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1. 发明授权

US09883818B2 Fiducial localization 有权
公开(公告)号：US09883818B2
公开(公告)日：2018-02-06
申请号：US12214771
申请日：2008-06-18
申请人： Adam Jerome Weber , Eric Earnst , Calvin R. Maurer, Jr. , Gopinath Kuduvalli , Christopher A. Raanes
发明人： Adam Jerome Weber , Eric Earnst , Calvin R. Maurer, Jr. , Gopinath Kuduvalli , Christopher A. Raanes
IPC分类号： A61B5/05 , A61B5/06 , A61B6/04 , A61B6/00 , A61N5/10 , A61B34/20 , A61B90/00 , A61B34/30
CPC分类号： A61B5/06 , A61B5/062 , A61B6/04 , A61B6/547 , A61B34/20 , A61B34/30 , A61B90/39 , A61B2034/2051 , A61B2090/376 , A61B2090/3762 , A61N5/1049 , A61N2005/1051
摘要： Fiducial localization methods and apparatus are described.

2. 发明申请

US20090005677A1 Fiducial localization 有权
标题翻译：基准本地化
公开(公告)号：US20090005677A1
公开(公告)日：2009-01-01
申请号：US12214771
申请日：2008-06-18
申请人： Adam Jerome Weber , Eric Earnst , Calvin R. Maurer, JR. , Gopinath Kuduvalli , Christopher A. Raanes
发明人： Adam Jerome Weber , Eric Earnst , Calvin R. Maurer, JR. , Gopinath Kuduvalli , Christopher A. Raanes
IPC分类号： A61B5/05
CPC分类号： A61B5/06 , A61B5/062 , A61B6/04 , A61B6/547 , A61B34/20 , A61B34/30 , A61B90/39 , A61B2034/2051 , A61B2090/376 , A61B2090/3762 , A61N5/1049 , A61N2005/1051
摘要： Fiducial localization methods and apparatus are described.
摘要翻译：描述了基准定位方法和装置。

3. 发明授权

US5756157A Method for processing flat panel displays and large wafers 失效
标题翻译：平板显示器和大晶圆处理方法
公开(公告)号：US5756157A
公开(公告)日：1998-05-26
申请号：US725282
申请日：1996-10-02
申请人： Chak D. Kannan , Adam Jerome Weber
发明人： Chak D. Kannan , Adam Jerome Weber
IPC分类号： H01L21/027 , B05D3/02 , H01L21/00
CPC分类号： H01L21/67103 , B05D3/0272
摘要： The invention provides a hot plate oven and a method suitable to bake materials on substrates such as flat panel displays and large semiconductor wafers such as 300 mm in diameter and above. The hot plate oven in one embodiment includes an insulated chamber, a heater in the chamber, a door for entry of a substrate, a frame, preferably water cooled, for suspending the substrate above the heater, a substrate lowering mechanism to hold the frame and lower the substrate to a certain height above the heater, and a set of manifolds and valves to feed and exhaust gases, vapors, and apply a vacuum to the chamber. In another feature, the oven assembly includes a stack of low profile ovens, each having a door on the side for entry of a substrate.
摘要翻译：本发明提供一种热板式烘箱和适用于将材料烘烤在诸如平板显示器和诸如直径为300mm以上的大型半导体晶片的基板上的方法。在一个实施例中，热板式烘箱包括隔热室，腔室中的加热器，用于进入基板的门，优选水冷的框架，用于将衬底悬挂在加热器上方;衬底降低机构，用于保持框架和将基板降低到加热器上方一定的高度，以及一组歧管和阀门，用于进料和排出气体，蒸气并向室施加真空。在另一个特征中，烤箱组件包括一堆低档烤箱，每一个炉门都在一侧用于进入衬底。

4. 发明授权

US6091056A Hot plate oven for processing flat panel displays and large wafers 失效
标题翻译：热板烤箱用于处理平板显示器和大晶圆
公开(公告)号：US6091056A
公开(公告)日：2000-07-18
申请号：US938396
申请日：1997-09-26
申请人： Chak D. Kannan , Adam Jerome Weber
发明人： Chak D. Kannan , Adam Jerome Weber
IPC分类号： H01L21/027 , B05D3/02 , H01L21/00 , C23C16/00 , F27B5/06 , F27B5/14
CPC分类号： H01L21/67103 , B05D3/0272
摘要： The invention provides a hot plate oven suitable to bake materials on substrates such as flat panel displays and large semiconductor wafers such as 300 mm in diameter and above. The hot plate oven in one embodiment includes an insulated chamber, a heater in the chamber, a door for entry of a substrate, a frame, preferably water cooled, for suspending the substrate above the heater, a substrate lowering mechanism to hold the frame and lower the substrate to a certain height above the heater at least one fluid cooled pin to counteract sag when the substrate is heated, and a set of manifolds and valves to feed and exhaust gases, vapors, and apply a vacuum to the chamber. In another feature, the oven assembly includes a stack of low profile ovens, each having a door on the side for entry of a substrate.
摘要翻译：本发明提供一种适用于在诸如平板显示器和大型半导体晶片（如300mm直径和以上）的基底上烘烤材料的热板式烤箱。在一个实施例中，热板式烘箱包括隔热室，腔室中的加热器，用于进入基板的门，优选水冷的框架，用于将衬底悬挂在加热器上方;衬底降低机构，用于保持框架和将基板降低到加热器上方至少一个流体冷却销的一定高度，以在加热基板时抵消下垂，以及一组歧管和阀门，用于进料和排出气体，蒸气并向室施加真空。在另一个特征中，烤箱组件包括一堆低档烤箱，每一个炉门都在一侧用于进入衬底。

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