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1. 发明专利

CA2781958A1 FLUX FOR SOLDER PASTE AND SOLDER PASTE 未知
公开(公告)号：CA2781958A1
公开(公告)日：2011-06-16
申请号：CA2781958
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C6-C15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

2. 发明专利

CA2781958C FLUX FOR SOLDER PASTE AND SOLDER PASTE 未知
公开(公告)号：CA2781958C
公开(公告)日：2015-04-07
申请号：CA2781958
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C13/00
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C6-C15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

3. 发明专利

CA2781956A1 SOLDER PASTE 未知
公开(公告)号：CA2781956A1
公开(公告)日：2011-06-16
申请号：CA2781956
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

4. 发明专利

CA2781956C SOLDER PASTE 未知
公开(公告)号：CA2781956C
公开(公告)日：2014-02-11
申请号：CA2781956
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

5. 发明公开

EP2524763A4 SOLDER PASTE 有权转让
标题翻译：锡膏
公开(公告)号：EP2524763A4
公开(公告)日：2016-10-05
申请号：EP10835925
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI COMPANY LTD , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
CPC分类号： B23K35/3613 , B23K35/362 , C22C12/00 , C22C13/00 , H05K3/3484
摘要： Disclosed is a solder paste that includes, within a flux, an activator that has: a dibasic acid with a molecular weight of no more than 250, a monobasic acid with a molecular weight in the range of 150 to 300, and a dibasic acid with a molecular weight in the range of 300 to 600; and at least one resin additive that is selected from among the group comprising high-density polyethylenes and polypropylenes. The solder paste has in the range of 4 wt% to 12 wt% resin additive within the flux, and the viscosity of the solder paste at 80°C is at least 400 Pa·s.

6. 发明公开

EP2511043A4 FLUX FOR SOLDER PASTE, AND SOLDER PASTE 有权转让
标题翻译：助焊剂焊膏焊膏和
公开(公告)号：EP2511043A4
公开(公告)日：2016-06-29
申请号：EP10835926
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , TOYOTA MOTOR CO LTD , DENSO CORP , FUJITSU TEN LTD , KOKI COMPANY LTD , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , GOTOH KAZUSHI , NAGASAKA SHINSUKE , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI
IPC分类号： B23K35/363 , B23K35/02 , B23K35/26 , B23K35/36 , B23K35/362 , C22C13/00
CPC分类号： B23K35/362 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/3613 , C22C13/00 , H05K3/3489
摘要： Disclosed is a solder paste which has adequate fluidity even after a shear force is repeatedly applied thereto by a screen printing method or the like. Specifically disclosed is a flux for a solder paste, which contains: an acrylic resin that is obtained by radically copolymerizing a (meth)acrylic acid ester having a C 6 -C 15 alkyl group and a (meth)acrylic acid ester other than the above-mentioned (meth)acrylic acid ester; and a rosin. When the weight of the rosin is taken as 1, the weight ratio of the acrylic resin is 0.5-1.2 (inclusive), and the flux for a solder paste is fluidized by the application of a shear force of 10-150 Pa (inclusive).

7. 发明专利

MY158763A SOLDER PASTE 未知
公开(公告)号：MY158763A
公开(公告)日：2016-11-15
申请号：MYPI2012002438
申请日：2010-12-06
申请人： ARAKAWA CHEM IND , KOKI KK , HARIMA CHEMICALS INC
发明人： IWAMURA EIJI , IKEDO KENSHI , ANDOH YOSHIYUKI , SHIRAI TAKESHI , MORI KIMIAKI , WADA RIE , NAKANISHI KENSUKE , AIHARA MASAMI , KUMAMOTO SEISHI , GOTOH KAZUSHI , ISHIGA FUMIO , YOSHIOKA TAKAYASU , UTSUNO MASAYOSHI , NAKAMURA ATSUO , OKOCHI TERUO , SANJI MASAKI , SUKEKAWA TAKUJI
IPC分类号： B23K35/363 , B23K35/26 , C22C12/00 , C22C13/00 , H05K3/34
摘要： DISCLOSED IS A SOLDER PASTE THAT INCLUDES, WITHIN A FLUX, AN ACTIVATOR THAT HAS: A DIBASIC ACID WITH A MOLECULAR WEIGHT OF NO MORE THAN 250, A MONOBASIC ACID WITH A MOLECULAR WEIGHT IN THE RANGE OF 150 TO 300, AND A DIBASIC ACID WITH A MOLECULAR WEIGHT IN THE RANGE OF 300 TO 600; AND AT LEAST ONE RESIN ADDITIVE THAT IS SELECTED FROM AMONG THE GROUP COMPRISING HIGH-DENSITY POLYETHYLENES AND POLYPROPYLENES. THE SOLDER PASTE HAS IN THE RANGE OF 4 WT% TO 12 WT% RESIN ADDITIVE WITHIN THE FLUX, AND THE VISCOSITY OF THE SOLDER PASTE AT 80°C IS AT LEAST 400 PA.S.

