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1. 发明申请

WO2016135489A1 POROUS HIERARCHICAL SUBSTRATE 审中-公开
标题翻译：多孔分层基板
公开(公告)号：WO2016135489A1
公开(公告)日：2016-09-01
申请号：PCT/GB2016/050477
申请日：2016-02-25
申请人： ASTON UNIVERSITY
发明人： LEE, Adam Fraser , PARLETT, Christopher Michael Andrew , WILSON, Karen
IPC分类号： B01J20/28 , C01B33/12 , B01J20/30 , B01J20/10
CPC分类号： B01J20/103 , B01J20/28092 , B01J20/28097 , B01J20/3057 , C01B33/12
摘要： The present invention provides a method of producing a substrate comprising a porous network. The method comprises forming a substrate precursor containing an array of template particles; and removing the template particles from the substrate precursor using a solvent at a temperature below room temperature to yield the substrate. The present invention also provides a method of producing a substrate comprising a first porous network and a second porous network, the two porous networks being interconnected. The method comprises: forming a substrate precursor containing an array of first template particles and an array of second template particles; selectively removing the first template particles from the substrate precursor to form the first porous network; and subsequently removing the second template particles from the substrate precursor to form the second porous network.
摘要翻译：本发明提供一种生产包括多孔网络的基底的方法。该方法包括形成含有模板颗粒阵列的底物前体; 并使用溶剂在低于室温的温度下从模板前体中除去模板颗粒，得到基材。本发明还提供一种生产包括第一多孔网络和第二多孔网络的基底的方法，所述两个多孔网络互连。该方法包括：形成含有第一模板颗粒阵列和第二模板颗粒阵列的衬底前体; 从所述衬底前体选择性地去除所述第一模板颗粒以形成所述第一多孔网络; 随后从衬底前体中除去第二模板颗粒以形成第二多孔网络。

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