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1. 发明申请

WO2015090380A1 AC POWER CONNECTOR, SPUTTERING APPARATUS AND METHOD THEREFOR 审中-公开
标题翻译：交流电源连接器，溅射装置及其方法
公开(公告)号：WO2015090380A1
公开(公告)日：2015-06-25
申请号：PCT/EP2013/077106
申请日：2013-12-18
申请人： APPLIED MATERIALS, INC. , SCHNAPPENBERGER, Frank , HELLMICH, Anke , KELLER, Stefan , BENDER, Marcus
发明人： SCHNAPPENBERGER, Frank , HELLMICH, Anke , KELLER, Stefan , BENDER, Marcus
IPC分类号： H01J37/32 , H01J37/34 , C23C14/34 , H01G5/04 , H01G5/06 , H01G5/16 , H01R24/38 , H01R24/40 , H03H7/38
CPC分类号： H01J37/32183 , C23C14/3407 , H01G5/04 , H01G5/12 , H01J37/32577 , H01J37/3405 , H01J37/3435 , H01J37/3444 , H01J2237/20214 , H01J2237/3322 , H03H7/004
摘要： An AC power connector (10) for connecting an AC power supply (20) with a device (30) is provided. The AC power connector includes at least one first element (11) connectable with the AC power supply and at least one second element (12) connectable with the device, the first element and the second elements being arranged at a first distance (13) with respect to each other for defining a capacitance, wherein the at least one first element and the at least one second element are rotatable with respect to each other, wherein the first element and the second element are configured for a transfer of an AC power between the at least one first element and the at least one second element.
摘要翻译：提供了用于将AC电源（20）与设备（30）连接的AC电源连接器（10）。 AC电源连接器包括可与AC电源连接的至少一个第一元件（11）和可与该装置连接的至少一个第二元件（12），第一元件和第二元件被布置在第一距离（13）处，彼此相对于限定电容，其中所述至少一个第一元件和所述至少一个第二元件可相对于彼此旋转，其中所述第一元件和所述第二元件被配置为在所述第一元件和所述至少一个第二元件之间传递AC电力至少一个第一元件和至少一个第二元件。

2. 发明申请

WO2011098538A1 METHOD FOR PRODUCING AN ITO LAYER AND SPUTTERING SYSTEM 审中-公开
标题翻译：生产ITO层和溅射系统的方法
公开(公告)号：WO2011098538A1
公开(公告)日：2011-08-18
申请号：PCT/EP2011/051991
申请日：2011-02-10
申请人： APPLIED MATERIALS, INC. , HELLMICH, Anke , SCHNAPPENBERGER, Frank , KREMPEL-HESSE, Joerg
发明人： HELLMICH, Anke , SCHNAPPENBERGER, Frank , KREMPEL-HESSE, Joerg
IPC分类号： C23C14/08 , C23C14/34 , C23C14/35
CPC分类号： C23C14/086 , C23C14/3407 , C23C14/3421 , C23C14/35 , H01J37/3405 , H01J37/342
摘要： The present disclosure relates to a method for producing an indium-tin-oxide layer, comprising: providing a substrate to be coated in a sputtering chamber; providing a rotatable non-bonded target around a backing tube for coating the substrate in the sputtering chamber; and sputtering the material from the target in an atmosphere containing an O 2 /H 2 mixture. Further, the present disclosure relates to a sputtering system comprising a sputtering chamber having at least one gas inlet and being adapted for at least one backing tube for a non-bonded rotatable target, a control device adapted to control the flow through the gas inlet, wherein the control device is adapted to control the at least one gas inlet such that a coating on a substrate using a sputtering process is performed in an atmosphere containing an O 2 /H 2 mixture in the sputtering chamber for forming an indium-tin-oxide layer.
摘要翻译：本公开内容涉及一种制造铟锡氧化物层的方法，包括：在溅射室中提供待涂覆的基板; 在背衬管周围提供可旋转的未粘合的靶，用于在溅射室中涂覆基底; 并在含有O 2 / H 2混合物的气氛中从靶上溅射材料。此外，本公开涉及一种溅射系统，其包括具有至少一个气体入口的溅射室，并且适用于至少一个用于非粘合的可旋转靶的背衬管，适于控制通过气体入口的流动的控制装置，其中所述控制装置适于控制所述至少一个气体入口，使得使用溅射工艺的衬底上的涂层在用于形成铟锡氧化物层的溅射室中的含有O 2 / H 2混合物的气氛中进行。

