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    • 8. 发明申请
    • INHERENTLY INK RECEPTIVE FILM SUBSTRATES
    • 独立墨水接收膜基材
    • WO0176885A2
    • 2001-10-18
    • PCT/US0111719
    • 2001-04-11
    • AVERY DENNISON CORPVENKATASANTHANAM SRIRAMHEYDARPOUR RAMINSHIH FRANK YMALLYA PRAKASH
    • VENKATASANTHANAM SRIRAMHEYDARPOUR RAMINSHIH FRANK YMALLYA PRAKASH
    • B41J2/01B41M5/00B41M5/50B41M5/52
    • B41M5/52B41M5/504B41M5/506B41M5/508B41M5/5236B41M5/5254B41M5/5272B41M5/5281Y10T428/24802Y10T428/25Y10T428/28Y10T428/31786Y10T428/31855
    • Ink receptive substrates comprise a base layer formed from a water-insoluble thermoplastic polymer, and an ink receptive layer disposed over the base layer. The ink receptive layer is formed from a melt processable blend of a water-soluble polymer and a substantially water-insoluble polymer, and provides an inherently ink receptive surface without further surface treatment. The ink receptive blend comprises in the range of from 20 to 80 percent by weight water-soluble polymer, and in the range of from 20 to 80 percent by weight substantially water-insoluble polymer based on the total weight of the blend. The blend has a melting temperature in the range of from about 100 to 600EF. Preferred water-soluble polymers include polyvinyl alcohols and polyalkyl oxazolines. Preferred ink receptive substrates of this invention comprise a base layer and ink receptive layer that are formed simultaneously by coextrusion process. Ink receptive substrates of this invention can include the ink receptive layer on one or both surfaces of the base layer, and/or can be constructed in the form of a pressure-sensitive adhesive label, i.e., with a pressure-sensitive adhesive material disposed on a surface of the base layer opposite the ink receptive layer.
    • 油墨接收基材包括由不溶于水的热塑性聚合物形成的基底层和设置在基底层上的墨接受层。 油墨接收层由水溶性聚合物和基本上不溶于水的聚合物的可熔融加工的共混物形成,并且提供固有的油墨接受表面而无需进一步的表面处理。 基于共混物的总重量,油墨接受共混物包含20至80重量%的水溶性聚合物,基于水不溶性聚合物的20至80重量%。 共混物的熔融温度范围为约100-600EF。 优选的水溶性聚合物包括聚乙烯醇和聚烷基恶唑啉。 本发明优选的受墨基材包括通过共挤出方法同时形成的基层和油墨接收层。 本发明的油墨接收基材可以包括在基层的一个或两个表面上的油墨接受层,和/或可以以压敏粘合剂标签的形式构成,即,将压敏粘合剂材料设置在 基底层的与吸墨层相对的表面。