8. 发明专利

ES2670524T3 Fundente y pasta para soldar 未知
公开(公告)号：ES2670524T3
公开(公告)日：2018-05-30
申请号：ES13866687
申请日：2013-12-13
申请人： HARIMA CHEMICALS INC
发明人： INOUE KOSUKE , SHIGESADA TETSUYUKI , TAKESHIMA KENICHI , SUKEKAWA TAKUJI , MURATA MASAO
IPC分类号： B23K35/02 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/365 , C22C13/00 , H05K3/34
摘要： Fundente de soldadura, que comprende: una resina acrílica (A) como resina de base que tiene un índice de acidez de 0 a 70 y se obtiene mediante polimerización de una mezcla de monómeros que contiene al menos el 50 % en masa de (met)acrilato de alquilo que tiene un grupo alquilo que tiene de 12 a 23 átomos de carbono; y una resina acrílica (B) como resina de base que tiene un índice de acidez de 30 a 230 y se obtiene mediante polimerización de una mezcla de monómeros que contiene al menos el 50 % en masa de (met)acrilato de alquilo que tiene un grupo alquilo que tiene de 6 a 10 átomos de carbono, en el que el índice de acidez de la resina acrílica (B) es mayor que el índice de acidez de la resina acrílica (A), y la diferencia entre los índices de acidez de estas dos resinas es de o más, midiéndose el índice de acidez según la norma JIS K 0070, en el que el contenido de la resina acrílica (A) es del 10 al 30 % en masa en una cantidad total del fundente, y el contenido de la resina acrílica (B) es del 10 al 30 % en masa en la cantidad total del fundente, y en el que el fundente puede comprender además en la cantidad total del fundente: del 0 al 20 % en masa de otra resina de base, del 0 al 30 % en masa de un activador, del 0 al 13 % en masa de un agente tixotrópico, y del 0 al 35 % en masa de un disolvente orgánico.

9. 发明公开

EP2939784A4 FLUX AND SOLDER PASTE 有权
标题翻译： FLUSSMITTEL UNDLÖTPASTE
公开(公告)号：EP2939784A4
公开(公告)日：2016-08-10
申请号：EP13866687
申请日：2013-12-13
申请人： HARIMA CHEMICALS INC
发明人： INOUE KOSUKE , SHIGESADA TETSUYUKI , TAKESHIMA KENICHI , SUKEKAWA TAKUJI , MURATA MASAO
IPC分类号： B23K35/363 , B23K35/26 , B23K35/36 , B23K35/362 , B23K35/365 , C22C13/00 , H05K3/34
CPC分类号： B23K35/26 , B23K35/0222 , B23K35/0244 , B23K35/025 , B23K35/262 , B23K35/36 , B23K35/3612 , B23K35/3613 , B23K35/362 , B23K35/365 , C22C13/00 , H05K3/3489
摘要： A soldering flux of the present invention contains, as a base resin, an acrylic resin (A) having an acid value of 0 to 70, and an acrylic resin (B) having an acid value of 30 to 230. The acrylic resin (A) is obtained by polymerization of a monomer mixture containing alkyl (meth)acrylate having an alkyl group having carbon atoms of 12 to 23. The acrylic resin (B) is obtained by polymerization of a monomer mixture containing alkyl (meth)acrylate having an alkyl group having carbon atoms of 6 to 10. The acid value of the acrylic resin (B) is higher than the acid value of the acrylic resin (A), and a difference between these two resins is 15 or more.
摘要翻译：本发明的助焊剂含有酸值为0〜70的丙烯酸树脂（A）和酸值为30〜230的丙烯酸树脂（B）作为基础树脂。丙烯酸树脂（A ）是通过使含有碳原子数为12〜23的烷基的（甲基）丙烯酸烷基酯的单体混合物的聚合得到的。丙烯酸树脂（B）是通过使含有具有烷基的（甲基）丙烯酸烷基酯丙烯酸树脂（B）的酸值高于丙烯酸树脂（A）的酸值，这两种树脂之间的差为15以上。

10. 发明专利

DE102010015841B4 Reflow-Lötverfahren 未知
公开(公告)号：DE102010015841B4
公开(公告)日：2022-09-15
申请号：DE102010015841
申请日：2010-03-05
申请人： DENSO CORP
发明人： SUKEKAWA TAKUJI , AKITA NAOYUKI
IPC分类号： B23K1/008
摘要： Reflow-Lötverfahren mit folgenden Schritten:Befördern und Einbringen eines Werkstücks (W) in einer versiegelbaren Behandlungkammer (1) zum Reflow-Löten (S1),Versiegeln der Behandlungskammer (1) (S2),Einleiten eines Inertgases in die Behandlungskammer (1), wobei das Inertgas, welches Stickstoffgas ist, unter einen Druck gesetzt wird, der höher als der Sättigungsdampfdruck des in dem Lötmittel (H) enthaltenen, an dem Werkstück anhaftenden Flussmittels bei einer Lötmittelschmelztemperatur ist (S3),Aufrechterhalten des Drucks der Behandlungskammer (1), der höher als der Sättigungsdampfdruck ist, während einem Erhitzen des Werkstückes (W) auf Schmelzlöttemperatur, um die Temperatur des Werkstückes (W) konstant zu halten (S4),Schmelzen des Lötmittels, das an dem Werkstück bei dem vorherigen Schritt für das Reflow-Löten anhaftete (S5),Abkühlen des Werkstückes (W) zur Verfestigung des Lötmittels (S6) unter Verwendung des Inertgases,Ausleiten des in der Behandlungskammer (1) befindlichen Inertgases , in die Umgebung der Behandlungskammer (1), nachdem das Werkstück (W) bis zu einer festgelegten Temperatur oder darunter abgekühlt worden ist (S7),undnach Beenden des Lötvorgangs, Öffnen der Behandlungskammer (1) und Entnehmen des Werkstückes (W) (S8).

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