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1. 发明专利

JPH0474898A COPPER PLATING DEVICE 失效
公开(公告)号：JPH0474898A
公开(公告)日：1992-03-10
申请号：JP18499090
申请日：1990-07-12
申请人： PERMELEC ELECTRODE LTD , ALMEX INC
发明人： UENO KENICHI , HIRAO KAZUHIRO , YAMAKAWA YOSHINAGA , ICHIKAWA KIYOSHI
IPC分类号： C25D3/38 , C25D7/00 , C25D7/12 , C25D21/14 , H05K3/42
摘要： PURPOSE:To rapidly replenish a dissolved copper compd. into a plating cell by disposing the plating cell and a dissolving cell for dissolving the copper compd. into the plating liquid circulated from the plating cell adjacent to each other. CONSTITUTION:The device body 1 consists of the box type plating cell 2 in the central part, an overflow cell 3 installed integrally to the left side wall of this plating cell 2 and the dissolving cell 5 integrated with the plating cell 2 via a diaphragm 4 which does not permeate the undissolved solid copper compd. and allows the permeation of only the plating liquid on the right side of the plating cell 2. The concn. of the copper ions in the plating liquid 8 decreases on continuation of the plating operation. The concn. of the copper ions is measured by a concn. sensor 10. The solid copper compd. is supplied into the dissolving cell 5 by operating a copper compd. feeding-out device 11 when the measured concn. falls down to the prescribed value or below. This copper compd. is dissolved into the plating liquid 9 in the dissolving cell 5 by a stirring vane 12. The plating liquid is supplied through the diaphragm 4 into the plating cell 2. Then, the concn. of the copper ions in the plating cell 2 is maintained within the prescribed range in this way.

2. 发明专利

JPH0499898A ANODE STRUCTURE IN PLATING DEVICE 失效
公开(公告)号：JPH0499898A
公开(公告)日：1992-03-31
申请号：JP21563690
申请日：1990-08-15
申请人： ALMEX INC , PERMELEC ELECTRODE LTD
发明人： ICHIKAWA KIYOSHI , USUDA HITOSHI , UENO KENICHI , HIRAO KAZUHIRO
IPC分类号： C25D17/00 , C25D7/00 , C25D17/10 , C25D17/12
摘要： PURPOSE:To obtain an anode structure which is easy in maintenance and replacement work of a diaphragm and simple in handling, miniature and lightweight by integrating a case main body, an insoluble plate electrode, the diaphragm and a ribbed body and providing the opening and closing means of a passage. CONSTITUTION:The face opposite to the object to be plated is closed by a diaphragm 31 to form the holding space S in a case 11 main body. A diaphragm electrode 10 is formed of an insoluble plate electrode 21 detachably formed in the holding space S, a sealing member, a spacer 15 and a ribbed body 41. A passage 50 for passing plating liquid is provided to the case 11 main body. A plating tank is communicated with the holding space S by this passage 50. Moreover an opening and closing means 60 of the passage is provided to open and close the passage 50 from the outer part of plating liquid contained in the plating tank. Thereby a miniature plating device is widely dissaminated at a low cost which is capable of exhibiting advantages such as both prevention of decomposition in an additive due to adoption of the insoluble anode and shortening of the distance between electrodes.

3. 发明专利

JPH04284691A ELECTRICALLY PLATING METHOD FOR PRINTED CIRCUIT BOARD 失效
公开(公告)号：JPH04284691A
公开(公告)日：1992-10-09
申请号：JP4821991
申请日：1991-03-13
申请人： ALMEX INC , PERMELEC ELECTRODE LTD
发明人： SUGIHARA YUMIO , TSURU KAZUTO , ANDO SHIGEKAZU , TSUJI HIDENORI , HIRAO KAZUHIRO
IPC分类号： C25D7/00 , H05K3/42
摘要： PURPOSE:To prevent a high concentration of copper at the time of plating and to always plate with high throwing power in an electrically plating method for a printed circuit board in a plating tank containing low copper concentration and high sulfuric acid concentration. CONSTITUTION:In an electrically plating method to be treated by conducting between a soluble copper anode 5 dipped in a plating tank 2 and a printed circuit board 6 of a cathode, an insoluble auxiliary anode 15 separate from the anode 5 is dipped in the tank 2, and a part of a current flowing between the anode 5 and the board 6 flows between the anode 15 and the board 6 to be treated.

4. 发明专利

JPH0499897A HORIZONTAL CARRIER TYPE PLATING DEVICE 失效
公开(公告)号：JPH0499897A
公开(公告)日：1992-03-31
申请号：JP21563890
申请日：1990-08-15
申请人： ALMEX INC , PERMELEC ELECTRODE LTD
发明人： USUDA HITOSHI , YAMAKAWA YOSHINAGA , UENO KENICHI , HIRAO KAZUHIRO
IPC分类号： C25D7/00 , C25D17/00 , C25D17/10 , C25D17/12 , C25D21/04 , H05K3/24
摘要： PURPOSE:To continuously perform high-quality plating treatment by forming the upper and lower-side electrodes into a diaphragm electrode structure and providing a small hole to the upper-side electrode and obliquely arranging the diaphragm of the lower-side electrode and providing a venting means to constitute a horizontal carrier type plating device. CONSTITUTION:A diaphragm electrode structure described below is formed. The upper and lower-side electrodes 21, 21 are horizontally opposed and arranged in a plating tank 1. The opposite face sides of the electrodes 21, 21 are covered with the diaphragms 31, 31. The insoluble plate electrodes (the upper and lower-side electrodes) 21, 21 are provided in the closed spaces S. A small hole 22 perforating both faces is provided to the upper-side insoluble plate electrode 21 in the diaphragm electrode structure. The venting holes 12 are made in the upper part side of the closed space S. The lower-side diaphragm 31 in the diaphragm electrode structure is arranged obliquely to the bottom face of the plating tank 1. Moreover a venting hole 16 is made in the side wherein the diaphragm 31 in the closed space S is raised. Thereby inspecting work of the disphragms is rapidly and easily performed.

