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1. 发明申请

WO2011146208A2 FEEDBACK FOR POLISHING RATE CORRECTION IN CHEMICAL MECHANICAL POLISHING 审中-公开
标题翻译：化学机械抛光抛光率校正反馈
公开(公告)号：WO2011146208A2
公开(公告)日：2011-11-24
申请号：PCT/US2011/033998
申请日：2011-04-26
申请人： APPLIED MATERIALS, INC. , QIAN, Jun , GARRETSON, Charles C. , DHANDAPANI, Sivakumar , DAVID, Jeffrey Drue , LEE, Harry, Q.
发明人： QIAN, Jun , GARRETSON, Charles C. , DHANDAPANI, Sivakumar , DAVID, Jeffrey Drue , LEE, Harry, Q.
CPC分类号： B24B49/04 , B24B49/12
摘要： A substrate having a plurality of zones is polished and spectra are measured. For each zone, a first linear function fits a sequence of index values associated with reference spectra that best match the measured spectra. A projected time at which a reference zone will reach the target index value is determined based on the first linear function, and for at least one adjustable zone, a polishing parameter adjustment is calculated such that the adjustable zone has closer to the target index at the projected time than without such adjustment. The adjustment is calculated based on a feedback error calculated for a previous substrate. The feedback error for a subsequent substrate is calculated based on a second linear function that fits a sequence of index values associated with reference spectra that best match spectra measured after the polishing parameter is adjusted.
摘要翻译：研磨具有多个区域的基板并测量光谱。对于每个区域，第一个线性函数拟合与参考光谱相关联的索引值序列，该参考光谱与测量的光谱最匹配。基于第一线性函数确定参考区域将达到目标指标值的预计时间，并且对于至少一个可调整区域，计算抛光参数调整，使得可调节区域更接近目标索引处的目标索引预计时间比没有这样的调整。基于对先前基板计算的反馈误差来计算调整。基于适合与调整抛光参数之后测量的最佳匹配光谱的参考光谱相关联的索引值序列的第二线性函数来计算后续衬底的反馈误差。

2. 发明申请

WO2008076601A1 DETERMINING PHYSICAL PROPERTY OF SUBSTRATE 审中-公开
标题翻译：确定基材的物理性质
公开(公告)号：WO2008076601A1
公开(公告)日：2008-06-26
申请号：PCT/US2007/085810
申请日：2007-11-28
申请人： APPLIED MATERIALS, INC. , RAVID, Abraham , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , QIAN, Jun , CARLSSON, Ingemar , BENVEGNU, Dominic J. , LEE, Harry Q. , KARUPPIAH, Lakshmanan
发明人： RAVID, Abraham , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , QIAN, Jun , CARLSSON, Ingemar , BENVEGNU, Dominic J. , LEE, Harry Q. , KARUPPIAH, Lakshmanan
IPC分类号： G01B11/06
CPC分类号： G01B11/0683 , G01B11/0625 , Y10S707/99936
摘要： A method of determining a physical property of a substrate includes recording a first spectrum obtained from a substrate, the first spectrum being obtained during a polishing process that alters a physical property of the substrate. The method includes identifying, in a database, at least one of several previously recorded spectra that is similar to the recorded first spectrum. Each of the spectra in the database has a physical property value associated therewith. The method includes generating a signal indicating that a first value of the physical property is associated with the first spectrum, the first value being determined using the physical property value associated with the identified previously recorded spectrum in the database. A system for determining a physical property of a substrate includes a polishing machine, an endpoint determining module, and a database.
摘要翻译：确定衬底的物理性质的方法包括记录从衬底获得的第一光谱，第一光谱是在改变衬底的物理性能的抛光工艺期间获得的。该方法包括在数据库中识别与记录的第一光谱相似的几个先前记录的光谱中的至少一个。数据库中的每个光谱具有与之相关联的物理属性值。该方法包括产生指示物理属性的第一值与第一频谱相关联的信号，第一值使用与数据库中识别的先前记录的频谱相关联的物理属性值来确定。用于确定基板的物理性质的系统包括抛光机，端点确定模块和数据库。

