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1. 发明授权

US4917466A Method for electrically connecting IC chips, a resinous bump-forming composition used therein and a liquid-crystal display unit electrically connected thereby 失效
标题翻译：用于电连接IC芯片的方法，其中使用的树脂凸起形成组合物和与其电连接的液晶显示单元
公开(公告)号：US4917466A
公开(公告)日：1990-04-17
申请号：US227253
申请日：1988-08-02
申请人： Akio Nakamura , Naoki Kodama , Osami Hayashi , Hirofumi Saita
发明人： Akio Nakamura , Naoki Kodama , Osami Hayashi , Hirofumi Saita
IPC分类号： G02F1/13 , H01L21/56
CPC分类号： G02F1/13452 , H01L21/563 , H01L2224/16 , H01L2224/16225 , H01L2224/32225 , H01L2224/73203 , H01L2224/73204 , H01L2924/01014 , H01L2924/01046 , H01L2924/01068 , H01L2924/01077 , H01L2924/01078 , H01L2924/01079
摘要： The invention provides a very efficient and reliable method for electrically connecting the electrodes of an electronic device, e.g., IC chips, and the electrodes of, for example, a glass-made circuit board substrate with good repairability. Thus, the electrodes of the IC chip are each first coated with an electroconductive thermally meltable adhesive resinous composition to form a resinous bump, the IC chip is mounted on the substrate with the adhesive-coated electrodes contacting with the respective electrodes of the substrate, and remelting and then solidifying the resinous bumps so that the electrodes are bonded and electrically connected together. As compared with the conventional methods in which an electroconductive thermosetting resinous composition is used for the bumps on the electrodes, the electrical connection can be obtained with a smaller thermal effect and good replaceability of the IC chip found unacceptable with an acceptable one.

2. 发明授权

US4775578A Colored ink ribbon of electrothermal transfer type for thermal printers 失效
标题翻译：用于热敏打印机的电热转印型彩色墨带
公开(公告)号：US4775578A
公开(公告)日：1988-10-04
申请号：US81288
申请日：1987-08-03
申请人： Osami Hayashi , Akio Nakamura , Yasuhiro Goto
发明人： Osami Hayashi , Akio Nakamura , Yasuhiro Goto
IPC分类号： B41J31/00 , B32B7/02 , B41J31/06 , B41M5/26 , B41M5/382
CPC分类号： B41M5/3825 , Y10S428/913 , Y10S428/914 , Y10T428/24917
摘要： The invention provides an electrothermal hot-melt type thermal transfer ink ribbon having a multi-layered structure used in thermal printers having a multi-stylus electrode head. Different from conventional ink ribbons of such a type composed of an electroconductive base film as a resistive layer, a vapor-deposited aluminum layer to serve as an electric pass to a return electrode and a layer of a hot-melt ink, the inventive ink ribbon has an additional layer as a heat barrier between the aluminum layer and the hot-melt ink layer so that the heat generated in the resistive base film and reaching the ink layer is radially diffused to produce a remarkable temperature gradient within the dot decreasing from the center to the periphery thus to provide a possibility of gradation control of the optical density of the printed dots by means of the voltage adjustment.
摘要翻译：本发明提供一种具有多层结构的电热热熔型热转印墨带，其用于具有多触针电极头的热敏打印机中。与由作为电阻层的导电性基底膜构成的常规墨带不同，作为用于返回电极的电穿孔的蒸镀铝层和热熔墨层，本发明的墨带在铝层和热熔油墨层之间具有作为隔热层的附加层，使得在电阻基膜中产生的到达油墨层的热量被径向扩散，以在从中心减小的点内产生显着的温度梯度从而提供通过电压调节对打印点的光密度进行灰度控制的可能性。

