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1. 发明公开

EP2109878A1 SYSTEM AND METHOD FOR CHEMICAL VAPOR DEPOSITION PROCESS CONTROL 审中-公开
标题翻译： SYSTEM AND METHOD FOR控制化学汽相淀积工艺
公开(公告)号：EP2109878A1
公开(公告)日：2009-10-21
申请号：EP07757045.5
申请日：2007-02-15
申请人： Applied Materials, Inc.
发明人： STOWELL, Michael, W.
IPC分类号： H01L21/00
CPC分类号： C23C16/505 , C23C16/4412 , C23C16/45563 , C23C16/481
摘要： A system and method for controlling deposition of thin films on substrates is disclosed. One embodiment includes providing the substrate; providing a plurality of sources configured to emit electromagnetic radiation; providing a first amount of power to a first of the plurality of sources; and providing a second amount of power to a second of the plurality of sources; wherein the first amount of power and the second amount of power are different to thereby control deposition of the film onto the substrate.

2. 发明申请

WO2008057105A1 SYSTEM AND METHOD FOR HIGH-ENERGY SPUTTERING USING RETURN CONDUCTORS 审中-公开
标题翻译：使用返回导体进行高能量溅射的系统和方法
公开(公告)号：WO2008057105A1
公开(公告)日：2008-05-15
申请号：PCT/US2006/045808
申请日：2006-11-30
申请人： APPLIED MATERIALS, INC. , STOWELL, Michael, W. , RUSKE, Manfred
发明人： STOWELL, Michael, W. , RUSKE, Manfred
IPC分类号： C23C14/00 , C23C14/32
CPC分类号： H01J37/34 , H01J37/32082 , H01J37/3244 , H01J37/3438
摘要： A system and method for sputtering is described. One embodiment includes a sputtering system that includes a vacuum chamber; a gas box secured to the inner surface of the vacuum chamber; a plurality of return conductors engaged with the gas box, the plurality of return conductors extending through the vacuum chamber; and a plurality of seals configured to engage corresponding ones of the plurality of return conductors, the plurality of seal configured to maintain the vacuum inside the vacuum chamber.
摘要翻译：描述了用于溅射的系统和方法。一个实施例包括一个包括真空室的溅射系统; 固定在真空室的内表面上的气箱; 与所述气箱接合的多个返回导体，所述多个返回导体延伸穿过所述真空室; 以及多个密封件，其构造成接合所述多个返回导体中的相应的一个，所述多个密封件构造成将所述真空保持在所述真空室内。

3. 发明申请

WO2009105565A3 INDEX MODIFIED COATING ON POLYMER SUBSTRATE 审中-公开
公开(公告)号：WO2009105565A3
公开(公告)日：2009-08-27
申请号：PCT/US2009/034551
申请日：2009-02-19
申请人： APPLIED MATERIALS, INC. , STOWELL, Michael, W. , CAMPO, Manuel, D.
发明人： STOWELL, Michael, W. , CAMPO, Manuel, D.
IPC分类号： B32B27/36 , B32B7/02 , C08J7/04 , C23C16/513
摘要： The invention includes the structure of a multilayer protective coating, which may have, among other properties, scratch resistance, UV absorption, and an effective refractive index matched to a polymer substrate such as polycarbonate. Each layer may contain multiple components consisting of organic and inorganic materials. The multilayer protective coating includes interleaved organic layers and inorganic layers. The organic layers may have 20% or more organic compounds such as SiOxCyHz. The inorganic layers may have 80% or more inorganic materials, such as SiO 2 , SiOxNy, and ZnO, or mixtures thereof. Each layer of the multilayer protective coating is a micro layer and may have a thickness of 5 angstroms or less in various embodiments. The multilayer protective coating may contain in the order of hundreds or thousands of micro layers, depending upon the design requirement of applications. In each micro layer, the components may have substantially continuous variations in concentration.

