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1. 发明申请

WO2011084181A1 FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE 审中-公开
标题翻译：与电子设备一起使用的折叠盒
公开(公告)号：WO2011084181A1
公开(公告)日：2011-07-14
申请号：PCT/US2010/046815
申请日：2010-08-26
申请人： APPLE INC. , ROHRBACH, Matthew, D. , DIEP, Vinh
发明人： ROHRBACH, Matthew, D. , DIEP, Vinh
IPC分类号： A45C11/00 , A45C13/02 , A45C9/00 , G06F1/16
CPC分类号： G06F1/1633 , A45C3/02 , A45C7/00 , A45C9/00 , A45C11/00 , A45C13/02 , A45C2011/003 , A45C2013/025 , A45C2200/15 , G06F1/1628 , G06F2200/1633 , Y10T29/49826
摘要： This is directed to a case for securing and protecting an electronic device. The case can include a cover connected to a pouch by a hinge such that the cover can be overlaid over a device interface (e.g., a device display). The case can be constructed by layering and combining several types of materials, including for example materials having resistant outer surfaces, materials limiting the deformation of the case, materials providing a soft surface to be placed in contact with the device, and rigid materials for defining a structure of the case. In some embodiments, the case can include a tab that allows a user to fold open the cover of the case to form a triangular prism. The prism can be placed on any of its surfaces such that the device can be oriented towards a user at particular angles (e.g., a typing- specific orientation and a media playback orientation).
摘要翻译：这是针对用于固定和保护电子设备的情况。壳体可以包括通过铰链连接到袋的盖，使得盖可以覆盖在设备接口（例如，设备显示器）上。这种情况可以通过层叠和组合几种类型的材料来构造，例如包括具有耐磨性外表面的材料，限制壳体变形的材料，提供要与设备接触的柔软表面的材料，以及用于限定案例结构。在一些实施例中，该情况可以包括允许用户折叠打开外壳的盖以形成三角形棱镜的突片。棱镜可以放置在其任何表面上，使得该装置可以以特定角度朝向使用者（例如，打字专门定向和媒体播放方向）定向。

2. 发明申请

WO2013033031A1 ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 审中-公开
标题翻译：具有热管理功能的电子器件封装和散热器结构
公开(公告)号：WO2013033031A1
公开(公告)日：2013-03-07
申请号：PCT/US2012/052548
申请日：2012-08-27
申请人： APPLE INC. , DIEP, Vinh , GOH, Chiew-Siang , HEIRICH, Doug , KWAN, Alexander Michael , LOZANO VILLARREAL, Cesar
发明人： DIEP, Vinh , GOH, Chiew-Siang , HEIRICH, Doug , KWAN, Alexander Michael , LOZANO VILLARREAL, Cesar
IPC分类号： H05K7/20 , H05K5/02
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002
摘要： An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.
摘要翻译：电子设备可以具有其中安装电子部件的壳体。电子部件可以安装到诸如印刷电路板的基板上。散热器结构可以散发由电子部件产生的热量。壳体可以具有通过气隙与散热器结构分离的壳体壁。外壳壁可以具有整体的支撑结构。每个支撑结构可以具有突出穿过散热器结构中的对应开口的向内突出的部分。突出部分可以各自具有纵向轴线和位于纵向轴线的圆柱形空腔。每个支撑结构可以具有从纵向轴线径向向外延伸的翅片。

3. 发明申请

WO2014178922A1 WIRELESS ELECTRONIC DEVICE WITH COMPONENT COOLING STRUCTURES 审中-公开
标题翻译：具有组件冷却结构的无线电子设备
公开(公告)号：WO2014178922A1
公开(公告)日：2014-11-06
申请号：PCT/US2014/011009
申请日：2014-01-10
申请人： APPLE INC.
发明人： SINHA, Vikas, K. , SATTERFIELD, Phillip, S. , DIEP, Vinh , DE IULIIS, Daniele
IPC分类号： G06F1/18 , G06F1/20 , G11B33/08 , G11B33/12 , G11B33/14
CPC分类号： G06F1/20 , G06F1/16 , G06F1/182 , G06F1/187 , G11B33/08 , G11B33/124
摘要： An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.
摘要翻译：电子设备可以具有对角地安装在壳体内的硬盘驱动器。电磁干扰屏蔽结构可能包围硬盘驱动器。屏蔽结构可以包括导电弹性体结构。印刷电路板可以与硬盘驱动器对角地平行安装。印刷电路板上的连接器可以以非零角度与印刷电路板成角度，并且可以用滑动件和锁定连接器保持构件保持抵靠壳体。加速度计可以检测设备何时翻转，以便控制电路可以保护硬盘驱动器。风扇可能导致空气在设备的一侧向上流动，并在设备的另一侧向下流动。外壳可以放置在具有倾斜通风孔和整体弹性脚的外壳支撑结构上。