3. 发明授权

US5041183A Method for the preparation of a hot-melt adhesive interconnector 失效
标题翻译：制备热熔胶连接器的方法
公开(公告)号：US5041183A
公开(公告)日：1991-08-20
申请号：US462040
申请日：1990-01-09
申请人： Akio Nakamura , Osami Hayashi , Hideki Tabei
发明人： Akio Nakamura , Osami Hayashi , Hideki Tabei
IPC分类号： H01R11/01 , H01R4/04 , H01R13/24 , H05K1/18 , H05K3/30 , H05K3/32 , H05K3/36
CPC分类号： H05K3/323 , H01R4/04 , H01R12/714 , H01R13/2414 , H05K1/181 , H05K2201/0129 , H05K2201/09945 , H05K2201/10378 , H05K2201/10977 , H05K2203/1189 , H05K3/305 , H05K3/321 , H05K3/361 , Y10T156/1075 , Y10T29/4922
摘要： The inventive interconnector, which is used for electrically connecting two arrays of electrodes on two circuit boards, etc., is a striped sheet composed of alternately arranged strips of an insulating adhesive hot-melt resin and strips of a conductive adhesive hot-melt resin composition. The interconnector is prepared by stacking a film of the insulating resin coated on one surface with the conductive composition, integrating the stack into an integral block and slicing the block in a plane perpendicular to the surface of the stacked films. Alternatively, the interconnector is composed of a matrix of an insulating adhesive hot-melt resin and regularly distributed spots of a conductive adhesive hot-melt resin composition. Such an interconnector can be prepared by stacking alternately numbers of the above mentioned striped sheets and sheets of the insulating adhesive hot-melt resin one on the other, integrating the stack into an integral block and slicing the block in a plane perpendicular to the running direction of the conductive strips in the conductive sheets.
摘要翻译：用于电连接两个电路板上的两个电极阵列的本发明的互连器是由交替布置的绝缘粘合剂热熔树脂条和导电粘合剂热熔树脂组合物条。通过将涂覆在一个表面上的绝缘树脂的膜与导电组合物层叠，将叠层整合成整体块并在垂直于堆叠膜的表面的平面中切割块来制备互连器。或者，互连器由绝缘粘合剂热熔树脂的基体和导电粘合剂热熔树脂组合物的规则分布的点组成。这样的互连器可以通过将上述条形片材和绝缘粘合剂热熔树脂片材交替堆叠而制成，将堆叠整合成整体块，并在与行进方向垂直的平面中切片块的导电片中的导电条。

4. 发明授权

US4163204A Pressure-sensitive resistors 失效
标题翻译：压敏电阻
公开(公告)号：US4163204A
公开(公告)日：1979-07-31
申请号：US973088
申请日：1978-12-26
申请人： Ryoichi Sado , Akio Nakamura , Naoki Kodama
发明人： Ryoichi Sado , Akio Nakamura , Naoki Kodama
IPC分类号： G01L9/00 , H01B1/20 , H01C10/10 , H01C10/12
CPC分类号： G01L9/0002 , H01C10/106
摘要： The pressure-sensitive resistor comprising an electroconductive elastomer, in which an electroconductive particulate material is dispersed, two electrodes placed on the opposing surfaces of the elastomer, a means for providing a compressive force between the electrodes and a means for adjusting the compressive force, works on a novel principle that the elastomer composite exhibits a positive coefficient in the curve of compression vs. resistance relationship when the compressive force is varied in a region exceeding an inversion point at which the resistance of the elastomer as measured in the direction of compression is minimal. The coefficient in this positive region is smaller than in the ordinary negative region, so that the variable resistance of the resistor can be controlled very delicately together with the decreased contribution of the uncontrollable contact resistance.
摘要翻译：压敏电阻器包括导电弹性体，其中分散有导电颗粒材料，放置在弹性体的相对表面上的两个电极，用于在电极之间提供压缩力的装置和用于调节压缩力的装置的工作基于弹性体复合材料在压缩力与电阻关系曲线中呈现正系数的新颖原理，当压缩力在超过在压缩方向测量的弹性体电阻最小时的反转点的区域中变化时。该正区域中的系数比普通负区域小，因此可以非常精细地控制电阻器的可变电阻以及不可控接触电阻的减小的贡献。

5. 发明授权

US08841572B2 Switch device and connector 有权
标题翻译：开关设备和连接器
公开(公告)号：US08841572B2
公开(公告)日：2014-09-23
申请号：US13541889
申请日：2012-07-05
申请人： Daiei Iwamoto , Takashi Yuba , Koichi Kiryu , SeungSeok Beak , Akio Nakamura
发明人： Daiei Iwamoto , Takashi Yuba , Koichi Kiryu , SeungSeok Beak , Akio Nakamura
IPC分类号： H01H33/16 , H01H9/44 , H01H1/26 , H01H15/10 , H01H15/24 , H01H13/52
CPC分类号： H01H1/26 , H01H9/443 , H01H13/52 , H01H15/102 , H01H15/24
摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions configured to contact the first and second fixed contacting portions, respectively and provided to be adjacent from each other; and a magnet unit provided such that a first pole is positioned to face the first contacting portion and a second pole is positioned to face the second contacting portion to generate magnetic fields between the first fixed contacting portion and the first movable contacting portion and between the second fixed contacting portion and the second movable contacting portion, respectively.
摘要翻译：开关装置包括第一和第二接触部分，第一和第二接触部分包括第一和第二固定接触部分，第一和第二可动接触部分分别被配置成接触第一和第二固定接触部分并被设置为彼此相邻; 以及设置成使得第一极定位成面对第一接触部分并且第二极被定位成面对第二接触部分以在第一固定接触部分和第一可动接触部分之间以及在第二接触部分之间产生磁场的磁体单元固定接触部分和第二可动接触部分。