4. 发明申请

WO2009096952A1 SYSTEM AND METHOD FOR CONTAINMENT SHIELDING OF PECVD DEPOSITION SOURCES 审中-公开
标题翻译：含有PECVD沉积源的屏蔽系统及方法
公开(公告)号：WO2009096952A1
公开(公告)日：2009-08-06
申请号：PCT/US2008/052381
申请日：2008-01-30
申请人： APPLIED MATERIALS, INC. , STOWELL, Michael, W.
发明人： STOWELL, Michael, W.
IPC分类号： C23C16/00
CPC分类号： C23C16/5093 , H01J37/321 , H01J37/32477 , H01J37/32495 , H01J37/32623
摘要： A system and method for treating a surface of a substrate is described. One embodiment includes a system for treating a surface of a substrate, the system comprising a process chamber, a substrate support positioned inside the process chamber, the substrate support configured to support a substrate, an antenna located inside the process chamber, a containment shield partially surrounding the antenna, the containment shield having an inner volume, the containment shield comprising a base material and a coating on the base material, wherein the coating is pre-coated on the base material, a support gas inlet positioned to supply a support gas to the inner volume of the containment shield, and an at least one aperture in the containment shield, the at least one aperture positioned to enable plasma species to escape the inner volume of the containment shield and collide with the precursor gas.
摘要翻译：描述了用于处理基板表面的系统和方法。一个实施例包括用于处理基板的表面的系统，该系统包括处理室，位于处理室内部的基板支撑件，被配置为支撑基板的基板支撑件，位于处理室内部的天线，部分地围绕所述天线，所述防护罩具有内部容积，所述防护罩包括基材和在所述基材上的涂层，其中所述涂层预涂在所述基底材料上，支撑气体入口，定位成将支撑气体供应到所述安全壳屏蔽件的内部容积以及所述安全壳屏蔽件中的至少一个孔口，所述至少一个孔口被定位成使等离子体物质能够逃离所述容纳罩的内部容积并与所述前体气体碰撞。

5. 发明申请

WO2009096951A1 SYSTEM AND METHOD FOR PRE-IONIZATION OF SURFACE WAVE LAUNCHED PLASMA DISCHARGE SOURCES 审中-公开
标题翻译：表面波发射等离子体放电源预先放电的系统和方法
公开(公告)号：WO2009096951A1
公开(公告)日：2009-08-06
申请号：PCT/US2008/052380
申请日：2008-01-30
申请人： APPLIED MATERIALS, INC. , STOWELL, Michael, W.
发明人： STOWELL, Michael, W.
IPC分类号： A62D3/00
CPC分类号： H01J37/32477 , H01J37/32192 , H01J37/32357 , H01J37/32422
摘要： A system and method for treating a surface of a substrate is described. One embodiment includes a method for depositing a film on a substrate, the method comprising generating a first plurality of power pulses, each of the first plurality of power pulses having a first pulse amplitude, providing the first plurality of power pulses to a first discharge tube, generating a plasma about the first discharge tube using the first plurality of power pulses, sustaining the plasma between each of the first plurality of power pulses such that the plasma is not reignited during each of the first plurality of power pulses, disassociating a feedstock gas using the plasma, and depositing at least a portion of the disassociated feedstock gas onto a substrate.
摘要翻译：描述了用于处理基板表面的系统和方法。一个实施例包括用于在衬底上沉积膜的方法，所述方法包括产生第一多个功率脉冲，第一多个功率脉冲中的每一个具有第一脉冲幅度，将第一多个功率脉冲提供给第一放电管使用所述第一多个功率脉冲在所述第一放电管周围产生等离子体，在所述第一多个功率脉冲中的每一个之间维持所述等离子体，使得所述等离子体在所述第一多个功率脉冲期间的每一个期间不重新点燃，使用等离子体，并将至少一部分脱离的原料气体沉积到基底上。

