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1. 发明公开

EP4391741A1 GLASS BARRIER LAYER PRODUCT, AND MANUFACTURE METHOD 审中-公开
公开(公告)号：EP4391741A1
公开(公告)日：2024-06-26
申请号：EP22306993.1
申请日：2022-12-22
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Trischler, Heinrich , Scalbert, Marie , Schlaffer, Erich , Pessl, Walter , De Los Santos, Anna Lucy
IPC分类号： H05K3/38
CPC分类号： H05K1/185 , H05K2201/076920130101 , H05K3/4605 , H05K3/4602 , H05K3/4679 , H05K3/4655 , H05K3/4697 , H05K3/4661 , H05K3/421 , H05K1/116
摘要： There is described a product (100), in particular a component carrier, comprising:
i) an electrically insulating layer structure (102);
ii) an electrically conductive layer structure (104); and
iii) at least one glass barrier layer (150), at least partially sandwiched between the electrically insulating layer structure (102) and the electrically conductive layer structure (104).
The at least one glass barrier layer (150) comprises two main surfaces (150a, 150b), wherein the two main surfaces (150a, 150b) comprise a different adhesion property.
Further, a manufacture method is described.

2. 发明公开

EP3911132A1 COMPONENT CARRIER WITH A SOLID BODY PROTECTING A COMPONENT CARRIER HOLE FROM FOREIGN MATERIAL INGRESSION 有权
公开(公告)号：EP3911132A1
公开(公告)日：2021-11-17
申请号：EP20174070.1
申请日：2020-05-12
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Schlaffer, Erich , Steinkellner, Markus
IPC分类号： H05K3/46
摘要： It is described a component carrier (100) comprising (a) a first stack (110) comprising at least one first electrically conductive layer structure (112) and/or at least one first electrically insulating layer structure (114); (b) a hole (120) formed within the first stack (110); and (c) a non-deformable solid body (130) closing a portion (124) of the hole (120) and being spaced with respect to side walls of the hole (120) by a gap. It is further described a component carrier assembly (160) comprising (a) a component carrier (100) as described above; (b) a second stack (150) comprising at least one second electrically conductive layer structure (152) and/or at least one second electrically insulating layer structure (154); and (c) a connection piece (140) connecting the first stack (110) with the second stack (150). Further described are methods for manufacturing such a component carrier (100) and such a component carrier assembly (160).

3. 发明公开

EP3764759A1 OPPOSING PLANAR ELECTRICALLY CONDUCTIVE SURFACES CONNECTED FOR ESTABLISHING A TWO-DIMENSIONAL ELECTRIC CONNECTION AREA BETWEEN COMPONENT CARRIER STACKS 审中-公开
公开(公告)号：EP3764759A1
公开(公告)日：2021-01-13
申请号：EP19185550.1
申请日：2019-07-10
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Reitmaier, Bernhard , Sattler, Sebastian , Schlaffer, Erich
IPC分类号： H05K3/46
摘要： A component carrier (100) which comprises a first stack (102) comprising at least one first electrically insulating layer structure (104) and at least one first electrically conductive layer structure (106) having a first connection body (110) with a first exposed planar electrically conductive surface (108), and a second stack (112) comprising at least one second electrically insulating layer structure (114) and at least one second electrically conductive layer structure (116) having a second connection body (120) with a second exposed planar electrically conductive surface (118), wherein the first stack (102) and the second stack (112) are connected with each other so that the first exposed planar electrically conductive surface (108) and the second exposed planar electrically conductive surface (118) are connected to establish a vertical two-dimensional electrically conductive connection.

