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    • 3. 发明申请
    • METHOD AND DEVICE FOR HANDLING A CUT WAFER BLOCK
    • 方法和设备用于处理啥样威化饼块
    • WO2010057671A3
    • 2011-04-07
    • PCT/EP2009008344
    • 2009-11-24
    • SCHMID GMBH & CO GEBHUBER REINHARD
    • HUBER REINHARD
    • B28D5/00H01L21/677
    • H01L21/67706B28D5/0082H01L21/67718
    • In a method for handling a wafer block cut into individual wafers while the block is being held by the carrier device, brushes having bristles as pressing means are moved up to the cut wafer block in horizontal position from both sides, reaching laterally up to the side edges of the wafers and into interspaces between the wafers so as to keep them at a distance. The bristles run along the cut wafer block and can be moved along said longitudinal extension. The cut wafer block is brought out of the horizontal position and into a vertical position while the bristles are pressed on at the same time. Then the bristles are moved away from the top down along the cut wafer block, and in doing so, the bristles are retracted from the interspaces between the individual wafers to lower the individual wafers directly onto one another without any interspaces to form a wafer stack.
    • 在用于处理锯成这仍然是由载体装置保持单独的晶片的晶片块的方法,将是从刷子的两侧与所述刷毛被移动作为加压装置,以在水平位置与锯晶片块连接,所述侧向接近在晶片和侧缘 丰富的,让他们在海湾晶圆之间的空间。 电刷沿着锯晶片块延伸且可沿所述纵向延伸。 锯开晶片块与从水平位置向垂直位置的按压电刷同时带来的。 然后,将电刷同时从空隙拉动其刷毛之间的各个晶片进行直接降低各个晶片彼此无间隙地成晶片堆叠沿锯晶片块移动从上到下程。