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1. 发明申请

WO2009032021A3 ELECTROPLATING ON ROLL-TO-ROLL FLEXIBLE SOLAR CELL SUBSTRATES 审中-公开
标题翻译：在滚动到滚动的柔性太阳能电池基板上进行电镀
公开(公告)号：WO2009032021A3
公开(公告)日：2009-06-25
申请号：PCT/US2007085959
申请日：2007-11-29
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , EAGLESHAM DAVID , GAY CHARLES
发明人： LOPATIN SERGEY , EAGLESHAM DAVID , GAY CHARLES
IPC分类号： H01L21/00 , H01L31/00
CPC分类号： C25D5/022 , C25D5/18 , C25D7/08 , C25D17/00 , C25D17/001 , H01L31/022425 , H01L31/02245 , H01L31/022466 , H01L31/03926 , H01L31/0465 , H01L31/0508 , H01L31/0512 , H01L31/0516 , H01L31/188 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost flexible solar cell using a novel electroplating method and apparatus to form a metal contact structure.
摘要翻译：本发明的实施例考虑使用新颖的电镀方法和装置形成金属接触结构来形成低成本的柔性太阳能电池。

2. 发明申请

WO2008070528A3 PRECISION PRINTING ELECTROPLATING THROUGH PLATING MASK ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：精密印刷通过太阳能电池基板上的电镀掩模进行电镀
公开(公告)号：WO2008070528A3
公开(公告)日：2008-07-24
申请号：PCT/US2007085963
申请日：2007-11-29
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , DUKOVIC JOHN O , EAGLESHAM DAVID , KOVARSKY NICOLAY Y , BACHRACH ROBERT , BUSCH JOHN , GAY CHARLES
发明人： LOPATIN SERGEY , DUKOVIC JOHN O , EAGLESHAM DAVID , KOVARSKY NICOLAY Y , BACHRACH ROBERT , BUSCH JOHN , GAY CHARLES
IPC分类号： C25D5/18
CPC分类号： H01L31/022425 , H01L31/02008 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel electroplating apparatus and method to form a metal contact structure having metal lines formed using an electrochemical plating process. The apparatus and methods described herein remove the need to perform the often costly processing steps of performing a mask preparation and formation steps, such as screen printing, lithographic steps and inkjet printing steps, to form a contact structure. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新型电镀设备和方法形成低成本太阳能电池，以形成具有使用电化学电镀工艺形成的金属线的金属接触结构。本文描述的装置和方法消除了进行掩模准备和形成步骤（例如丝网印刷，平版印刷步骤和喷墨印刷步骤）经常昂贵的处理步骤以形成接触结构的需要。在太阳能电池装置中形成的互连电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文所述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。

3. 发明申请

WO2008118222A3 SELECTIVE ELECTROLESS DEPOSITION FOR SOLAR CELLS 审中-公开
标题翻译：太阳能电池的选择性电沉积
公开(公告)号：WO2008118222A3
公开(公告)日：2008-12-18
申请号：PCT/US2007085873
申请日：2007-11-29
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , SHANMUGASUNDRAM ARULKUMAR , BACHRACH ROBERT Z , GAY CHARLES , EAGLESHAM DAVID
发明人： LOPATIN SERGEY , SHANMUGASUNDRAM ARULKUMAR , BACHRACH ROBERT Z , GAY CHARLES , EAGLESHAM DAVID
IPC分类号： H01L31/00
CPC分类号： H01L31/022425 , H01L31/022433 , H01L31/02245 , Y02E10/50
摘要： A metal contact structure of a solar cell substrate includes a contact with a conductive layer or a capping layer that is formed using an electroless plating process. The contact may be disposed within a hole formed through the solar cell substrate or on a non-light-receiving surface of the solar cell substrate. The electroless plating process for the conductive layer uses a seed layer that includes an activation layer for electroless plating.
摘要翻译：太阳能电池基板的金属接触结构包括与使用无电解电镀工艺形成的导电层或覆盖层的接触。接触可以设置在通过太阳能电池基板形成的孔内或太阳能电池基板的非光接收表面上。用于导电层的化学镀处理使用包括用于化学镀的活化层的晶种层。