6. 发明申请

US20130037401A1 SWITCH DEVICE AND CONNECTOR 有权
标题翻译：开关器件和连接器
公开(公告)号：US20130037401A1
公开(公告)日：2013-02-14
申请号：US13541826
申请日：2012-07-05
申请人： Takashi Yuba , Daiei Iwamoto , SeungSeok Beak , Koichi Kiryu , Akio Nakamura
发明人： Takashi Yuba , Daiei Iwamoto , SeungSeok Beak , Koichi Kiryu , Akio Nakamura
IPC分类号： H01R13/70 , H01H33/20
CPC分类号： H01H13/52 , H01H1/24 , H01H9/44 , H01H9/46 , H01H15/102 , H01H15/24
摘要： A switch device includes first and second contacting portions including first and second fixed contacting portions and first and second movable contacting portions, respectively, the first fixed contacting portion and the second fixed contacting portion being configured to be electrically connected to one of a power source and an electronic device while the first movable contacting portion and the second movable contacting portion are configured to be electrically connected to the other of the power source and the electronic device; a first electric arc runner provided near at least one of the first fixed contacting portion and the first movable contacting portion; and a second electric arc runner provided near at least one of the second fixed contacting portion and the second movable contacting portion.
摘要翻译：开关装置包括分别包括第一和第二固定接触部分以及第一和第二可动接触部分的第一和第二接触部分，第一固定接触部分和第二固定接触部分被构造成电连接到电源和电子设备，同时第一可动接触部分和第二可动接触部分被配置为电连接到电源和电子设备中的另一个; 设置在第一固定接触部分和第一可动接触部分中的至少一个附近的第一电弧流道; 以及设置在第二固定接触部分和第二可动接触部分中的至少一个附近的第二电弧流道。

7. 发明授权

US07719516B2 Actuator having an inputting function 有权
标题翻译：具有输入功能的执行器
公开(公告)号：US07719516B2
公开(公告)日：2010-05-18
申请号：US10909329
申请日：2004-08-03
申请人： Noboru Fujii , Takashi Arita , Nobuyoshi Shimizu , Akio Nakamura , Shinichiro Akieda , Shigemi Kurashima
发明人： Noboru Fujii , Takashi Arita , Nobuyoshi Shimizu , Akio Nakamura , Shinichiro Akieda , Shigemi Kurashima
IPC分类号： G09G5/00
CPC分类号： H02K41/0354 , H02K2201/18
摘要： An actuator includes: a magnetic field generator that has different magnetic poles alternately arranged in a plane, with a predetermined position being the center of the magnetic poles; a coil holder that holds a plurality of coils that are radially arranged and face the magnetic field generator, relative motion being caused between the magnetic field generator and the coil holder; and an electromagnetic conversion unit that detects the relative motion and is mounted on either the magnetic field generator or the coil holder.
摘要翻译：致动器包括：具有交替布置在平面中的不同磁极的磁场发生器，其中预定位置是磁极的中心; 保持径向布置并面对磁场发生器的多个线圈的线圈架，在磁场发生器和线圈架之间产生相对运动; 以及电磁转换单元，其检测相对运动并安装在磁场发生器或线圈架上。