3. 发明申请

WO2015090373A1 ELECTRODE ASSEMBLY FOR DEPOSITION APPARATUS AND METHOD FOR ASSEMBLING SAID ELECTRODE ASSEMBLY 审中-公开
标题翻译：用于沉积电极的电极组件和组装电极组件的方法
公开(公告)号：WO2015090373A1
公开(公告)日：2015-06-25
申请号：PCT/EP2013/076984
申请日：2013-12-17
申请人： APPLIED MATERIALS, INC. , HELLMICH, Anke , SCHNAPPENBERGER, Frank , LOPP, Andreas , GEBELE, Thomas
发明人： HELLMICH, Anke , SCHNAPPENBERGER, Frank , LOPP, Andreas , GEBELE, Thomas
IPC分类号： H01J37/34
CPC分类号： H01J37/342 , H01J37/3405 , H01J37/3435 , H01J37/3452 , H01J37/3455 , H01J37/3461
摘要： An electrode assembly (120; 200; 300; 400; 700; 800; 900) for a sputter deposition apparatus is provided. The electrode assembly includes an assembly element (210; 310; 410; 710; 810; 910) for at least one of providing material to be deposited and holding a rotatable target; a magnet system (230; 330; 430; 730; 830; 930) disposed inside the assembly element (210; 310; 410; 710; 810; 910); and a pole piece (240; 241; 242; 340; 341; 342; 440; 441; 442; 740; 741; 742; 840; 841; 842; 940; 941; 942) for being disposed between the magnet system and the assembly element. Further, a method for assembling an electrode assembly with a magnet system (230; 330; 430; 730; 830; 930) is described.
摘要翻译：提供了一种用于溅射沉积设备的电极组件（120; 200; 300; 400; 700; 800; 900）。电极组件包括用于至少一个提供要沉积的材料并保持可旋转靶的组件元件（210; 310; 410; 710; 810; 910）设置在所述组件元件（210; 310; 410; 710; 810; 910）内的磁体系统（230; 330; 430; 730; 830; 930）和磁极件（240; 241; 242; 340; 341; 342; 440; 441; 442; 740; 741; 742; 840; 841; 842; 940; 941; 942）装配元件此外，描述了一种用于组装具有磁体系统（230; 330; 430; 730; 830; 930）的电极组件的方法。

4. 发明申请

WO2011006801A1 TARGET BACKING TUBE, CYLINDRICAL TARGET ASSEMBLY AND SPUTTERING SYSTEM 审中-公开
标题翻译：目标后支管，圆柱形目标组件和喷射系统
公开(公告)号：WO2011006801A1
公开(公告)日：2011-01-20
申请号：PCT/EP2010/059658
申请日：2010-07-06
申请人： APPLIED MATERIALS, INC. , SCHNAPPENBERGER, Frank , WEBER, Roland , KREMPEL-HESSE, Joerg , HELLMICH, Anke
发明人： SCHNAPPENBERGER, Frank , WEBER, Roland , KREMPEL-HESSE, Joerg , HELLMICH, Anke
IPC分类号： H01J37/34
CPC分类号： H01J37/3405 , H01J37/3435 , H01J37/3497
摘要： The present application concerns a target backing tube (122) for a rotatable cylindrical target assembly (120) comprising: a tube (122) for at least one target element (126) to be disposed there around, wherein the tube has an exterior surface adapted to be directed to the at least one target element; and a thermal reflection cover (128) covering a portion of at least 20% of the exterior surface of the tube. Further, the present application concerns a rotatable cylindrical target assembly comprising: said target backing tube and at least one target element disposed around the target backing tube, wherein the thermal reflection cover disposed between the target backing tube and the at least one target element.
摘要翻译：本申请涉及一种用于可旋转的圆柱形目标组件（120）的目标支撑管（122），包括：用于至少一个待设置在其周围的目标元件（126）的管（122），其中管具有适于指向至少一个目标元件; 以及覆盖管的外表面的至少20％的一部分的热反射罩（128）。此外，本申请涉及一种可旋转圆柱形目标组件，其包括：所述目标背衬管和围绕目标背衬管设置的至少一个目标元件，其中设置在目标背衬管和至少一个目标元件之间的热反射盖。