4. 发明申请

WO2008070568A3 APPARATUS AND METHOD FOR ELECTROPLATING ON A SOLAR CELL SUBSTRATE 审中-公开
标题翻译：用于电镀在太阳能电池基板上的装置和方法
公开(公告)号：WO2008070568A3
公开(公告)日：2008-09-12
申请号：PCT/US2007086145
申请日：2007-11-30
申请人： APPLIED MATERIALS INC , LOPATIN SERGEY , KOVARSKY NICOLAY Y , EAGLESHAM DAVID , DUKOVIC JOHN O , GAY CHARLES
发明人： LOPATIN SERGEY , KOVARSKY NICOLAY Y , EAGLESHAM DAVID , DUKOVIC JOHN O , GAY CHARLES
IPC分类号： C25D5/18
CPC分类号： H01L31/022425 , C23C28/021 , C23C28/023 , C23C28/025 , C23C28/028 , C23C28/321 , C23C28/322 , C23C28/3225 , C23C28/34 , C23C28/36 , C25D5/022 , C25D5/08 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/06 , Y02E10/50
摘要： Embodiments of the invention contemplate the formation of a low cost solar cell using a novel method and apparatus to form a metal contact structure having selectively formed metal lines using an electrochemical plating process. The apparatus and methods described herein remove the need to perform one or more high temperature screen printing processes to form conductive features on the surface of a solar cell substrate. The resistance of interconnects formed in a solar cell device greatly affects the efficiency of the solar cell. It is thus desirable to form a solar cell device that has a low resistance connection that is reliable and cost effective. Therefore, one or more embodiments of the invention described herein are adapted to form a low cost and reliable interconnecting layer using an electrochemical plating process containing a common metal, such as copper.
摘要翻译：本发明的实施例考虑使用新颖的方法和装置形成低成本太阳能电池，以形成具有使用电化学电镀工艺的具有选择性地形成的金属线的金属接触结构。本文所述的装置和方法消除了执行一个或多个高温丝网印刷工艺以在太阳能电池基板的表面上形成导电特征的需要。在太阳能电池器件中形成的互连的电阻极大地影响太阳能电池的效率。因此，希望形成具有可靠和成本有效的低电阻连接的太阳能电池装置。因此，本文描述的本发明的一个或多个实施例适用于使用包含普通金属（例如铜）的电化学电镀工艺形成低成本且可靠的互连层。

5. 发明申请

WO2007044555A3 SYSTEM AND METHOD FOR MAKING AN IMPROVED THIN FILM SOLAR CELL INTERCONNECT 审中-公开
标题翻译：用于制造改进的薄膜太阳能电池互连的系统和方法
公开(公告)号：WO2007044555A3
公开(公告)日：2009-04-23
申请号：PCT/US2006039212
申请日：2006-10-06
申请人： APPLIED MATERIALS INC , BORDEN PETER G , EAGLESHAM DAVID
发明人： BORDEN PETER G , EAGLESHAM DAVID
IPC分类号： H02N6/00 , H01L31/042
CPC分类号： H01L31/046 , H01L31/0465 , Y02E10/50
摘要： In a module of photovoltaic cells, a method of forming the module interconnects includes a single cutting process after the deposition of all active layers. This simplifies the overall process to a set of vacuum steps followed by a set of interconnect steps, and may significantly module quality and yield. According to another aspect, an interconnect forming method includes self-aligned deposition of an insulator. This simplifies the process because no alignment is required. According to another aspect, an interconnect forming method includes a scribing process that results in a much narrower interconnect which may significantly boost cell efficiency, and allow for narrower cell sizes. According to another aspect, an interconnect includes an insulator layer that greatly reduces shunt current through the active layer, which can greatly improve cell efficiency.
摘要翻译：在光伏电池的模块中，形成模块互连的方法包括在沉积所有有源层之后的单个切割工艺。这将整个过程简化为一组真空步骤，随后是一组互连步骤，并且可以显着地模块质量和产量。根据另一方面，互连形成方法包括绝缘体的自对准沉积。这简化了过程，因为不需要对齐。根据另一方面，互连形成方法包括划线过程，其导致更窄的互连，其可以显着提高电池效率，并且允许更窄的电池尺寸。根据另一方面，互连包括绝缘体层，其大大减少了通过有源层的分流电流，这可以大大提高电池效率。