3. 发明申请

WO2012102871A3 GATHERING SPECTRA FROM MULTIPLE OPTICAL HEADS 审中-公开
公开(公告)号：WO2012102871A3
公开(公告)日：2012-08-02
申请号：PCT/US2012/021135
申请日：2012-01-12
申请人： APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , DHANDAPANI, Sivakumar
发明人： DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , DHANDAPANI, Sivakumar
IPC分类号： H01L21/304
摘要： A polishing apparatus includes a platen to hold a polishing pad having a plurality of optical apertures, a carrier head to hold a substrate against the polishing pad, a motor to generate relative motion between the carrier head and the platen, and an optical monitoring system. The optical monitoring system includes at least one light source, a common detector, and an optical assembly configured to direct light from the at least one light source to each of a plurality of separated positions in the platen, to direct light from each position of the plurality of separated positions to the substrate as the substrate passes over said each position, to receive reflected light from the substrate as the substrate passes over said each position, and to direct the reflected light from each of the plurality of separated positions to the common detector.

4. 发明申请

WO2011139575A2 ENDPOINT METHOD USING PEAK LOCATION OF MODIFIED SPECTRA 审中-公开
标题翻译：使用修改光谱的峰位置的端点方法
公开(公告)号：WO2011139575A2
公开(公告)日：2011-11-10
申请号：PCT/US2011/033320
申请日：2011-04-20
申请人： APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , SIN, Garrett Ho , LEE, Harry Q. , BENVEGNU, Dominic J.
发明人： DAVID, Jeffrey Drue , SIN, Garrett Ho , LEE, Harry Q. , BENVEGNU, Dominic J.
IPC分类号： H01L21/304
CPC分类号： B24B37/013 , H01L22/12 , H01L22/26
摘要： A method of optically monitoring a substrate during polishing includes receiving an identification of a selected spectral feature and a characteristic of the selected spectral feature to monitor during polishing, measuring a first spectrum from the substrate during polishing, the first spectrum measured within an initial time following initiation of polishing, measuring a sequence of second spectra from the substrate during polishing, the sequence of second spectra measured after the initial time, for each second spectrum in the sequence of second spectra, removing the first spectrum from the second spectrum to generate a sequence of modified third spectra, determining a value of a characteristic of the selected spectral feature for each third spectrum in the sequence of third spectra to generate a sequence of values for the characteristic, and determining a polishing endpoint or an adjustment for a polishing rate based on the sequence of values.
摘要翻译：在抛光期间光学监测基底的方法包括接收所选择的光谱特征的标识和所选择的光谱特征的特征以在抛光期间监测，在抛光期间测量来自基底的第一光谱，在初始时间之后测量的第一光谱开始抛光，在抛光期间测量来自衬底的第二光谱序列，在初始时间之后测量的第二光谱序列，对于第二光谱序列中的每个第二光谱，从第二光谱去除第一光谱以产生序列修改的第三光谱，确定在第三光谱序列中的每个第三光谱的所选光谱特征的特征值，以产生该特征值的序列，以及基于以下步骤确定抛光终点或抛光速率的调整：值序列。

5. 发明申请

WO2008103964A3 USING SPECTRA TO DETERMINE POLISHING ENDPOINTS 审中-公开
公开(公告)号：WO2008103964A3
公开(公告)日：2008-08-28
申请号：PCT/US2008/054807
申请日：2008-02-22
申请人： APPLIED MATERIALS, INC. , LEE, Harry Q. , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , DAVID, Jeffrey Drue
发明人： LEE, Harry Q. , SWEDEK, Boguslaw A. , BENVEGNU, Dominic J. , DAVID, Jeffrey Drue
IPC分类号： B24B49/00
摘要： Methods of determining a polishing endpoint are described using spectra obtained during a polishing sequence. In particular, techniques for using only desired spectra, faster searching methods and more robust rate determination methods are described.