4. 发明公开

EP3211976A1 PRINTED CIRCUIT BOARD WITH ANTENNA STRUCTURE AND METHOD FOR ITS PRODUCTION 审中-公开
标题翻译：具有天线结构的印刷电路板及其制造方法
公开(公告)号：EP3211976A1
公开(公告)日：2017-08-30
申请号：EP16157837.2
申请日：2016-02-29
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Schlaffer, Erich
IPC分类号： H05K3/46 , H01Q1/38
CPC分类号： H01Q1/38 , H01Q1/48 , H01Q19/10 , H05K1/0222 , H05K1/115 , H05K1/185 , H05K3/282 , H05K3/4038 , H05K3/4644 , H05K3/4697 , H05K2201/10098 , H05K2203/06
摘要： The invention relates to a method for producing an intermediate printed circuit board product (80) with an antenna structure (5), comprising the following steps:
- Providing a ground layer (10) comprising optionally a release layer (20) that is removably positioned (22) on an antenna subarea (12) of an exterior side (11) of the ground layer (10);
- Attaching a dielectric insulating layer (30) on the exterior side (11) of the ground layer (10) that is if applicable partly covered by the release layer (20);
- Attaching a conducting layer (40) on an exterior side (31) of the dielectric insulating layer (30);
- Laminating of the layers (10, 20, 30,40) to receive a first semi-finished product (50);
- Manufacturing of an antenna cavity (60) throughout the conducting layer (40) and the dielectric insulating layer (30) with a ground-plane area (62) that is if applicable made up of the release layer (20);
- Attaching a compound signal layer (70) on the conducting layer (40) covering the antenna cavity (60);
- Laminating of the layers (50, 70) to receive the intermediate product (80).
摘要翻译：本发明涉及一种用于制造具有天线结构（5）的中间印刷电路板产品（80）的方法，包括以下步骤： - 提供包括可选地具有可移除地定位的释放层（20）的接地层（22）在所述接地层（10）的外侧（11）的天线分区（12）上; - 在所述接地层（10）的外侧（11）上附接介电绝缘层（30），所述外侧（11）部分地被所述释放层（20）覆盖; - 在介电绝缘层（30）的外侧（31）上附着导电层（40）; - 将层（10,20,30,40）层压以接收第一半成品（50）; - 利用如果适用的由释放层（20）构成的接地平面区域（62）在整个导电层（40）和介电绝缘层（30）中制造天线腔（60）; - 在覆盖天线腔（60）的导电层（40）上附着复合信号层（70）; - 层压层（50,70）以接收中间产品（80）。

5. 发明公开

EP4307023A1 PACKAGE HAVING COMPONENT CARRIER AND EMBEDDED OPTICAL AND ELECTRIC CHIPS WITH HORIZONTAL SIGNAL PATH IN BETWEEN 审中-实审
公开(公告)号：EP4307023A1
公开(公告)日：2024-01-17
申请号：EP22184172.9
申请日：2022-07-11
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Jörg, Tanja , Schlaffer, Erich
IPC分类号： G02B6/42 , H01L21/56 , H01L23/16 , H01L23/31 , H01L25/16
摘要： A package (100), wherein the package (100) comprises a component carrier (102) comprising at least one electrically conductive layer structure (104) and/or at least one electrically insulating layer structure (106), and an optical chip (108) and an electric chip (110) being functionally coupled with each other and being embedded side-by-side in the component carrier (102) so that a signal path (112) between the optical chip (108) and the electric chip (110) is within a horizontal plane.

6. 发明公开

EP4102639A1 RF FUNCTIONALITY AND ELECTROMAGNETIC RADIATION SHIELDING IN A COMPONENT CARRIER 审中-实审
公开(公告)号：EP4102639A1
公开(公告)日：2022-12-14
申请号：EP22188783.9
申请日：2019-06-03
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Leitgeb, Markus , Schrems, Martin , Schlaffer, Erich , Anderson, Steve
IPC分类号： H01Q1/22 , H01L23/66 , H01Q1/52 , H05K1/02 , H01L23/552 , H05K1/18 , H05K3/46
摘要： A component carrier (100) comprising i) an electronic component (110) embedded in the component carrier (100), ii) an antenna structure (120) arranged at a region of a first main surface (102) of the component carrier (100), iii) a shielding structure (130) made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure (120) and the electronic component (110). Hereby, the shielding structure (130) is arranged at least partially between the antenna structure (120) and the electronic component (110). Furthermore, the component carrier (100) comprises an electrically conductive structure (150) to electrically connect the electronic component (110) and the antenna structure (120) through the shielding structure (130). The shielding structure (130) is non-perforated at least in a plane (P) between the antenna structure (120) and the electronic component (110).