6. 发明申请

WO2008014248B1 THIN FILM PHOTOVOLTAIC MODULE WIRING FOR IMPROVED EFFICIENCY 审中-公开
标题翻译：薄膜光伏模块接线，提高效率
公开(公告)号：WO2008014248B1
公开(公告)日：2008-12-18
申请号：PCT/US2007074199
申请日：2007-07-24
申请人： APPLIED MATERIALS INC , BORDEN PETER G , EAGLESHAM DAVID
发明人： BORDEN PETER G , EAGLESHAM DAVID
IPC分类号： H01L25/00 , H01L31/00 , H01L31/042 , H02N6/00
CPC分类号： H01L31/0465 , Y02E10/50
摘要： The present invention relates to configuring and wiring together cells in TF PV modules. According to one aspect, cells are fabricated on one plane on a top surface of a substrate, with wiring patterened on a parallel plane, and vias formed to provide connections between the cell plane and wiring plane. In one embodiment, the wiring plane is on the back surface of the substrate and vias are formed through the substrate. In another embodiment, the wiring plane is on the top surface of the substrate underneath the cell plane and an insulating layer, with the vias formed through the insulating layer. These connections can be wired in a variety of methods, allowing use of series-parallel arrangements so that, for example, local regions could be parallel connected while larger regions series connected.
摘要翻译：本发明涉及将TF PV模块中的电池配置和布线在一起。根据一个方面，将单元制造在衬底的顶表面上的一个平面上，其中在平行平面上布线图案，并且形成通孔以提供单元平面和布线平面之间的连接。在一个实施例中，布线平面位于衬底的背表面上并且穿过衬底形成通孔。在另一个实施例中，布线平面在单元平面下方的衬底的顶表面上以及绝缘层上，并且通孔形成为穿过绝缘层。这些连接可以采用多种方法进行布线，从而允许使用串并联布置，以便例如局部区域可以并联而较大区域串联连接。

7. 发明申请

WO2008014248A3 THIN FILM PHOTOVOLTAIC MODULE WIRING FOR IMPROVED EFFICIENCY 审中-公开
标题翻译：薄膜太阳能电池组件提升效率
公开(公告)号：WO2008014248A3
公开(公告)日：2008-10-30
申请号：PCT/US2007074199
申请日：2007-07-24
申请人： APPLIED MATERIALS INC , BORDEN PETER G , EAGLESHAM DAVID
发明人： BORDEN PETER G , EAGLESHAM DAVID
IPC分类号： H01L25/00 , H01L31/00 , H01L31/042 , H02N6/00
CPC分类号： H01L31/0465 , Y02E10/50
摘要： The present invention relates to configuring and wiring together cells in TF PV modules. According to one aspect, cells are fabricated on one plane on a top surface of a substrate, with wiring patterened on a parallel plane, and vias formed to provide connections between the cell plane and wiring plane. In one embodiment, the wiring plane is on the back surface of the substrate and vias are formed through the substrate. In another embodiment, the wiring plane is on the top surface of the substrate underneath the cell plane and an insulating layer, with the vias formed through the insulating layer. These connections can be wired in a variety of methods, allowing use of series-parallel arrangements so that, for example, local regions could be parallel connected while larger regions series connected.
摘要翻译：本发明涉及将光伏组件中的电池配置和接线在一起。根据一个方面，在衬底的顶表面上的一个平面上制造电池，其中布线平行于平行平面，形成通孔以提供电池平面和布线平面之间的连接。在一个实施例中，布线平面位于基板的背面，并且穿过基板形成通孔。在另一个实施例中，布线平面位于单元平面下方的基板的顶表面和绝缘层，通孔通过绝缘层形成。这些连接可以通过各种方法进行布线，允许使用串并联布置，使得例如，当较大区域串联连接时，局部区域可以并联连接。