6. 发明申请

WO2008070736A1 DETERMINING COPPER CONCENTRATION IN SPECTRA 审中-公开
标题翻译：确定光谱中的铜浓度
公开(公告)号：WO2008070736A1
公开(公告)日：2008-06-12
申请号：PCT/US2007/086535
申请日：2007-12-05
申请人： APPLIED MATERIALS, INC. , BENVEGNU, Dominic J. , DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , ZHANG, Jimin , LEE, Harry Q.
发明人： BENVEGNU, Dominic J. , DAVID, Jeffrey Drue , SWEDEK, Boguslaw A. , ZHANG, Jimin , LEE, Harry Q.
IPC分类号： G01N21/55 , G01N21/84 , G01B11/06
CPC分类号： G01B11/0683 , G01N21/55
摘要： Methods of subtracting the copper contribution to spectra obtained from a substrate during chemical mechanical polishing are described. A method of optically determining the amount of area on a substrate that includes a non-dielectric material by making us of a broad band reflectance spectrum of the surface and in particular to determining the concentration of metal such as copper coverage on the surface of a semiconductor as it is gradually reduced during polishing so as to detect the endpoint in a semiconductor etching process. The method is directed to reliably determining the endpoint via the spectral interference pattern resulting from reflections form different dielectric layer interfaces when regions of the substrate are still covered by metal which reflects strongly over the whole wavelength range considered and which tend to mask the reflectance spectrum from the underlying dielectric layers which varies cyclically with decreasing thickness of the dielectric layers.
摘要翻译：描述了在化学机械抛光期间减去从基板获得的光谱对铜的贡献的方法。通过使我们获得表面的宽带反射光谱，特别是确定半导体表面上的金属浓度（例如铜覆盖度）来光学地确定包括非电介质材料的衬底上的面积量的方法因为它在抛光过程中逐渐减少，以便在半导体蚀刻工艺中检测端点。该方法旨在通过由不同介电层界面的反射产生的光谱干涉图形可靠地确定端点，当衬底的区域仍然被在所考虑的整个波长范围内强烈反射并且倾向于掩蔽反射光谱的金属覆盖时底层电介质层随着介电层的厚度逐渐变化而周期性变化。

7. 发明申请

WO2012019044A2 TECHNIQUES FOR MATCHING MEASURED SPECTRA TO REFERENCE SPECTRA FOR IN-SITU OPTICAL MONITORING 审中-公开
标题翻译：将测量的光谱与现场光学监测参考光谱进行匹配的技术
公开(公告)号：WO2012019044A2
公开(公告)日：2012-02-09
申请号：PCT/US2011/046646
申请日：2011-08-04
申请人： APPLIED MATERIALS, INC. , HU, Xiaoyuan , WANG, Zhihong , LEE, Harry Q. , ZHU, Zhize , DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , ZHANG, Jimin , TU, Wen-Chiang
发明人： HU, Xiaoyuan , WANG, Zhihong , LEE, Harry Q. , ZHU, Zhize , DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , ZHANG, Jimin , TU, Wen-Chiang
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B37/013 , B24B37/042 , B24B37/107 , B24B37/205 , B24B49/045 , B24B49/12
摘要： A method of controlling polishing includes storing a library having a plurality of reference spectra, polishing a substrate, measuring a sequence of spectra of light from the substrate during polishing, for each measured spectrum of the sequence of spectra, finding a best matching reference spectrum using a matching technique other than sum of squared differences to generate a sequence of best matching reference spectra, and determining at least one of a polishing endpoint or an adjustment for a polishing rate based on the sequence of best matching reference spectra. Finding a best matching reference spectrum may include performing a cross-correlation of the measured spectrum with each of two or more of the plurality of reference spectra from the library and selecting a reference spectrum with the greatest correlation to the measured spectrum as a best matching reference spectrum.
摘要翻译：控制抛光的方法包括存储具有多个参考光谱的库，抛光衬底，在抛光期间测量来自衬底的光的光谱序列，对于光谱序列的每个测量光谱，使用不同于平方差平方和的匹配技术来找到最佳匹配参考谱以产生最佳匹配参考谱的序列，以及基于最佳匹配序列来确定抛光终点或抛光速率的调整中的至少一个参考光谱。寻找最佳匹配参考光谱可以包括执行测量光谱与来自库的多个参考光谱中的两个或更多个中的每一个的互相关，并选择与测量光谱具有最大相关性的参考光谱作为最佳匹配参考谱。