5. 发明申请

WO2016180444A1 RADIO FREQUENCY (RF) - SPUTTER DEPOSITION SOURCE, CONNECTOR FOR RETROFITTING A SPUTTER DEPOSITION SOURCE, APPARATUS AND METHOD OF OPERATING THEREOF 审中-公开
标题翻译：无线射频（RF） - 溅射沉积源，改变溅射沉积源的连接器，装置及其操作方法
公开(公告)号：WO2016180444A1
公开(公告)日：2016-11-17
申请号：PCT/EP2015/060229
申请日：2015-05-08
申请人： APPLIED MATERIALS, INC. , SCHNAPPENBERGER, Frank , HELLMICH, Anke
发明人： SCHNAPPENBERGER, Frank , HELLMICH, Anke
IPC分类号： C23C14/34
CPC分类号： C23C14/3407 , H01J37/32082 , H01J37/32577 , H01J37/34
摘要： A deposition source for sputter deposition and a method of operating a deposition source for sputter deposition is provided. The deposition source (100) includes a rotatable cathode (110) having a first end (111) and a second end (112). Further, the deposition source includes an RF power supply (120) for providing the rotatable cathode with RF energy. The first end (112) of the rotatable cathode (110) is connected to a drive (130) for rotating the rotatable cathode (110) via a connecting portion (113), wherein a coil (140) is arranged around the connecting portion (113) for shielding the drive (130) from the RF energy. The method (300) includes feeding (310) a rotatable cathode with RF energy, and shielding (320) a drive (130) for rotating the rotatable cathode (110) from the RF energy.
摘要翻译：提供了用于溅射沉积的沉积源和用于溅射沉积的沉积源的操作方法。沉积源（100）包括具有第一端（111）和第二端（112）的可旋转阴极（110）。此外，沉积源包括用于向可旋转阴极提供RF能量的RF电源（120）。可旋转阴极（110）的第一端（112）连接到用于经由连接部分（113）旋转可旋转阴极（110）的驱动器（130），其中线圈（140）围绕连接部分 113），用于屏蔽驱动器（130）与RF能量。方法（300）包括用RF能量馈送（310）可旋转阴极，并屏蔽（320）用于使可旋转阴极（110）与RF能量旋转的驱动器（130）。

6. 发明申请

WO2015010713A1 CLOSED LOOP CONTROL BY MEASURING OPTICAL PROPERTIES 审中-公开
标题翻译：通过测量光学特性的闭环控制
公开(公告)号：WO2015010713A1
公开(公告)日：2015-01-29
申请号：PCT/EP2013/065411
申请日：2013-07-22
申请人： APPLIED MATERIALS, INC. , SCHNAPPENBERGER, Frank , HELLMICH, Anke
发明人： SCHNAPPENBERGER, Frank , HELLMICH, Anke
IPC分类号： G05B19/042
CPC分类号： G05B19/042
摘要： A method and an apparatus for processing a substrate, particularly for processing a large area substrate are described. The method for processing a large area substrate includes: transporting a large area substrate in a substantially vertically arranged state through a chamber arrangement of an apparatus for processing a large area substrate at a transportation speed; processing the large area substrate using a processing device of the apparatus for processing a large area substrate; monitoring at least one optical property of the substantially vertically arranged large area substrate using a measurement arrangement, wherein the substantially vertically arranged large area substrate is illuminated with diffuse light; and controlling at least one process parameter based on the monitored at least one optical property of the large area substrate.
摘要翻译：描述了用于处理衬底的方法和装置，特别是用于处理大面积衬底的方法和装置。用于处理大面积基板的方法包括：通过用于以传输速度处理大面积基板的装置的室布置，大体上垂直排列的大面积基板传送; 使用用于处理大面积基板的装置的处理装置来处理大面积基板; 使用测量装置监测基本垂直布置的大面积基板的至少一个光学特性，其中基本垂直布置的大面积基板被漫射光照射; 以及基于所监测的所述大面积衬底的至少一个光学特性来控制至少一个工艺参数。

