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1. 发明申请

WO2008051393A2 REMOVING RESIDUES FROM SUBSTRATE PROCESSING COMPONENTS 审中-公开
标题翻译：从基板加工组件中取出残留物
公开(公告)号：WO2008051393A2
公开(公告)日：2008-05-02
申请号：PCT/US2007022005
申请日：2007-10-15
申请人： APPLIED MATERIALS INC , WEST BRIAN T , BRUECKNER KARL , WU SHUN , HANEY ROBERT
发明人： WEST BRIAN T , BRUECKNER KARL , WU SHUN , HANEY ROBERT
IPC分类号： B08B3/08
CPC分类号： B08B7/0021 , B08B1/00 , B08B3/02 , B08B3/08 , C23C16/4407 , H01J37/32862
摘要： Residues are removed from a surface of a substrate processing component which has a polymer coating below the residues. In one version, the component surfaces are contacted with an organic solvent to remove the residues without damaging or removing the polymer coating. The residues can be process residues or adhesive residues. The cleaning process can be conducted as part of a refurbishment process. In another version, the residues are ablated by scanning a laser across the component surface. In yet another version, the residues are vaporized by scanning a plasma cutter across the surface of the component.
摘要翻译：残留物从具有低于残留物的聚合物涂层的底物处理组分的表面除去。在一个版本中，组分表面与有机溶剂接触以去除残留物而不损坏或去除聚合物涂层。残留物可以是工艺残留物或粘合剂残留物。清洁过程可以作为翻新过程的一部分进行。在另一个版本中，通过在组件表面上扫描激光来消除残留物。在另一个版本中，通过扫描等离子体切割器跨部件的表面来蒸发残留物。

2. 发明专利

JP2005317974A Repolishing of covered chamber components 审中-公开
标题翻译：覆盖室组件的拆卸
公开(公告)号：JP2005317974A
公开(公告)日：2005-11-10
申请号：JP2005130263
申请日：2005-04-27
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： LIN YIXING , XU DAJIANG , HANEY ROBERT , STOW CLIFFORD
IPC分类号： H05H1/46 , B05D3/02 , B08B3/08 , B08B3/12 , B08B7/00 , B08B7/02 , C23C14/56 , H01J9/38 , H01J37/32 , H01L21/205 , H01L21/3065
CPC分类号： H01J37/32431 , B08B3/08 , B08B3/12 , B08B7/0035 , C23C14/564 , H01J9/38
摘要： PROBLEM TO BE SOLVED: To provide a method of repolishing components, which has a method of repolishing and cleaning the components, which does not take an unacceptable long pump down period, gives improved corrosion resistance, and reduces contamination of processed substrate, within a chamber in which the components are used. SOLUTION: The components in the processing chamber are cleaned and repolished. The components has a coating of a first layer and has a structure body with a coating overlying thereon. In order to repolish the components, the first layer is removed and a surface exposed on the structure body is formed. During removing the coating or thereafter, the exposed surface is cleaned by cleaning fluid. Thus, cleaning residue is deposited on the exposed surface. The exposed surface is heated up to a high temperature enough to evaporate the cleaning residue from the surface within substantially non-oxidizing atmosphere. Thereby, the cleaned surface is formed. A second layer is formed over the cleaned surface. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：为了提供一种重新组装方法，其具有不会导致不可接受的长抽空时间的组分的重新洗涤和清洁的方法，提供了改善的耐腐蚀性，并且减少了处理过的基材的污染，在其中使用组件的室内。
解决方案：处理室中的组件被清洁和重新抛光。这些部件具有第一层的涂层，并且具有覆盖在其上的涂层的结构体。为了重新组装组分，去除第一层并形成暴露在结构体上的表面。在去除涂层或其后，通过清洗流体清洁暴露的表面。因此，清洁残留物沉积在暴露的表面上。将暴露的表面加热到足以在基本上非氧化性气氛中从表面蒸发清洁残留物的高温。从而形成清洁表面。在清洁的表面上形成第二层。版权所有（C）2006，JPO＆NCIPI

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