8. 发明授权

US07663151B2 Method of fabricating light emitting device and thus-fabricated light emitting device 有权
标题翻译：制造发光器件和由此制造的发光器件的方法
公开(公告)号：US07663151B2
公开(公告)日：2010-02-16
申请号：US11587632
申请日：2005-04-13
申请人： Hitoshi Ikeda , Kingo Suzuki , Akio Nakamura
发明人： Hitoshi Ikeda , Kingo Suzuki , Akio Nakamura
IPC分类号： H01L33/00
CPC分类号： H01L33/22 , H01L33/0079 , H01L33/0095 , H01L33/30
摘要： A light emitting device chip is obtained by dicing a light emitting device wafer having a light emitting layer section 24 based on a double heterostructure in which a first-conductivity-type cladding layer 6, an active layer 5 and an second-conductivity-type cladding layer 4, each of which being composed of a compound semiconductor having a composition allowing lattice matching with GaAs, out of compound semiconductors expressed by formula (AlxGa1-x)yIn1-yP (where, 0≦x≦1, 0≦y≦1), are stacked in this order, and having the (100) surface appeared on the main surface thereof, and GaP transparent semiconductor layers 20, 90 stacked on the light emitting layer section 24 as being agreed with the crystal orientation thereof, so that the {100} surfaces appear on the side faces of the GaP transparent semiconductor layer. Accordingly, there can be provided a method of fabricating a light emitting device having the AlGaInP light emitting layer section and the GaP transparent semiconductor layers, less causative of failures such as edge chipping during the dicing.
摘要翻译：通过基于双异质结构对具有发光层部分24的发光器件晶片进行切割来获得发光器件芯片，其中第一导电型包覆层6，有源层5和第二导电型包层（Al x Ga 1-x）y In 1-y P表示的化合物半导体中的每一个由具有允许与GaAs晶格匹配的组成的化合物半导体构成，其中，0≤x≤1,0< y <= 1）按顺序堆叠，并且在其主表面上出现（100）表面，并且与发光层部分24堆叠在一起的GaP透明半导体层20,90与晶体取向一致，使得{100}表面出现在GaP透明半导体层的侧面上。因此，可以提供一种制造具有AlGaInP发光层部分和GaP透明半导体层的发光器件的方法，其不利于在切割期间的边缘切屑等故障。

9. 发明授权

US07595557B2 Semiconductor device and manufacturing method thereof 有权
标题翻译：半导体装置及其制造方法
公开(公告)号：US07595557B2
公开(公告)日：2009-09-29
申请号：US11453827
申请日：2006-06-16
申请人： Kazumi Watase , Akio Nakamura , Katsumi Ootani
发明人： Kazumi Watase , Akio Nakamura , Katsumi Ootani
IPC分类号： H01L29/40
CPC分类号： H01L22/14 , G01R31/2853 , H01L23/3114 , H01L23/5228 , H01L2924/0002 , H01L2924/014 , H01L2924/00
摘要： A metal wire for inspection and an electrode for inspection are formed on a region of a semiconductor substrate where a metal wire and an electrode for external connection are not formed. The metal wire for inspection and the electrode for inspection electrically detect an open failure, a short-circuit failure and a leakage failure of the metal wire and a connection failure between an element electrode and the metal wire. A semiconductor wafer is subjected to an electrical test, so that it is possible to detect the aforementioned failures with good accuracy during a manufacturing process.
摘要翻译：在不形成金属线和外部连接用电极的半导体基板的区域上形成检查用金属线和检查用电极。用于检查的金属线和用于检查的电极电检测金属线的开路故障，短路故障和漏电故障以及元件电极和金属线之间的连接故障。对半导体晶片进行电气测试，从而可以在制造过程中以高精度检测上述故障。

10. 发明授权

US07579205B2 Method of fabricating light emitting device and thus-fabricated light emitting device 有权
标题翻译：制造发光器件和由此制造的发光器件的方法
公开(公告)号：US07579205B2
公开(公告)日：2009-08-25
申请号：US11587635
申请日：2005-04-13
申请人： Hitoshi Ikeda , Kingo Suzuki , Akio Nakamura
发明人： Hitoshi Ikeda , Kingo Suzuki , Akio Nakamura
IPC分类号： H01L21/00
CPC分类号： H01L33/30 , H01L24/03 , H01L24/05 , H01L33/22 , H01L2224/48091 , Y10S438/964 , H01L2924/00014
摘要： A light emitting device wafer having a light emitting layer section 24 having an AlGaInP-base double heterostructure, and a GaP light extraction layer 20 disposed on the light emitting layer section so as to allow a first main surface thereof to compose a first main surface of the wafer is fabricated so that the first main surface of the GaP light extraction layer appears as the (100) surface. The first main surface of the GaP light extraction layer 20 composed of the (100) surface is etched using an etching solution for surface roughening to thereby form surface roughening projections 40f. Accordingly, there can be provided a method of fabricating a light emitting device having the GaP light extraction layer agreed with the (100) main surface, capable of readily subjecting the (100) main surface to surface roughening.
摘要翻译：一种发光器件晶片，具有具有AlGaInP基双异质结构的发光层部分24和设置在发光层部分上的GaP光提取层20，以便允许其第一主表面组成第一主表面制造晶片，使得GaP光提取层的第一主表面显示为（100）表面。使用用于表面粗糙化的蚀刻溶液蚀刻由（100）表面构成的GaP光提取层20的第一主表面，从而形成表面粗糙化突起40f。因此，可以提供一种制造具有与（100）主表面一致的GaP光提取层的发光器件的方法，能够容易地使（100）主表面粗糙化。

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