会员体验
专利管家(专利管理)
工作空间(专利管理)
风险监控(情报监控)
数据分析(专利分析)
侵权分析(诉讼无效)
联系我们
交流群
官方交流:
QQ群: 891211   
微信请扫码    >>>
现在联系顾问~
热词
    • 10. 发明申请
    • INDIRECT PULSED LASER MACHINING METHOD OF TRANSPARENT MATERIALS BY BRINGING A ABSORBING LAYER ON THE BACKSIDE OF THE MATERIAL TO BE MACHINED
    • 透明材料的间接激光加工方法通过在待加工的材料的背面上形成吸收层
    • WO2007138370A1
    • 2007-12-06
    • PCT/HU2007/000048
    • 2007-05-25
    • SZEGEDI TUDOMÁNYEGYETEMHOPP, BélaSMAUSZ KOLUMBÁN, TamásVASS, CsabaBOR, Zsolt
    • HOPP, BélaSMAUSZ KOLUMBÁN, TamásVASS, CsabaBOR, Zsolt
    • B23K26/18B23K26/36B23K26/38B23K26/40C03B33/08C03C15/00C03C23/00
    • B23K26/18B23K26/006B23K26/066B23K26/361B23K26/382B23K26/40B23K2203/42B23K2203/50B23K2203/52C03C15/00C03C23/0025C03C2218/355
    • The present invention relates to a novel indirect pulsed laser machining process of a transparent material. The process according to the invention comprises the steps of bringing a transparent material (12), at least in a region (19) thereof to be machined, into coupling with an absorbing layer (18), said coupling ensuring intense heat exchange; directing a laser pulse of a laser light (20) emitted by a laser source (10) through the transparent material (12) into the absorbing layer (18); having the energy of the laser pulse absorbed within a portion of the absorbing layer (18) located in the vicinity of the transparent material's region (19) to be machined, and thereby heating up said absorbing portion of the absorbing layer (18) to boiling and removing mechanically material from the region (19) to be machined through a retroaction exerted on said region (19) by the boiling-away material of the absorbing layer (18), comprising (i) applying as the transparent material (12) such a material that is essentially fully transmissive at the wavelength of the laser light (20), (ii) making the absorbing layer (18) of such a material that is essentially fully absorbing at the wavelength of the laser light (20), (iii) setting the energy of the laser pulse so as to correspond to at least the transparent material's (12) threshold fluence value for etching, and (iv) forming the absorbing layer (18) with such a thickness that ensures boiling away of the absorbing layer (18) in its full thickness at the transparent material's region (19) to be machined as a consequence of absorbing the energy of the laser pulse by it.
    • 本发明涉及透明材料的新型间接脉冲激光加工工艺。 根据本发明的方法包括以下步骤:至少在要加工的区域(19)中使透明材料(12)与吸收层(18)耦合,所述耦合确保强烈的热交换; 将由激光源(10)发射的激光(20)的激光脉冲引导通过透明材料(12)进入吸收层(18); 使吸收层(18)的位于所述透明材料区域(19)附近的部分内的激光脉冲的能量被吸收,从而将吸收层(18)的吸收部分加热至沸腾 以及通过所述吸收层(18)的沸腾材料施加在所述区域(19)上的回复,从要加工的区域(19)中去除机械材料,所述方法包括:(i)作为所述透明材料(12) 在激光(20)的波长处基本上完全透射的材料,(ii)使得在激光(20)的波长上基本上完全吸收的这种材料的吸收层(18),(iii) )将激光脉冲的能量设定为至少对应于用于蚀刻的透明材料(12)阈值注量值,以及(iv)形成具有确保吸收层沸腾的厚度的吸收层(18) (18) 因为通过吸收激光脉冲的能量的结果,在待加工的透明材料区域(19)处的厚度。