会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 8. 发明申请
    • Small form factor air jet cooling system
    • 小型空气喷射冷却系统
    • US20060019597A1
    • 2006-01-26
    • US10898736
    • 2004-07-23
    • Abdlmonem BeitelmalChandrakant PatelCullen Bash
    • Abdlmonem BeitelmalChandrakant PatelCullen Bash
    • H05K5/00
    • H05K7/20727
    • An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. A cooling system is formed by a plenum pressurized by a blower. The plenum defines a plurality of configurable orifices in the chassis, each directing pressurized air toward a component. The plenum includes adjustable valves to controllably limit airflow through the orifices, and a controller to control the air pressure within the plenum and the orifice flow rates through the valves.
    • 外壳形成在纵向尺寸上垂直堆叠的多个层。 每个层是1U模块化计算机系统,其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。 冷却系统由通过鼓风机加压的增压室形成。 气室在底盘中限定了多个可配置的孔,每个将加压空气朝向组件。 气室包括可调节的阀门,以可控地限制通过孔口的气流,以及控制器来控制气室内的空气压力和通过阀门的孔口流量。