6. 发明公开

EP2121816A1 LOCALIZED LINEAR MICROWAVE SOURCE ARRAY PUMPING TO CONTROL LOCALIZED PARTIAL PRESSURE IN FLAT AND 3 DIMENSIONAL PECVD COATINGS 审中-公开
标题翻译：局部源微波ARRAY PUMPS用于局部分压扁平和三维PECVD COATINGS CONTROL
公开(公告)号：EP2121816A1
公开(公告)日：2009-11-25
申请号：EP07710482.6
申请日：2007-02-15
申请人： Applied Materials, Inc.
发明人： STOWELL, Michael, W.
IPC分类号： C08J7/06
CPC分类号： C23C16/455 , C23C16/4412 , C23C16/45574 , C23C16/45591 , C23C16/50
摘要： A system and method for controlling deposition of thin films on substrates. One embodiment includes a vacuum chamber; a plurality of sources located inside the vacuum chamber; and a plurality of gas tubes, each of the plurality of gas tubes comprising a first volume for delivering precursor gas and a second volume for providing pumping.

7. 发明申请

WO2015187322A1 WORKPIECE PROCESSING CHAMBER HAVING A ROTARY MICROWAVE PLASMA SOURCE 审中-公开
标题翻译：具有旋转微波等离子体源的工件加工室
公开(公告)号：WO2015187322A1
公开(公告)日：2015-12-10
申请号：PCT/US2015/030485
申请日：2015-05-13
申请人： APPLIED MATERIALS, INC.
发明人： STOWELL, Michael, W. , LIANG, Qiwei
IPC分类号： H01L21/67
CPC分类号： H05B6/80 , H05B6/6402 , H05B6/642 , H05B6/707 , H05B6/725 , H05B6/806
摘要： In a processing reactor having a microwave plasma source, the microwave radiator is mounted on a rotary microwave coupling for continuous rotation.
摘要翻译：在具有微波等离子体源的处理反应器中，微波辐射器安装在用于连续旋转的旋转微波耦合器上。

8. 发明申请

WO2011006128A2 CURVED MICROWAVE PLASMA LINE SOURCE FOR COATING OF THREE-DIMENSIONAL SUBSTRATES 审中-公开
标题翻译：三维基底涂层的曲面微波等离子体线源
公开(公告)号：WO2011006128A2
公开(公告)日：2011-01-13
申请号：PCT/US2010/041609
申请日：2010-07-09
申请人： APPLIED MATERIALS, INC. , STOWELL, Michael, W.
发明人： STOWELL, Michael, W.
IPC分类号： C23C14/22 , C23C14/34 , C23C14/50
CPC分类号： H01J27/16 , C23C16/04 , C23C16/511 , H01J37/32192 , H01J37/3222 , H05H1/46
摘要： Deposition system and methods for dynamic and static coatings are provided. A deposition system for dynamic coating includes a processing chamber, a non-linear coaxial microwave source, and a substrate support member disposed inside the processing chamber for holding a non-planar substrate. The substrate has a first contour along a first direction and a second contour along a second direction orthogonal to the first direction. The deposition system further includes a carrier gas line for providing a flow of sputtering agents inside the processing chamber and a feedstock gas line for providing a flow of precursor gases. The deposition system for static coating includes a substrate support member disposed inside the processing chamber for holding a non-planar substrate and an array of curved coaxial microwave sources within the processing chamber. The curved coaxial microwave sources are spaced along the second direction to cover the substrate.
摘要翻译：提供了动态和静态涂层的沉积系统和方法。用于动态涂覆的沉积系统包括处理室，非线性同轴微波源以及设置在处理室内用于保持非平面基板的基板支撑构件。衬底具有沿着第一方向的第一轮廓和沿着与第一方向正交的第二方向的第二轮廓。沉积系统还包括用于在处理室内提供溅射剂流的载气管线和用于提供前体气体流的原料气管线。用于静态涂覆的沉积系统包括设置在处理室内部的基板支撑构件，用于在处理室内保持非平面基板和弯曲同轴微波源阵列。弯曲的同轴微波源沿第二方向隔开以覆盖基板。

