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    • 3. 发明申请
    • MASTERBATCH FOR FOAM MOLDING AND MOLDED FOAM
    • 用于泡沫成型和模制泡沫的主板
    • US20110166242A1
    • 2011-07-07
    • US13056203
    • 2009-09-16
    • Yasuhiro KawaguchiYoshiyuki KosakaKenichi Matsumura
    • Yasuhiro KawaguchiYoshiyuki KosakaKenichi Matsumura
    • C08L23/06C08L23/12C08L25/06
    • C08J9/32C08J3/226C08J2201/024C08J2203/22C08J2323/06C08J2323/12C08J2325/06
    • The present invention has its object to provide a masterbatch for foam molding, which can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding, which shows a high expansion ratio, and which yields a foamed product with a good appearance. The present invention also has its object to provide a foamed product using the masterbatch for foam molding.A masterbatch for foam molding comprises a base resin and a thermally expandable microcapsule, the base resin being a thermoplastic resin having a melting point of 100° C. or higher, the masterbatch containing 10 to 230 parts by weight of the thermally expandable microcapsule to 100 parts by weight of the base resin, and the masterbatch having a true density of 0.80 g/cm3 or more, a bulk density of 0.35 g/cm3 or more, and a masterbatch size of 450 mg/30 pieces or more.
    • 本发明的目的是提供一种发泡成型用母料,其可以适用于显示高发泡倍率的涉及高剪切力的捏合成型,压延成型,挤出成型,注射成型等成型工艺,以及 其产生具有良好外观的发泡产品。 本发明的目的还在于提供使用发泡成型用母料的发泡体。 用于发泡成型的母料包括基础树脂和热膨胀性微胶囊,所述基础树脂是熔点为100℃以上的热塑性树脂,所述母料含有10〜230重量份的所述热膨胀性微囊至100 基础树脂重量份,真空密度为0.80g / cm 3以上,母体密度为0.35g / cm 3以上,母料粒径为450mg / 30个以上的母料。
    • 4. 发明申请
    • THERMALLY EXPANDABLE MICROCAPSULE AND FOAM-MOLDED ARTICLE
    • 热膨胀微孔和泡沫塑料制品
    • US20110263746A1
    • 2011-10-27
    • US13127552
    • 2009-09-16
    • Yasuhiro KawaguchiYoshiyuki Kosaka
    • Yasuhiro KawaguchiYoshiyuki Kosaka
    • C08L33/20C08J9/16C08J9/22C08L33/14
    • C08J9/228B01J13/14B29C67/247B29C70/66C08F220/44C08F220/50C08J9/32C08J2203/22C08J2333/22C08L51/10
    • The present invention has its object to provide a thermally expandable microcapsule, which shows excellent heat resistance and a high expansion ratio and thereby can be suitably used for molding processes involving high shearing force, such as kneading molding, calender molding, extrusion molding, and injection molding. The present invention also has its object to provide a foamed product using the thermally expandable microcapsule. The present invention relates to a thermally expandable microcapsule, which comprises: a shell made of a polymer; and a volatile expansion agent as a core agent encapsulated in the shell, the storage elastic modulus (E′) of the shell at a temperature of 200° C. and a frequency of 10 Hz being 1×105 N/m2 or more, the storage elastic modulus (E′) of the shell at a temperature of 250° C. and a frequency of 10 Hz being 1×105 N/m2 or more, and a maximum displacement amount measured by thermomechanical analysis being 300 μm or more.
    • 本发明的目的是提供一种热膨胀性微胶囊,其显示出优异的耐热性和高膨胀率,因此可以适用于包括高剪切力在内的成型工艺,例如捏合成型,压延成型,挤压成型和注射 成型。 本发明的目的还在于提供一种使用该热膨胀性微胶囊的泡沫制品。 本发明涉及一种热可膨胀微胶囊,其包括:由聚合物制成的壳; 作为封装在外壳中的核心试剂的挥发性膨胀剂,壳的温度为200℃,频率为10Hz的储能弹性模量(E')为1×10 5 N / m 2以上, 在250℃的温度和10Hz的频率为1×10 5 N / m 2以上的壳体的储能弹性模量(E')为300μm以上,通过热机械分析测定的最大位移量为300μm以上。