8. 发明申请

WO2007115100A3 METHOD FOR FORMING THIN FILM PHOTOVOLTAIC INTERCONNECTS USING SELF ALIGNED PROCESS 审中-公开
标题翻译：使用自对准过程形成薄膜光伏互连的方法
公开(公告)号：WO2007115100A3
公开(公告)日：2008-10-16
申请号：PCT/US2007065515
申请日：2007-03-29
申请人： APPLIED MATERIALS INC , BORDEN PETER G , EAGLESHAM DAVID
发明人： BORDEN PETER G , EAGLESHAM DAVID
IPC分类号： H01L21/00 , H01B13/00
CPC分类号： H01L31/0322 , H01L31/0463 , Y02E10/541
摘要： Processing steps that are useful for forming interconnects in a photovoltaic module are described herein. According to one aspect, a method according to the invention includes processing steps that are similar to those performed in conventional integrated circuit fabrication. For example, the method can include etches to form a conductive step adjacent to the grooves that can be used to form interconnects between cells. According to another aspect the method for forming the conductive step can be self-aligned, such as by positioning a mirror above the module and exposing photoresist from underneath the substrate at an angle one or more times, and etching to expose the conductive step.
摘要翻译：本文描述了可用于在光伏模块中形成互连的处理步骤。根据一个方面，根据本发明的方法包括与常规集成电路制造中执行的步骤相似的处理步骤。例如，该方法可以包括蚀刻以形成邻近凹槽的导电步骤，其可用于在单元之间形成互连。根据另一方面，用于形成导电步骤的方法可以是自对准的，例如通过在模块上方定位反射镜并以一个或多个角度从基底下方曝光光致抗蚀剂，以及蚀刻以暴露导电步骤。

9. 发明专利

JP2012084892A Epitaxial growth of compound nitride semiconductor structures 审中-公开
标题翻译：化合物半导体结构的外延生长
公开(公告)号：JP2012084892A
公开(公告)日：2012-04-26
申请号：JP2011230211
申请日：2011-10-19
申请人： Applied Materials Inc , アプライドマテリアルズインコーポレイテッドApplied Materials,Incorporated
发明人： SANDEEP NIJHAWAN , DAVID BOWIE , ROLY WASHINGTON , JACOB SMITH , RONALD STEVENS , EAGLESHAM DAVID
IPC分类号： H01L21/205 , C23C16/34 , C23C16/56 , H01L33/32
CPC分类号： C30B25/14 , C30B29/403 , C30B35/00 , H01L21/0242 , H01L21/02458 , H01L21/0254 , H01L21/0262 , H01L21/67155
摘要： PROBLEM TO BE SOLVED: To provide an apparatus and methods for fabricating a compound nitride semiconductor structure.SOLUTION: First group-III and nitrogen precursors are flowed into a first processing chamber to deposit a first layer over a substrate with a thermal chemical-vapor-deposition process. The substrate is transferred from the first processing chamber to a second processing chamber. Second group-III and nitrogen precursors are flowed into the second processing chamber to deposit a second layer over the first layer with a thermal chemical-vapor-deposition process. The first and second group-III precursors have different group-III elements.

10. 发明专利

AU2006302366A1 System and method for making an improved thin film solar cell interconnect 未知
公开(公告)号：AU2006302366A1
公开(公告)日：2007-04-19
申请号：AU2006302366
申请日：2006-10-06
申请人： APPLIED MATERIALS INC
发明人： EAGLESHAM DAVID , BORDEN PETER G
IPC分类号： H02N6/00 , H01L31/00
摘要： In a module of photovoltaic cells, a method of forming the module interconnects includes a single cutting process after the deposition of all active layers. This simplifies the overall process to a set of vacuum steps followed by a set of interconnect steps, and may significantly module quality and yield. According to another aspect, an interconnect forming method includes self-aligned deposition of an insulator. This simplifies the process because no alignment is required. According to another aspect, an interconnect forming method includes a scribing process that results in a much narrower interconnect which may significantly boost cell efficiency, and allow for narrower cell sizes. According to another aspect, an interconnect includes an insulator layer that greatly reduces shunt current through the active layer, which can greatly improve cell efficiency.

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