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    • 4. 发明申请
    • INTERLOCKING EMI SHIELD
    • 互连EMI屏蔽
    • WO2009134559A1
    • 2009-11-05
    • PCT/US2009/038421
    • 2009-03-26
    • APPLE INC.MYERS, ScottWANG, Erik
    • MYERS, ScottWANG, Erik
    • H05K9/00
    • H05K9/0032Y10T29/49876
    • An electromagnetic interference shield system is provided. Each EMI shield may include a frame (110) providing the structure around the electronic device components to be shielded, and a cover (120) operative to be placed over the frame to prevent electromagnetic radiation from passing over the frame. Each frame may be coupled to a circuit board, and enclose electronic components in need of shielding. Each cover may be coupled to its corresponding frame using at least one snap (124, 154) that extends from the periphery of the cover towards the frame and circuit board. To minimize the space taken by the EMI shields, the snaps of adjacent covers may be offset or staggered so that opposing snaps engage voids left between snaps of the opposing cover, thus reducing the space needed between adjacent EMI shields by up to the width of a snap.
    • 提供电磁干扰屏蔽系统。 每个EMI屏蔽件可以包括提供围绕待屏蔽的电子设备部件的结构的框架(110),以及可操作地放置在框架上以防止电磁辐射超过框架的盖(120)。 每个框架可以耦合到电路板,并且包围需要屏蔽的电子部件。 每个盖可以使用从盖的周边朝向框架和电路板延伸的至少一个卡扣(124,154)联接到其对应的框架。 为了最小化EMI屏蔽件所占的空间,相邻盖板的卡扣可以偏移或交错,使得相对的卡扣与相对的盖子的卡扣之间留下空隙,从而将相邻EMI屏蔽件之间所需的空间减小直到 单元。