍射法将激光束转换为基波长的多个光束光学元件，并且使用谐波晶体将基波长处的多个光束转换成与基波的谐波相关的多个光束。

10. 发明授权

US06211080B1 Repair of dielectric-coated electrode or circuit defects 失效
标题翻译：修复电介质电极或电路缺陷
公开(公告)号：US06211080B1
公开(公告)日：2001-04-03
申请号：US08741480
申请日：1996-10-30
申请人： Abdelkrim Tatah
发明人： Abdelkrim Tatah
IPC分类号： H01L2144
CPC分类号： H05K3/225 , B23K26/351 , C23C14/046 , C23C16/045 , H05K1/0306 , H05K3/0017 , H05K3/146 , H05K3/28 , H05K2203/0528 , H05K2203/0769 , H05K2203/107 , H05K2203/1338 , H05K2203/173
摘要： A method of repairing or augmenting a metal line buried beneath at least one cover layer comprising the steps of creating a via through the cover layer to the metal line, repairing or augmenting the metal line, and filling the via. Also provided is apparatus for repairing or augmenting a metal line buried beneath at least one cover layer comprising means for creating a via through the cover layer to the metal line, means for repairing or augmenting the metal line, and means for filling the via. Also provided is a substrate having a metal line buried beneath at least one cover layer wherein the metal line has been repaired or augmented according to the process comprising the steps of creating a via through the cover layer to the metal line, repairing or augmenting the metal line, and filling the via.
摘要翻译：一种修复或增加掩埋在至少一个覆盖层下面的金属线的方法，包括以下步骤：通过覆盖层形成通向金属线的通孔，修复或增加金属线，以及填充通孔。还提供了用于修复或增加掩埋在至少一个覆盖层下面的金属线的装置，包括用于通过覆盖层形成到金属线的通孔，用于修复或增加金属线的装置，以及用于填充通孔的装置。还提供了一种衬底，其具有埋在至少一个覆盖层下面的金属线，其中金属线已经被修复或增加，根据包括以下步骤的金属线：通过覆盖层形成通孔到金属线，修复或增加金属线，填充通孔。

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