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1. 发明申请

WO2012143951A2 METHOD AND APPARATUS FOR COMPONENT REMOVAL 审中-公开
标题翻译：组件拆卸的方法和装置
公开(公告)号：WO2012143951A2
公开(公告)日：2012-10-26
申请号：PCT/IN2012/000288
申请日：2012-04-20
申请人： ATTERO RECYCLING PVT. LTD. , DAS, Pranamesh , GUPTA, Nitin
发明人： DAS, Pranamesh , GUPTA, Nitin , SINGH, Khadak , REHMAN, Abdul
CPC分类号： B07B1/46 , B07B1/28 , H05K13/0486
摘要： The proposed invention relates to an apparatus and a method of separating all the parts including but not limited to electronic components, mechanical components, and electromechanical components, modules etc either individually or in sections and modular parts from the main input PCB. The proposed invention is an apparatus and method for component removal during recycling of an electronic device comprising in combination an isothermal system; heating to achieve desired range of temperature within the said isothermal system; at least one system for mechanical handling of the object being recycled; at least one system for selective separation of components being removed.
摘要翻译：所提出的发明涉及一种从主输入PCB单独地或部分地和模块化部分分离所有部件的装置和方法，包括但不限于电子部件，机械部件和机电部件，模块等。所提出的发明是一种用于在电子设备的再循环期间去除元件的装置和方法，包括组合等温系统; 加热以在所述等温系统内实现期望的温度范围; 至少一个用于对所述物体进行机械处理的系统被再循环; 用于选择性分离被除去的组分的至少一个系统。

2. 发明公开

EP2700291A2 METHOD AND APPARATUS FOR COMPONENT REMOVAL 有权
标题翻译： VERFAHREN UND VORRICHTUNG ZUR ENTFERNUNG VON KOMPONENTEN
公开(公告)号：EP2700291A2
公开(公告)日：2014-02-26
申请号：EP12722909.4
申请日：2012-04-20
申请人： Attero Recycling Pvt. Ltd.
发明人： DAS, Pranamesh , GUPTA, Nitin , SINGH, Khadak , REHMAN, Abdul
IPC分类号： H05K13/04
CPC分类号： B07B1/46 , B07B1/28 , H05K13/0486
摘要： The proposed invention relates to an apparatus and a method of separating all the parts including but not limited to electronic components, mechanical components, and electromechanical components, modules etc either individually or in sections and modular parts from the main input PCB. The proposed invention is an apparatus and method for component removal during recycling of an electronic device comprising in combination an isothermal system; heating to achieve desired range of temperature within the said isothermal system; at least one system for mechanical handling of the object being recycled; at least one system for selective separation of components being removed.
摘要翻译：所提出的发明涉及一种从主输入PCB单独或部分和模块化部件分离所有部件的装置和方法，包括但不限于电子部件，机械部件和机电部件，模块等。所提出的发明是一种用于在电子设备的再循环期间去除元件的装置和方法，包括组合等温系统; 加热以在所述等温系统内实现期望的温度范围; 至少一个用于对所述物体进行机械处理的系统被再循环; 用于选择性分离除去的组分的至少一个系统。

3. 发明授权

EP2700291B1 METHOD AND APPARATUS FOR COMPONENT REMOVAL 有权
标题翻译：用于部件移除的方法和设备
公开(公告)号：EP2700291B1
公开(公告)日：2017-11-29
申请号：EP12722909.4
申请日：2012-04-20
申请人： Attero Recycling Pvt. Ltd.
发明人： DAS, Pranamesh , GUPTA, Nitin , SINGH, Khadak , REHMAN, Abdul
IPC分类号： H05K13/04
CPC分类号： B07B1/46 , B07B1/28 , H05K13/0486

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