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1. 发明申请

US20120132359A1 ATTACHING DEVICE AND ATTACHING APPARATUS FOR SUPPORTING PLATE, AND ATTACHING METHOD FOR SUPPORTING PLATE 审中-公开
标题翻译：连接装置和连接装置，用于支撑板，以及连接支撑板的方法
公开(公告)号：US20120132359A1
公开(公告)日：2012-05-31
申请号：US13369448
申请日：2012-02-09
申请人： Akihiko NAKAMURA , Atsushi MIYANARI , Yoshihiro INAO
发明人： Akihiko NAKAMURA , Atsushi MIYANARI , Yoshihiro INAO
IPC分类号： B29C65/48
CPC分类号： B32B38/1841 , B32B37/0046 , B32B2038/1891 , B32B2309/68 , B32B2457/14 , H01L21/68 , H01L21/68742 , Y10T156/17
摘要： An attaching method for attaching a support plate to a surface of a substrate with an adhesive involves the steps of applying an adhesive to the surface of the substrate, heating and thereafter cooling the substrate, positioning centers of the substrate and the supporting plate to coincide with each other, and forming a layered structure by pushing the supporting plate onto the substrate with the adhesive therebetween in a pressure-reduced atmosphere. In the positioning step, after the supporting late has been placed on the substrate, it is possible to finely adjust the alignment of the supporting plate and a semiconductor wafer when attached because the adhesive is applied to the surface of the substrate, and thereafter the substrate is heated and cooled.
摘要翻译：用粘合剂将支撑板附着在基板的表面上的安装方法包括以下步骤：将粘合剂施加到基板的表面，加热然后冷却基板，使基板和支撑板的中心定位成与并且通过在压力降低的气氛中将粘合剂将支撑板推压到基板上而形成层状结构。在定位步骤中，在将支承后端放置在基板上之后，由于将粘合剂施加于基板的表面，所以可以在附着时精细地调整支撑板和半导体晶片的对准，然后将基板被加热和冷却。

2. 发明申请

US20110146899A1 SUPPORTING PLATE, APPARATUS AND METHOD FOR STRIPPING SUPPORTING PLATE 有权
标题翻译：支撑板，剥离支撑板的装置和方法
公开(公告)号：US20110146899A1
公开(公告)日：2011-06-23
申请号：US13036761
申请日：2011-02-28
申请人： Akihiko NAKAMURA , Atsushi MIYANARI , Yoshihiro INAO
发明人： Akihiko NAKAMURA , Atsushi MIYANARI , Yoshihiro INAO
IPC分类号： B32B38/10 , B32B38/04
CPC分类号： B29C63/0013 , B29L2031/3425 , Y10T156/1111 , Y10T156/1132 , Y10T156/1928
摘要： A method for stripping a supporting plate from a circuit-formed surface of a substrate to which it is bonded with an adhesive by using a plate which has a first penetrating hole formed in a substantially central portion thereof in the thickness direction, a second penetrating hole formed in a peripheral portion thereof in the thickness direction, and a hole for attracting the supporting plate formed between the first penetrating hole and the second penetrating hole in the radial direction of the plate. The method involves supplying a solvent from outside to the first penetrating hole of the plate and to an associated first penetrating hole formed in a substantially central portion of the supporting plate; distributing the solvent from the first penetrating hole of the supporting plate through grooves formed on a surface of the supporting plate in contact with the adhesive and connecting with the first penetrating hole of the supporting plate; dissolving the adhesive with the solvent; and draining the solvent from a second penetrating hole connecting with the grooves and formed in a peripheral portion of the supporting plate and the second penetrating hole formed in the plate.
摘要翻译：一种从其厚度方向的大致中央部形成有第一贯通孔的板剥离由基板的电路形成面与粘接剂抵接的支撑板的方法，第二贯通孔在其厚度方向的周边部分形成有用于吸引形成在板的径向方向上的第一贯通孔和第二贯通孔之间的支撑板的孔。该方法包括从外部向板的第一穿透孔和形成在支撑板的大致中心部分中的相关联的第一穿透孔提供溶剂; 从支撑板的第一贯通孔通过形成在支撑板的表面上的与粘合剂接触并与支撑板的第一穿透孔连接的槽分配溶剂; 用溶剂溶解粘合剂; 并且从与所述槽连接的第二贯通孔排出溶剂，并形成在所述支撑板的周边部分和形成在所述板中的所述第二贯通孔。