4. 发明公开

EP2521468A1 FOLDABLE CASE FOR USE WITH AN ELECTRONIC DEVICE 审中-公开
标题翻译： FALTBAREHÜLLEZUR VERWENDUNG麻醉师EINER ELEKTRONISCHEN VORRICHTUNG
公开(公告)号：EP2521468A1
公开(公告)日：2012-11-14
申请号：EP10754612.9
申请日：2010-08-26
申请人： Apple Inc.
发明人： ROHRBACH, Matthew, D. , DIEP, Vinh
IPC分类号： A45C11/00 , A45C13/02 , A45C9/00 , G06F1/16
CPC分类号： G06F1/1633 , A45C3/02 , A45C7/00 , A45C9/00 , A45C11/00 , A45C13/02 , A45C2011/003 , A45C2013/025 , A45C2200/15 , G06F1/1628 , G06F2200/1633 , Y10T29/49826
摘要： This is directed to a case for securing and protecting an electronic device. The case can include a cover connected to a pouch by a hinge such that the cover can be overlaid over a device interface (e.g., a device display). The case can be constructed by layering and combining several types of materials, including for example materials having resistant outer surfaces, materials limiting the deformation of the case, materials providing a soft surface to be placed in contact with the device, and rigid materials for defining a structure of the case. In some embodiments, the case can include a tab that allows a user to fold open the cover of the case to form a triangular prism. The prism can be placed on any of its surfaces such that the device can be oriented towards a user at particular angles (e.g., a typing-specific orientation and a media playback orientation).
摘要翻译：这是针对用于固定和保护电子设备的情况。壳体可以包括通过铰链连接到小袋的盖，使得盖可以覆盖在设备接口（例如，设备显示器）上。这种情况可以通过层叠和组合几种类型的材料来构造，例如包括具有耐磨性外表面的材料，限制壳体变形的材料，提供与该装置接触的软表面的材料，以及用于限定案例的结构。在一些实施例中，壳体可以包括允许使用者折叠打开壳体的盖以形成三棱柱的突片。棱镜可以放置在其任何表面上，使得该装置可以以特定角度朝向使用者（例如，打字特定取向和媒体播放方向）定向。

5. 发明公开

EP2752103A1 ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 有权
标题翻译：腔体内热管理功能的电子器件和结构HEAT SINK
公开(公告)号：EP2752103A1
公开(公告)日：2014-07-09
申请号：EP12828505.3
申请日：2012-08-27
申请人： Apple Inc.
发明人： DIEP, Vinh , GOH, Chiew-Siang , HEIRICH, Doug , KWAN, Alexander Michael , LOZANO VILLARREAL, Cesar
IPC分类号： H05K7/20 , H05K5/02
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002
摘要： An electronic device may have a housing in which electronic components are mounted. The electronic components may be mounted to a substrate such as a printed circuit board. A heat sink structure may dissipate heat generated by the electronic components. The housing may have a housing wall that is separated from the heat sink structure by an air gap. The housing wall may have integral support structures. Each of the support structures may have an inwardly protruding portion that protrudes through a corresponding opening in the heat sink structure. The protruding portions may each have a longitudinal axis and a cylindrical cavity that lies along the longitudinal axis. Each of the support structures may have fins that extend radially outward from the longitudinal axis.

6. 发明授权

EP2752103B1 ELECTRONIC DEVICE ENCLOSURES AND HEATSINK STRUCTURES WITH THERMAL MANAGEMENT FEATURES 有权
标题翻译：腔体内热管理功能的电子器件和结构HEAT SINK
公开(公告)号：EP2752103B1
公开(公告)日：2017-03-01
申请号：EP12828505.3
申请日：2012-08-27
申请人： Apple Inc.
发明人： DIEP, Vinh , GOH, Chiew-Siang , HEIRICH, Doug , KWAN, Alexander Michael , LOZANO VILLARREAL, Cesar
IPC分类号： H05K7/20 , H05K5/02
CPC分类号： H05K7/20436 , H05K13/00 , Y10T29/49002