9. 发明申请

WO2010036489A2 MICROWAVE PLASMA CONTAINMENT SHIELD SHAPING 审中-公开
标题翻译：微波等离子体包容屏蔽成形
公开(公告)号：WO2010036489A2
公开(公告)日：2010-04-01
申请号：PCT/US2009/055626
申请日：2009-09-01
申请人： APPLIED MATERIALS, INC. , STOWELL, Michael, W.
发明人： STOWELL, Michael, W.
IPC分类号： H01L21/205 , H01L21/3065 , H05H1/46
CPC分类号： C23C16/515 , C23C16/511 , H01J37/32192 , H01J37/32357 , H01J37/32422 , H01J37/32477
摘要： The present invention provides microwave systems and methods for achieving better control of process and film properties by optimizing plasma containment shield shaping around an antenna. By using a containment shield, plasma generated by microwave may become more homogeneous, and the pressure inside a processing chamber may be reduced. By optimizing the shape of the containment shield, the lifetime of metastable radical species may be increased. One aspect of extending the lifetime of metastable radical species is to allow better control of chemical reaction and thus help achieve the desired film properties. For an array of antennas, the containment shield comprises a dielectric coated metal base with dividers between the antennas. The divider comprises a dielectric material or a mixture of a dielectric layer and a dielectric coated metal layer, and allows coupling among the antennas. Such a dielectric coated metal containment shield may be easier to be manufactured at lower cost than a containment shield comprising only dielectric material such as quartz.
摘要翻译：本发明提供用于通过优化围绕天线的等离子体围护罩成形来更好地控制工艺和膜特性的微波系统和方法。通过使用防护罩，由微波产生的等离子体可以变得更加均匀，并且可以减小处理室内的压力。通过优化防护罩的形状，可以增加亚稳态自由基物质的寿命。延长亚稳态自由基物质寿命的一个方面是允许更好地控制化学反应并因此帮助实现期望的膜性质。对于天线阵列，防护罩包括在天线之间具有分隔器的电介质涂覆的金属基座。分隔器包括介电材料或介电层和介电涂覆金属层的混合物，并且允许天线之间的耦合。这种电介质涂覆的金属屏蔽罩可以比仅包含电介质材料（例如石英）的屏蔽罩更容易以低成本制造。

10. 发明申请

WO2009096954A1 SYSTEM AND METHOD FOR MICROWAVE PLASMA SPECIES SOURCE 审中-公开
标题翻译：微波等离子体源的系统和方法
公开(公告)号：WO2009096954A1
公开(公告)日：2009-08-06
申请号：PCT/US2008/052383
申请日：2008-01-30
申请人： APPLIED MATERIALS, INC. , STOWELL, Michael, W.
发明人： STOWELL, Michael, W.
IPC分类号： H01L21/00
CPC分类号： C23C16/511 , H01J37/32192 , H01J37/32697 , H01L21/67069
摘要： A system and method for treating a surface of a substrate is described. One embodiment includes a system for treating a surface of a substrate, the system comprising a process chamber, a substrate support positioned inside the process chamber, the substrate support configured to support a substrate, an antenna located inside the process chamber, a containment shield, the containment shield partially surrounding the antenna, an aperture in the containment shield, and a plasma species extraction grid positioned at least partially over the aperture.
摘要翻译：描述了用于处理基板表面的系统和方法。一个实施例包括用于处理基板表面的系统，该系统包括处理室，位于处理室内部的基板支撑件，被配置为支撑基板的基板支撑件，位于处理室内的天线，容纳屏蔽件，部分围绕天线的容纳屏蔽，容纳屏蔽中的孔，以及至少部分地位于孔上方的等离子体物质提取栅格。

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