8. 发明申请

WO2011139571A2 DYNAMICALLY OR ADAPTIVELY TRACKING SPECTRUM FEATURES FOR ENDPOINT DETECTION 审中-公开
标题翻译：用于端点检测的动态或自适应跟踪光谱特征
公开(公告)号：WO2011139571A2
公开(公告)日：2011-11-10
申请号：PCT/US2011/033258
申请日：2011-04-20
申请人： APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , LEE, Harry Q. , LIM, Thian Choi , LAM, Gary Ka Ho
发明人： DAVID, Jeffrey Drue , LEE, Harry Q. , LIM, Thian Choi , LAM, Gary Ka Ho
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： B24B37/042 , B24B37/005 , B24B49/12 , H01L22/12 , H01L22/26
摘要： A method of controlling polishing includes polishing a substrate and receiving an identification of a selected spectral feature, a wavelength range having a width, and a characteristic of the selected spectral feature to monitor during polishing. A sequence of spectra of light from the substrate is measured while the substrate is being polished. A sequence of values of the characteristic of the selected spectral feature is generated from the sequence of spectra. For at least some spectra from the sequence of spectra, a modified wavelength range is generated based on a position of the spectral feature within a previous wavelength range used for a previous spectrum in the sequence of spectra, the modified wavelength range is searched for the selected spectral feature, and a value of a characteristic of the selected spectral feature is determined.
摘要翻译：控制抛光的方法包括抛光衬底并接收所选择的光谱特征的识别，具有宽度的波长范围以及所选择的光谱特征的特征以在抛光期间进行监视。在衬底被抛光的同时测量来自衬底的光的光谱序列。从光谱序列中产生所选光谱特征的特征值的序列。对于来自光谱序列的至少一些光谱，基于在光谱序列中用于先前光谱的先前波长范围内的光谱特征的位置来生成修改的波长范围，将修改的波长范围搜索所选择的光谱特征和所选光谱特征的特征值被确定。

9. 发明申请

WO2010056679A2 SEMI-QUANTITATIVE THICKNESS DETERMINATION 审中-公开
标题翻译：半定量厚度测定
公开(公告)号：WO2010056679A2
公开(公告)日：2010-05-20
申请号：PCT/US2009/063913
申请日：2009-11-10
申请人： APPLIED MATERIALS, INC. , BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , LEE, Harry Q.
发明人： BENVEGNU, Dominic J. , SWEDEK, Boguslaw A. , DAVID, Jeffrey Drue , LEE, Harry Q.
IPC分类号： H01L21/304 , H01L21/66
CPC分类号： H01L22/12 , B24B37/013 , B24B49/12 , H01L22/26
摘要： While a substrate is polished, it is also irradiated with light from a light source. A current spectrum of the light reflected from the surface of the substrate is measured. A selected peak, having a first parameter value, is identified in the current spectrum. A value of a second parameter associated with the first parameter is determined from a lookup table using a processor. Depending on the value of the second parameter, the polishing of the substrate is changed. An initial spectrum of light reflected from the substrate before the polishing of the substrate can be measured and a wavelength corresponding to a selected peak of the initial spectrum can be determined.
摘要翻译：当抛光衬底时，它也用来自光源的光照射。测量从衬底表面反射的光的当前光谱。具有第一参数值的选定峰值在当前谱图中被识别。使用处理器从查找表中确定与第一参数相关联的第二参数的值。根据第二参数的值，改变衬底的抛光。可以测量在抛光衬底之前从衬底反射的初始光谱，并且可以确定对应于初始光谱的选定峰值的波长。

10. 发明申请

WO2010028180A2 ADJUSTING POLISHING RATES BY USING SPECTROGRAPHIC MONITORING OF A SUBSTRATE DURING PROCESSING 审中-公开
标题翻译：通过在加工过程中使用基板的光谱监测来调整抛光率
公开(公告)号：WO2010028180A2
公开(公告)日：2010-03-11
申请号：PCT/US2009/055935
申请日：2009-09-03
申请人： APPLIED MATERIALS, INC. , DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , LEE, Harry Q. , SWEDEK, Boguslaw A.
发明人： DAVID, Jeffrey Drue , BENVEGNU, Dominic J. , LEE, Harry Q. , SWEDEK, Boguslaw A.
IPC分类号： H01L21/304
CPC分类号： B24B37/005 , B24B37/013 , B24B49/12 , H01L21/302
摘要： A computer implemented method includes receiving a sequence of current spectra of reflected light from a substrate; comparing each current spectrum from the sequence of current spectra to a plurality of reference spectra from a reference spectra library to generate a sequence of best match reference spectra; determining a goodness of fit for the sequence of best match reference spectra; and determining at least one of whether to adjust a polishing rate or an adjustment for the polishing rate, based on the goodness of fit.
摘要翻译：计算机实现的方法包括从基板接收反射光的当前光谱序列; 将来自当前光谱序列的每个当前光谱与来自参考光谱库的多个参考光谱进行比较，以生成最佳匹配参考光谱的序列; 确定最佳匹配参考光谱序列的拟合优度; 以及基于拟合优度确定是否调整抛光速率或抛光速率的调整中的至少一个。

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