7. 发明公开

EP3579334A1 RF FUNCTIONALITY AND ELECTROMAGNETIC RADIATION SHIELDING IN A COMPONENT CARRIER 有权
公开(公告)号：EP3579334A1
公开(公告)日：2019-12-11
申请号：EP19177885.1
申请日：2019-06-03
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Leitgeb, Markus , Schrems, Martin , Schlaffer, Erich , Anderson, Steve
IPC分类号： H01Q1/22 , H01L23/66 , H01Q1/52 , H05K1/02
摘要： A component carrier (100) comprising i) an electronic component (110) embedded in the component carrier (100), ii) an antenna structure (120) arranged at a region of a first main surface (102) of the component carrier (100), iii) a shielding structure (130) made of an electrically conductive material and configured for shielding electromagnetic radiation from propagating between the antenna structure (120) and the electronic component (110). Hereby, the shielding structure (130) is arranged at least partially between the antenna structure (120) and the electronic component (110). Furthermore, the component carrier (100) comprises an electrically conductive structure (150) to electrically connect the electronic component (110) and the antenna structure (120) through the shielding structure (130). The shielding structure (130) is non-perforated at least in a plane (P) between the antenna structure (120) and the electronic component (110).

8. 发明公开

EP3468317A1 KOMPONENTENTRÄGER MIT ZUMINDEST EINEM TEIL AUSGEBILDET ALS DREIDIMENSIONAL GEDRUCKTE STRUKTUR 审中-公开
公开(公告)号：EP3468317A1
公开(公告)日：2019-04-10
申请号：EP18198723.1
申请日：2018-10-04
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Gavagnin, Marco , Silvano De Sousa, Jonathan , Leitgeb, Markus , Moitzi, Heinz , Krivec, Thomas , Grober, Gernot , Schlaffer, Erich , Morianz, Mike , Frauwallner, Rainer , Haidinger, Hubert , Schulz, Gernot , Gmundner, Gernot , Lutschounig, Ferdinand
IPC分类号： H05K3/00 , H05K3/46 , H05K1/02 , H05K1/16 , H05K1/18 , H05K3/10 , H05K3/40
摘要： Es wird ein Komponententräger (100, 300) und Verfahren zum Herstellen eines Komponententrägers (100, 300) beschrieben, wobei der Komponententräger einen Trägerkörper (101, 301) aufweist. Der Trägerkörper (101, 301) weist eine Mehrzahl von elektrisch leitenden Schichtstrukturen (104) und/oder elektrisch isolierenden Schichtstrukturen (103) auf, wobei zumindest ein Teil des Komponententrägers (100, 300) als dreidimensional gedruckte Struktur (1831, 1832, 1833) ausgebildet ist.

