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    • 9. 发明申请
    • SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING A SEMICONDUCTOR DEVICE
    • 半导体器件及制造半导体器件的方法
    • WO2007009027A3
    • 2009-04-09
    • PCT/US2006027171
    • 2006-07-12
    • VISHAY GEN SEMICONDUCTOR LLCCHOU PETERZHANG BEAR
    • CHOU PETERZHANG BEAR
    • H01L21/44H01L21/48H01L21/50
    • H01L23/49562H01L23/3114H01L2924/0002H01L2924/13091H01L2924/1815H01L2924/00
    • A semiconductor device mountable to a substrate includes: a semiconductor die (406); an electrically conductive attachment region (404) having a first attachment surface and a second attachment surface, the first attachment surface arranged for electrical communication with the semiconductor die (406); an interface material (206) having a first interface surface and a second interface surface, the first interface surface in contact with the second attachment surface of the electrically conductive attachment region (404); a thermally conductive element (202) in contact with the second interface surface; and a housing (410) at least in part enclosing the semiconductor die (406) and affixed to the thermally conductive element (202). The thermally conductive element (202) and the housing (410) form exterior packaging of the semiconductor device. Heat is removable from the semiconductor die (406) to the exterior packaging via a thermal conduction path formed by the electrically conductive attachment region (404), the interface material (206), and the thermally conductive element (202).
    • 可安装到基板的半导体器件包括:半导体管芯(406); 具有第一附接表面和第二附接表面的导电附接区域(404),所述第一附接表面布置成与半导体管芯(406)电连通; 具有第一界面表面和第二界面表面的界面材料(206),所述第一界面表面与所述导电附接区域(404)的第二附接表面接触; 与所述第二界面表面接触的导热元件(202); 以及至少部分地封装半导体管芯(406)并固定到导热元件(202)的壳体(410)。 导热元件(202)和壳体(410)形成半导体器件的外部封装。 热量可以通过由导电附着区域(404),界面材料(206)和导热元件(202)形成的导热路径从半导体管芯(406)移除到外部封装。