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1. 发明申请

US20150368518A1 PROTECTIVE FILM-LAMINATED ADHESIVE SHEET 审中-公开
标题翻译：保护膜层压粘合片
公开(公告)号：US20150368518A1
公开(公告)日：2015-12-24
申请号：US14740985
申请日：2015-06-16
申请人： Ajinomoto Co., Inc.
发明人： Kenji KAWAI , Shigeo NAKAMURA , Yukinori EDO , Seiichiro OHASHI
IPC分类号： C09J7/02 , H05K3/04 , H05K3/46 , H05K3/00
摘要： Protective film-laminated adhesive sheets which include; an adhesive sheet including a support having first and second surfaces and a resin composition layer in contact with the second surface of the support; and a protective film having first and second surfaces with the second surface of the protective film in contact with the resin composition layer of the adhesive sheet and in which the first surface of the protective film has an arithmetic mean roughness (Rap1) of 100 nm or more, and the second surface of the protective film has an arithmetic mean roughness (Rap2) of 100 nm or more are capable of suppressing a winding displacement when the sheet is wound into a roll and are capable of preventing a resin separation when the protective film is peeled off in an automatic cutter device.
摘要翻译：保护膜层压粘合片，包括：粘合片，其包括具有第一表面和第二表面的支撑体和与支撑体的第二表面接触的树脂组合物层; 保护膜具有第一和第二表面，保护膜的第二表面与粘合片的树脂组合物层接触，其中保护膜的第一表面具有100nm的算术平均粗糙度（Rap1）或并且保护膜的第二表面具有100nm以上的算术平均粗糙度（Rap2）能够抑制当片材卷绕成卷时的卷绕位移，并且当保护膜可以防止树脂分离时在自动切割装置中剥离。

2. 发明申请

US20140102623A1 RESIN COMPOSITION FOR INSULATING LAYER FOR MULTI-LAYERED PRINTED BOARD 有权
标题翻译：用于多层印刷板绝缘层的树脂组合物
公开(公告)号：US20140102623A1
公开(公告)日：2014-04-17
申请号：US14136107
申请日：2013-12-20
申请人： Ajinomoto Co., Inc.
发明人： Kenji KAWAI , Shigeo NAKAMURA
IPC分类号： H05K3/46
CPC分类号： H05K3/4688 , C08G59/621 , C08L21/00 , C08L63/00 , C08L71/00 , H05K3/381 , H05K3/4632 , H05K3/4661 , H05K2201/0133 , H05K2201/0212 , C08L2666/14 , C08L61/04 , C08L2666/04
摘要： Epoxy resin compositions, which comprise (A) en epoxy resin having two or more epoxy groups in a molecule; (B) a phenol type curing agent where an average hydroxyl group content in a molecule (a mean value of (the total number of hydroxyl groups)/(the total number of benzene rings)), P, satisfies the equation 0
摘要翻译：环氧树脂组合物，其包含（A）在分子中具有两个或更多个环氧基的环氧树脂; （B）分子中的平均羟基含量（（羟基的总数）/（苯环的总数）的平均值）/（苯环的总数））的酚类固化剂满足式0

3. 发明申请

US20190200455A1 RESIN SHEET 审中-公开
公开(公告)号：US20190200455A1
公开(公告)日：2019-06-27
申请号：US16286237
申请日：2019-02-26
申请人： Ajinomoto Co., Inc.
发明人： Shigeo NAKAMURA , Shiro TATSUMI , lkumi SAWA
IPC分类号： H05K1/03 , H05K3/46 , C08L63/00 , H05K3/22 , H01L23/14 , H01L21/48 , H05K3/00 , B32B27/00 , H01L21/683 , H01L23/498
CPC分类号： H05K1/0373 , B32B7/04 , B32B15/08 , B32B15/20 , B32B27/00 , B32B27/08 , B32B27/10 , B32B27/18 , B32B27/205 , B32B27/26 , B32B27/28 , B32B27/281 , B32B27/285 , B32B27/288 , B32B27/32 , B32B27/325 , B32B27/36 , B32B27/365 , B32B2264/02 , B32B2264/0207 , B32B2264/0264 , B32B2307/202 , B32B2307/206 , B32B2307/306 , B32B2307/7265 , B32B2307/732 , B32B2457/08 , C08G59/621 , C08G59/686 , C08L63/00 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/145 , H01L23/49894 , H01L2221/68345 , H05K3/0011 , H05K3/22 , H05K3/4038 , H05K3/4673 , H05K3/4682 , H05K2201/0209 , H05K2201/0212 , H05K2203/06
摘要： Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.

