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    • 1. 发明申请
    • Multilayer Coatings By Plasma Enhanced Chemical Vapor Deposition
    • 多层涂料通过等离子体增强化学气相沉积
    • US20080095954A1
    • 2008-04-24
    • US11661055
    • 2005-09-02
    • Aaron GabelnickChristina Lambert
    • Aaron GabelnickChristina Lambert
    • C23C16/513
    • B05D1/62B05D7/53B05D2201/00C08J7/123C23C16/0272C23C16/401
    • The present invention provides a process for preparing a multiple layer coating on the surface of an organic polymeric substrate by means of atmospheric pressure plasma deposition, the steps of the process comprising depositing a layer (first layer) of a plasma polymerized, optically clear, highly adherent, organosilicon compound onto the surface of the organic polymeric substrate by atmospheric pressure plasma deposition of a gaseous mixture comprising an organosilicon reagent compound and optionally an oxidant in a first step and thereafter in a second step depositing a substantially uniform layer (second layer) of a silicon oxide compound onto the exposed surface of said first layer by atmospheric pressure plasma deposition of a gaseous mixture comprising an oxidant and an organosilicon reagent compound, wherein the molar ratio of oxidant to organosilicon reagent compound in the gaseous mixture is greater in the second step than in the first step.
    • 本发明提供了一种通过大气压等离子体沉积在有机聚合物基材的表面上制备多层涂层的方法,该方法的步骤包括沉积等离子体聚合的,光学透明的,高度的 粘附的有机硅化合物通过大气压等离子体沉积包含有机硅试剂化合物和任选的氧化剂的气体混合物在第一步骤中,然后在第二步骤中沉积基本均匀的层(第二层),在有机聚合物基材的表面上沉积有机硅化合物 氧化硅化合物通过大气压等离子体沉积包含氧化剂和有机硅试剂化合物的气体混合物在所述第一层的暴露表面上,其中气态混合物中氧化剂与有机硅试剂化合物的摩尔比在第二步骤中更大 比第一步。