7. 发明申请

WO2014178921A1 ELECTRONIC DEVICE WITH COMPONENT SHIELDING STRUCTURES AND INPUT-OUTPUT CONNECTORS 审中-公开
标题翻译：具有组件屏蔽结构和输入输出连接器的电子设备
公开(公告)号：WO2014178921A1
公开(公告)日：2014-11-06
申请号：PCT/US2014/010983
申请日：2014-01-10
申请人： APPLE INC.
发明人： SINHA, Vikas, K. , SATTERFIELD, Phillip, S. , DIEP, Vinh , DE IULIIS, Daniele
IPC分类号： H05K9/00 , G11B33/14 , G11B33/12 , G11B33/08 , G06F1/18
CPC分类号： H05K9/0015 , G06F1/1656 , G06F1/182 , G06F1/187 , G11B33/08 , G11B33/124 , G11B33/1493 , H05K9/0007 , H05K9/003 , H05K9/0043
摘要： An electronic device may have a hard disk drive mounted diagonally within a housing. Electromagnetic interference shielding structures may enclose the hard disk drive. The shielding structures may include conductive elastomeric structures. A printed circuit board may be mounted diagonally in parallel with the hard disk drive. Connectors on the printed circuit board may be angled away from the printed circuit board at a non-zero angle and may be retained against the housing with a slide and lock connector retention member. An accelerometer may detect when the device is tipped over so that control circuitry may protect the hard disk drive. A fan may cause air to flow upwards on one side of the device and downwards on the other side of the device. The housing may rest on housing support structures with angled air vents and integral elastomeric feet.
摘要翻译：电子设备可以具有对角地安装在壳体内的硬盘驱动器。电磁干扰屏蔽结构可能包围硬盘驱动器。屏蔽结构可以包括导电弹性体结构。印刷电路板可以与硬盘驱动器对角地平行安装。印刷电路板上的连接器可以以非零角度与印刷电路板成角度，并且可以用滑动件和锁定连接器保持构件保持抵靠壳体。加速度计可以检测设备何时翻转，以便控制电路可以保护硬盘驱动器。风扇可能导致空气在设备的一侧向上流动，并在设备的另一侧向下流动。外壳可以放置在具有倾斜通风孔和整体弹性脚的外壳支撑结构上。

8. 发明申请

WO2014046772A1 HEAT SINKING AND ELECTROMAGNETIC SHIELDING STRUCTURES 审中-公开
标题翻译：热沉和电磁屏蔽结构
公开(公告)号：WO2014046772A1
公开(公告)日：2014-03-27
申请号：PCT/US2013/050737
申请日：2013-07-16
申请人： APPLE INC.
发明人： DOLCI, Dominic , SMEENGE, James, G. , DIEP, Vinh , GOH, Chiew-siang
IPC分类号： H01L23/10 , H01L23/34 , H01L23/40 , H01L23/552
CPC分类号： H01L23/10 , H01L23/373 , H01L23/3736 , H01L23/40 , H01L23/4006 , H01L23/552 , H01L24/13 , H01L24/16 , H01L24/32 , H01L24/73 , H01L25/0655 , H01L2224/131 , H01L2224/16225 , H01L2224/32225 , H01L2224/32245 , H01L2224/73253 , H01L2924/12042 , H01L2924/14 , H01L2924/1421 , H01L2924/1434 , H01L2924/16251 , H01L2924/167 , H01L2924/014 , H01L2924/00
摘要： An electronic device may be provided with electronic components such as radio-frequency transceiver integrated circuits and other integrated circuits that are be sensitive to electromagnetic interference. Metal structures are configured to serve both as heat sinking structures for the electrical components and electromagnetic interference shielding. Components are mounted to the substrate using solder. Metal fence structures are also soldered to the substrate. Each metal fence has an opening that covers a respective one of the components. A thermally conductive elastomeric gap filler pad is mounted in the opening. A metal heat spreading structure is electrically shorted to the fence using a conductive gasket that surrounds the gap filler pad so that the structure serves as an electromagnetic interference shield. Heat from the component travels through the gap filler pad to the metal heat spreading structure so that the heat spreading structure may laterally spread and dissipate the heat.
摘要翻译：电子设备可以设置有诸如射频收发机集成电路和对电磁干扰敏感的其他集成电路的电子部件。金属结构被配置为用作电气部件的散热结构和电磁干扰屏蔽。使用焊料将部件安装到基板上。金属栅栏结构也焊接到基板。每个金属围栏具有覆盖相应的一个部件的开口。导热弹性体间隙填充垫安装在开口中。使用围绕间隙填充垫的导电垫片将金属散热结构电气短路到栅栏，使得该结构用作电磁干扰屏蔽。来自组件的热量穿过间隙填充垫移动到金属散热结构，使得散热结构可以横向扩散并散热。

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