4. 发明申请

US20170290149A1 RESIN SHEET 审中-公开
公开(公告)号：US20170290149A1
公开(公告)日：2017-10-05
申请号：US15472684
申请日：2017-03-29
申请人： Ajinomoto Co., Inc.
发明人： Shigeo NAKAMURA , Shiro TATSUMI , Ikumi SAWA
IPC分类号： H05K1/03 , H01L21/48 , H05K3/40 , H01L21/683 , H05K3/00 , H05K3/22 , H01L23/498 , H05K3/46
CPC分类号： H05K1/0373 , H01L21/4857 , H01L21/486 , H01L21/6835 , H01L23/49894 , H01L2221/68345 , H05K3/0011 , H05K3/22 , H05K3/4038 , H05K3/4673 , H05K3/4682 , H05K2201/0209 , H05K2201/0212 , H05K2203/06
摘要： Resin sheets which includes a support and a resin composition layer in contact on the support, and which are characterized in that an extracted water conductivity A of a cured product of the resin composition layer when extracted at 120° C. for 20 hours is 50 μS/cm or less and an extracted water conductivity B of the cured product of the resin composition layer when extracted at 160° C. for 20 hours is 200 μS/cm or less, can provide a thin insulating layer having excellent insulating properties.

5. 发明申请

US20170154841A1 RESIN COMPOSITION 有权
公开(公告)号：US20170154841A1
公开(公告)日：2017-06-01
申请号：US15363166
申请日：2016-11-29
申请人： Ajinomoto Co., Inc.
发明人： Shigeo NAKAMURA , Kazuhiko TSURUI , Shiro TATSUMI
IPC分类号： H01L23/498 , C08K7/18 , C08K3/36 , H01L21/48
CPC分类号： H01L23/49894 , C08K3/36 , C08K7/18 , C08K9/06 , C08K2201/003 , C08K2201/006 , C08L63/00 , H01L21/481 , H01L21/4857 , H01L23/49822
摘要： Resin compositions containing (A) an epoxy resin, (B) a curing agent, and (C) an inorganic filler in which the content of (C) the inorganic filler is 55% by mass or higher with respect to 100% by mass of a non-volatile component within the resin composition, the average particle diameter of (C) the inorganic filler is 0.05 to 0.35 μm, the product of the specific surface area (m2/g) of (C) the inorganic filler and the true density of (C) the inorganic filler is 1 to 77 m2/g and the moisture permeation of a cured product obtained by thermally cured the resin composition is 0.05 to 2.8 g˜mm/m2·24 h are useful for making printed wiring boards.

6. 发明申请

US20170086306A1 METHOD FOR MANUFACTURING WIRING BOARD 审中-公开
公开(公告)号：US20170086306A1
公开(公告)日：2017-03-23
申请号：US15266323
申请日：2016-09-15
申请人： Ajinomoto Co., Inc.
发明人： Shigeo NAKAMURA , Chihiro FUJIWARA
IPC分类号： H05K3/42 , H05K1/09 , H05K3/00 , H05K3/22 , H05K1/11 , H05K1/02
摘要： Wiring boards, including an embedded type wiring boards and flexible wiring boards, may be produce by: (1) preparing a wiring layer-attached base including a base and a wiring layer provided on at least one surface of the base, (2) laminating an adhesive sheet including (i) a thermosetting resin composition layer and (ii) a resin film layer on the wiring layer-attached base so that the wiring layer will be embedded in (i) the thermosetting resin composition layer and performing thermal curing to form an insulating layer, (3) forming via holes in the insulating layer, (4) forming a conductor layer, and (5) removing the base.

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