9. 发明公开

EP3302006A1 COMPONENT CARRIER COMPRISING AT LEAST ONE HEAT PIPE AND METHOD FOR PRODUCING SAID COMPONENT CARRIER 审中-实审
标题翻译：包括至少一个热管的元件载体以及制造所述元件载体的方法
公开(公告)号：EP3302006A1
公开(公告)日：2018-04-04
申请号：EP16191722.4
申请日：2016-09-30
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Silvano De Sousa, Jonathan , Reitmaier, Bernhard , Schlaffer, Erich , Stahr, Johannes , Schrittwieser, Wolfgang , Weidinger, Gerald , Kasper, Alexander , Grober, Gernot
IPC分类号： H05K1/02
CPC分类号： H01L23/427 , F21V29/51 , F28D15/0275 , F28D20/023 , F28F3/086 , H01L21/673 , H05K1/0203 , H05K1/0206 , H05K1/0207 , H05K1/0272 , H05K2201/064
摘要： The invention refers to a component carrier (1) comprising at least one heat pipe (20), wherein the at least one heat pipe (20) has at least a largely cylindrical heat pipe section (25) with a largely cylindrical profile (26) with an outer diameter (27). The at least one heat pipe (20) is embedded within a recess (50) of at least one inner layer (10, 12, 13, 14, 19) or is surface-mounted on an outer layer (10, 15) of said component carrier (1), wherein at least the largely cylindrical heat pipe section (25) of the heat pipe (20) is thermoconductively coupled by means of at least one adapter means (30, 130, 230, 330) that directly contacts the heat pipe (20) with at least one layer (10, 12, 13, 14, 15, 19) of the component carrier (1). Furthermore the invention refers to several methods for producing said component carrier (1).
摘要翻译：本发明涉及一种包括至少一个热管（20）的部件载体（1），其中所述至少一个热管（20）具有至少一个基本上圆柱形的热管部分（25），该热管部分具有基本上圆柱形的轮廓（26）具有外径（27）。所述至少一个热管（20）嵌入至少一个内层（10,12,13,14,19）的凹部（50）内或者表面安装在所述至少一个内层（10,12,13,14,19）的外层（10,15）其中至少所述热管（20）的大体上圆柱形的热管部分（25）通过至少一个直接接触热量的适配器装置（30,130,230,330）导热地耦合，（20）与所述部件载体（1）的至少一个层（10,12,13,14,15,19）连接。此外，本发明涉及用于产生所述分量载波（1）的几种方法。

10. 发明公开

EP3211977A1 PRINTED CIRCUIT BOARD WITH ANTENNA STRUCTURE AND METHOD FOR ITS PRODUCTION 有权
标题翻译：具有天线结构的印刷电路板及其制造方法
公开(公告)号：EP3211977A1
公开(公告)日：2017-08-30
申请号：EP17158161.4
申请日：2017-02-27
申请人： AT & S Austria Technologie & Systemtechnik Aktiengesellschaft
发明人： Schlaffer, Erich
IPC分类号： H05K3/46 , H01Q1/38
CPC分类号： H01Q1/38 , H01Q1/48 , H01Q19/10 , H05K1/0222 , H05K1/115 , H05K1/185 , H05K3/282 , H05K3/4038 , H05K3/4644 , H05K3/4697 , H05K2201/10098 , H05K2203/06
摘要： The invention relates to a method for producing an intermediate printed circuit board product (80) with an antenna structure (5), comprising the following steps:
- Providing a ground layer (10) comprising optionally a release layer (20) that is removably positioned (22) on an antenna subarea (12) of an exterior side (11) of the ground layer (10);
- Attaching a dielectric insulating layer (30) on the exterior side (11) of the ground layer (10) that is if applicable partly covered by the release layer (20);
- Attaching a conducting layer (40) on an exterior side (31) of the dielectric insulating layer (30);
- Laminating of the layers (10, 20, 30, 40) to receive a first semi-finished product (50);
- Manufacturing of an antenna cavity (60) throughout the conducting layer (40) and the dielectric insulating layer (30) with a ground-plane area (62) that is if applicable made up of the release layer (20);
- Attaching a compound signal layer (70) on the conducting layer (40) covering the antenna cavity (60);
- Laminating of the layers (50, 70) to receive the intermediate product (80).
摘要翻译：本发明涉及一种用于制造具有天线结构（5）的中间印刷电路板产品（80）的方法，包括以下步骤： - 提供包括可选地具有可移除地定位的释放层（20）的接地层（22）在所述接地层（10）的外侧（11）的天线分区（12）上; - 在所述接地层（10）的外侧（11）上附接介电绝缘层（30），所述外侧（11）部分地被所述释放层（20）覆盖; - 在介电绝缘层（30）的外侧（31）上附着导电层（40）; - 将所述层（10,20,30,40）层压以接收第一半成品（50）; - 利用如果适用的由释放层（20）构成的接地平面区域（62）在整个导电层（40）和介电绝缘层（30）中制造天线腔（60）; - 在覆盖天线腔（60）的导电层（40）上附着复合信号层（70）; - 层压层（50,70）以接收中间产品（80）。

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