7. 发明申请

WO2015043622A1 METHOD FOR CONTROLLING A GAS SUPPLY AND CONTROLLER 审中-公开
标题翻译：用于控制气体供应和控制器的方法
公开(公告)号：WO2015043622A1
公开(公告)日：2015-04-02
申请号：PCT/EP2013/069857
申请日：2013-09-24
申请人： APPLIED MATERIALS, INC. , SCHNAPPENBERGER, Frank , HELLMICH, Anke , KOCH, Thomas , DEPPISCH, Thomas
发明人： SCHNAPPENBERGER, Frank , HELLMICH, Anke , KOCH, Thomas , DEPPISCH, Thomas
IPC分类号： H01J37/32 , C23C16/455
CPC分类号： C23C14/0042 , C23C14/544 , H01J37/32449 , H01J37/32981 , H01J37/3299
摘要： A method (200) for controlling a gas supply to a process chamber (301) is provided. The method (200) includes: measuring (210) a gas parameter by each of two or more sensors (35, 36, 313, 314) provided in the process chamber (301); determining (220) a combined gas parameter from the measured gas parameters; and controlling (230) the gas supply to the process chamber (301) based on the determined combined gas parameter.
摘要翻译：提供了一种用于控制对处理室（301）的气体供应的方法（200）。方法（200）包括：通过设置在处理室（301）中的两个或多个传感器（35,36,313,314）中的每一个测量（210）气体参数; 根据测量的气体参数确定（220）组合气体参数; 以及基于所确定的组合气体参数来控制（230）到所述处理室（301）的气体供应。

8. 发明申请

WO2015010714A1 APPARATUS AND METHOD FOR PROCESSING A LARGE AREA SUBSTRATE 审中-公开
标题翻译：用于处理大面积基板的装置和方法
公开(公告)号：WO2015010714A1
公开(公告)日：2015-01-29
申请号：PCT/EP2013/065412
申请日：2013-07-22
申请人： APPLIED MATERIALS, INC. , HELLMICH, Anke , SCHNAPPENBERGER, Frank , SCHROEDER, Juergen
发明人： HELLMICH, Anke , SCHNAPPENBERGER, Frank , SCHROEDER, Juergen
IPC分类号： G01N21/47 , G01N21/896 , G01N21/958
CPC分类号： G01N21/474 , G01N21/896 , G01N21/958
摘要： An apparatus (100) for processing a large area substrate (120) and a method for measuring at least one optical property of a substantially vertically arranged large area substrate is described. The apparatus for processing a large area substrate comprises: a chamber arrangement (110) for transporting the large area substrate there through in a vertically arranged state, wherein the chamber arrangement includes at least one chamber, a processing device for processing the vertically arranged large area substrate and an exit port (112) for the vertically arranged large area substrate; a transport system for transporting the substrate through the chamber arrangement; and a measuring arrangement (210) comprising an optical measuring device. The optical measuring device includes an illuminating device (211) for emitting diffuse light onto the vertically arranged large area substrate, and a light detecting device for measuring at least one optical property of the vertically arranged large area substrate.
摘要翻译：描述了一种用于处理大面积基板（120）的设备（100）和用于测量基本垂直布置的大面积基板的至少一个光学特性的方法。用于处理大面积基板的装置包括：用于在垂直布置的状态下输送大面积基板的室配置（110），其中所述室装置包括至少一个室，用于处理垂直布置的大面积的处理装置基板和用于垂直布置的大面积基板的出口（112）; 用于通过所述室装置输送所述基板的输送系统; 和包括光学测量装置的测量装置（210）。光学测量装置包括用于向垂直布置的大面积基板发射漫射光的照明装置（211），以及用于测量垂直布置的大面积基板的至少一个光学特性的光检测装置。

