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    • 1. 发明申请
    • SOLVENT-LESS IONIC LIQUID EPOXY RESIN
    • 无溶剂离子液体环氧树脂
    • WO2018081165A1
    • 2018-05-03
    • PCT/US2017/058142
    • 2017-10-24
    • ARIZONA BOARD OF REGENTS ON BEHALF OF ARIZONA STATE UNIVERSITY
    • FRIESEN, CodyBAUTISTA-MARTINEZ, Jose AntonioGONCHARENKO, MykhayloJOHNSON, Paul
    • C07D301/36C07D303/04
    • Solvent free epoxy system that includes: a hardener compound H comprising: a molecular structure (Y 1 -R 1 -Y 2 ), wherein R 1 is an ionic moiety Y 1 is a nucleophilic group and Y 2 nucleophilic group; and an ionic moiety A acting as a counter ion to R 1 ; and an epoxy compound E comprising: a molecular structure (Z 1 R 2 -Z 2 ), wherein R 1 is an ionic moiety, Z 1 comprises an epoxide group, and Z 2 comprises an epoxide group; and an ionic moiety B acting as a counter ion to R 2 . In embodiments, the epoxy compound E and/or the hardener H is comprised in a solvent-less ionic liquid. The systems can further include accelerators, crossiinkers, plasticizers, inhibitors, ionic hydrophobic and/or super-hydrophobic compounds, ionic hydrophilic compounds, ionic transitional hydrophobic/hydrophilic compounds, biological active compounds, and/or plasticizer compounds. Polymers made from the disclosed epoxy systems and their methods of used.
    • 无溶剂环氧体系包括:硬化剂化合物H,其包含:分子结构(Y 1 -R 1 -Y 2) ),其中R 1为离子部分Y 1为亲核基团和Y 2为亲核基团; 以及作为R 1 1抗衡离子的离子部分A; 和环氧化合物E,所述环氧化合物E包含:分子结构(Z 1 R 2 -Z 2),其中R 1 >是离子部分,Z 1包含环氧基团,并且Z 2包含环氧基团; 和作为R 2 2抗衡离子的离子部分B. 在实施方案中,环氧化合物E和/或硬化剂H包含在无溶剂的离子液体中。 该系统可以进一步包括促进剂,交叉剂,增塑剂,抑制剂,离子疏水和/或超疏水化合物,离子亲水化合物,离子过渡疏水/亲水化合物,生物活性化合物和/或增塑剂化合物。 由所公开的环氧体系制成的聚合物及其使用方法。