3. 发明申请

US20130000852A1 STRIPPING DEVICE AND STRIPPING METHOD 有权
标题翻译：剥离装置和剥离方法
公开(公告)号：US20130000852A1
公开(公告)日：2013-01-03
申请号：US13613384
申请日：2012-09-13
申请人： Kimihiro NAKADA , Yasumasa IWATA , Akihiko NAKAMURA , Yoshihiro INAO , Satoshi KOBARI
发明人： Kimihiro NAKADA , Yasumasa IWATA , Akihiko NAKAMURA , Yoshihiro INAO , Satoshi KOBARI
IPC分类号： B32B38/10
CPC分类号： B32B43/006 , B32B2457/14 , H01L21/67132 , H01L21/6715 , Y10T156/1111 , Y10T156/1121 , Y10T156/19 , Y10T156/1922
摘要： A stripping method for stripping a support plate from a laminate including a substrate and the support plate adhered to the wafer via an adhesive layer, in which the adhesive layer is formed from an adhesive compound soluble in a non-polar solvent or a highly polar solvent; and the stripping method includes supplying the non-polar solvent or the highly polar solvent, so that the non-polar solvent or the highly polar solvent is retained at least on an edge portion of that surface of the laminate which faces the support plate, and on a lateral surface of the laminate.
摘要翻译：一种用于从包括基底和支撑板的层压板剥离支撑板的剥离方法，所述支撑板通过粘合剂层粘合到晶片上，其中粘合剂层由可溶于非极性溶剂或高极性溶剂的粘合剂形成 ; 并且剥离方法包括供给非极性溶剂或高极性溶剂，使得非极性溶剂或高极性溶剂至少保留在面向支撑板的层压体的该表面的边缘部分上，以及在层压板的侧表面上。

4. 发明申请

US20100000680A1 SEPARATING APPARATUS AND SEPARATING METHOD 有权
标题翻译：分离装置和分离方法
公开(公告)号：US20100000680A1
公开(公告)日：2010-01-07
申请号：US12492620
申请日：2009-06-26
申请人： Yoshihiro INAO , Akihiko Nakamura , Yasumasa Iwata
发明人： Yoshihiro INAO , Akihiko Nakamura , Yasumasa Iwata
IPC分类号： B32B38/10
CPC分类号： H01L21/67092 , H01L21/67011 , H01L21/6838 , Y10T156/1111 , Y10T156/1116 , Y10T156/1132 , Y10T156/1137 , Y10T156/1939 , Y10T156/1944
摘要： A separating apparatus according to the present invention includes a sucking plate for sticking to a support plate by suction. The sucking plate has sucking holes 3 and 3′ for expelling gas from a space between the sucking plate and the support plate. Each of the sucking holes 3 and 3′ has a diameter of not less than 0.3 mm and not more than an outer diameter of the support plate. This makes it possible to separate a supporting plate from a wafer without breaking the wafer.
摘要翻译：根据本发明的分离装置包括用于通过抽吸粘附到支撑板的吸板。吸盘具有用于从吸板和支撑板之间的空间排出气体的吸孔3和3'。每个吸孔3和3'的直径不小于0.3mm且不大于支撑板的外径。这使得可以在不破坏晶片的情况下将支撑板与晶片分离。

5. 发明申请

US20100310817A1 SUPPORT PLATE, METHOD FOR PRODUCING THE SAME, AND METHOD FOR PROCESSING SUBSTRATE 有权
标题翻译：支撑板，其制造方法以及处理基板的方法
公开(公告)号：US20100310817A1
公开(公告)日：2010-12-09
申请号：US12794096
申请日：2010-06-04
申请人： Hirofumi IMAI , Koki TAMURA , Takahiro ASAI , Takahiro YOSHIOKA , Yoshihiro INAO
发明人： Hirofumi IMAI , Koki TAMURA , Takahiro ASAI , Takahiro YOSHIOKA , Yoshihiro INAO
IPC分类号： B32B3/02 , B32B37/00 , G03F7/20
CPC分类号： B32B38/06 , B32B2309/105 , B32B2457/14 , H01L21/67132 , H01L21/6836 , H01L21/68757 , H01L2221/68318 , Y10T428/24091 , Y10T428/24149 , Y10T428/24174 , Y10T428/24793 , Y10T428/24802
摘要： This invention provides a support plate which makes it possible to stably perform a step for separating from a support plate a wafer which has been processed while preventing delay in time taken for this step. The support plate of this invention is a support plate for supporting a substrate via an adhesive, including: a plate-shaped part having a surface which is in contact with the adhesive; and at least one spacer provided on the surface which is in contact with the adhesive.
摘要翻译：本发明提供了一种支撑板，其使得可以稳定地执行从支撑板分离已经被处理的晶片的步骤，同时防止该步骤所花费的时间延迟。本发明的支撑板是用于通过粘合剂支撑基底的支撑板，包括：具有与粘合剂接触的表面的板状部分; 以及设置在与粘合剂接触的表面上的至少一个间隔物。

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