9. 发明申请

WO2011006802A1 TARGET BACKING TUBE, CYLINDRICAL TARGET, AND CYLINDRICAL TARGET ASSEMBLY 审中-公开
标题翻译：目标支管，圆柱目标和圆柱目标组件
公开(公告)号：WO2011006802A1
公开(公告)日：2011-01-20
申请号：PCT/EP2010/059660
申请日：2010-07-06
申请人： APPLIED MATERIALS, INC. , SCHNAPPENBERGER, Frank , WEBER, Roland , KREMPEL-HESSE, Joerg , HELLMICH, Anke
发明人： SCHNAPPENBERGER, Frank , WEBER, Roland , KREMPEL-HESSE, Joerg , HELLMICH, Anke
IPC分类号： H01J37/34
CPC分类号： H01J37/3405 , H01J37/3435
摘要： A target backing tube is described. The target backing tube is for a rotatable target and includes a tube adapted for one or more non-bonded target cylinders to be disposed around the tube, the tube having an exterior surface adapted to face the at least one target cylinder and at least three or more protrusion receiving positions; and protrusions mounted on the exterior surface of the tube at each of the protrusion receiving positions for centering the target cylinders.
摘要翻译：描述了目标背衬管。目标背衬管用于可旋转的靶，并且包括适于一个或多个未粘合的目标圆柱体的管以围绕管布置，所述管具有适于面对至少一个目标圆柱体的外表面和至少三个或更多突出接收位置; 以及在用于使目标气缸对中的每个突起接收位置处安装在管的外表面上的突起。

10. 发明申请

WO2011006799A1 SPUTTERING SYSTEM, ROTATABLE CYLINDRICAL TARGET ASSEMBLY, BACKING TUBE, TARGET ELEMENT AND COOLING SHIELD 审中-公开
标题翻译：喷射系统，可旋转圆柱形目标组件，背管，目标元件和冷却屏蔽
公开(公告)号：WO2011006799A1
公开(公告)日：2011-01-20
申请号：PCT/EP2010/059656
申请日：2010-07-06
申请人： APPLIED MATERIALS, INC. , SCHNAPPENBERGER, Frank , WEBER, Roland , KREMPEL-HESSE, Joerg , HELLMICH, Anke
发明人： SCHNAPPENBERGER, Frank , WEBER, Roland , KREMPEL-HESSE, Joerg , HELLMICH, Anke
IPC分类号： H01J37/34
CPC分类号： H01J37/342 , H01J37/3405 , H01J37/3435 , H01J37/3497
摘要： The application concerns a target backing tube for a rotatable cylindrical target assembly (120) comprising : a tube (122a) for at least one target element (126a) to be disposed there around, wherein the tube has an exterior surface adapted to face the at least one target element, wherein a portion of the exterior surface of the tube has a mean emissivity of 0.7 to 1, wherein the portion is at least 50% of the exterior surface of the tube. Further, the application concerns a cooling shield for a sputtering system comprising a rotatable target, the cooling shield has an interior surface adapted to face a target element of a sputtering system and an exterior surface; wherein a portion of the interior surface of the cooling shield has a mean emissivity of 0.7 to 1, wherein the portion is at least 50% of the interior surface of the cooling shield. Additionally, the application concerns a target element for a rotatable cylindrical target assembly of a sputtering system, wherein the target element an interior surface adapted to face a target backing tube onto which the target cylinder is adapted to be disposed and exterior surface, wherein a portion of the interior surface of the target element has a emissivity of 0.7 to 1, wherein the portion is at least 50% of the interior surface of the target element.
摘要翻译：该应用涉及用于可旋转圆柱形目标组件（120）的目标背衬管，包括：用于至少一个目标元件（126a）的管（122a），其布置在其周围，其中管具有适于面向至少一个目标元件，其中所述管的外表面的一部分的平均发射率为0.7至1，其中所述部分是所述管的外表面的至少50％。此外，该应用涉及包括可旋转靶的溅射系统的冷却屏蔽，冷却屏具有适于面对溅射系统的目标元件和外表面的内表面; 其中所述冷却罩的内表面的一部分的平均发射率为0.7-1，其中所述部分是所述冷却屏蔽的内表面的至少50％。另外，该应用涉及一种用于溅射系统的可旋转圆柱形目标组件的目标元件，其中目标元件适于面向目标背衬管的内表面，目标圆柱体适于放置在其上并且外表面，其中一部分目标元件的内表面的发射率为0.7比1，其中该部分是目标元件的内表面的至少50％。

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