5. 发明专利

JPH0499899A PLATING DEVICE 失效
公开(公告)号：JPH0499899A
公开(公告)日：1992-03-31
申请号：JP21563790
申请日：1990-08-15
申请人： ALMEX INC , PERMELEC ELECTRODE LTD
发明人： USUDA HITOSHI , YAMAKAWA YOSHINAGA , UENO KENICHI , HIRAO KAZUHIRO
IPC分类号： C25D17/12 , C25D7/00 , C25D21/00 , C25D21/12
摘要： PURPOSE:To perform high-quality plating treatment with high efficiency by forming an anode of a plurality of insoluble electrode elements and providing both a selective setting means and a selective feeding means and supplying electricity to only the selected insoluble electrode elements. CONSTITUTION:An anode 3 is formed into a plate shape consisting of a plurality of insoluble electrode elements 3A arranged in a matrix. The insoluble electrode element 3A to be supplied with electricity is selected and set by a selective setting means 10. Only the insoluble electrode element 3A selected by a selective feeding means 20 is connected to a power source device 30. A plating device is constituted so that the electricity conductive amount per unit area of a plate- shaped plating object is selected and automatically regulated. Thereby the plating device is automatically regulated to the required current distribution in comformity with the plating object.

6. 发明专利

DE69113723T2 未知
公开(公告)号：DE69113723T2
公开(公告)日：1996-04-04
申请号：DE69113723
申请日：1991-08-15
申请人： ALMEX INC , PERMELEC ELECTRODE LTD
发明人： USUDA HITOSHI , YAMAKAWA RYOEI , UENO KENICHI , HIRAO KAZUHIRO
IPC分类号： C25D7/00 , C25D17/00 , C25D17/10 , C25D17/12 , C25D21/04 , H05K3/24
摘要： According to the present invention, an upper electrode and a lower electrode are integrally assembled with insoluble electrodes (21) and diaphragm (31) in diaphragm electrode structure. Small holes are furnished on the upper electrode, and the diaphragm of the upper electrode is installed obliquely with degassing means. (12,13) (16,17) By simply carrying the objects to be plated (5) in horizontal direction, uniform and high quality electroplating can be continuously performed with extensive increase in productivity, while enjoying all of the benefits such as shorter interpolar distance between two electrodes, compact design of the apparatus, saving of expensive additives, etc. Further, the inspection of the diaphragm and the like can be rapidly and easily accomplished, and perfect protection of the diaphragm is assured, thus providing a horizontal carrying type electroplating apparatus suitable for practical use.

7. 发明专利

DE69113723D1 未知
公开(公告)号：DE69113723D1
公开(公告)日：1995-11-16
申请号：DE69113723
申请日：1991-08-15
申请人： ALMEX INC , PERMELEC ELECTRODE LTD
发明人： USUDA HITOSHI , YAMAKAWA RYOEI , UENO KENICHI , HIRAO KAZUHIRO
IPC分类号： C25D7/00 , C25D17/00 , C25D17/10 , C25D17/12 , C25D21/04 , H05K3/24
摘要： According to the present invention, an upper electrode and a lower electrode are integrally assembled with insoluble electrodes (21) and diaphragm (31) in diaphragm electrode structure. Small holes are furnished on the upper electrode, and the diaphragm of the upper electrode is installed obliquely with degassing means. (12,13) (16,17) By simply carrying the objects to be plated (5) in horizontal direction, uniform and high quality electroplating can be continuously performed with extensive increase in productivity, while enjoying all of the benefits such as shorter interpolar distance between two electrodes, compact design of the apparatus, saving of expensive additives, etc. Further, the inspection of the diaphragm and the like can be rapidly and easily accomplished, and perfect protection of the diaphragm is assured, thus providing a horizontal carrying type electroplating apparatus suitable for practical use.

8. 发明申请

WO2013099780A3 HIGH-LOAD DURABLE ANODE FOR OXYGEN GENERATION AND MANUFACTURING METHOD FOR THE SAME 审中-公开
标题翻译：用于氧发生的高负载耐用阳极及其制造方法
公开(公告)号：WO2013099780A3
公开(公告)日：2013-10-10
申请号：PCT/JP2012083168
申请日：2012-12-14
申请人： PERMELEC ELECTRODE LTD
发明人： CAO YI , KATO AKIHIRO , HIRAO KAZUHIRO , FURUSAWA TAKASHI
IPC分类号： C25B11/04
CPC分类号： C25B11/0473 , C25B1/02 , C25B1/04 , C25B11/0405 , C25B11/0478 , C25B11/0484 , Y02E60/366
摘要： The present invention aims to provide a high-load durable anode for oxygen generation and a manufacturing method for the same used for industrial electrolyses including manufacturing of electrolytic metal foils such as electrolytic copper foil, aluminum liquid contact and continuously electrogalvanized steel plate, and metal extraction, having superior durability under high-load electrolysis conditions. The present invention features an anode for oxygen generation and a manufacturing method for the same comprising a conductive metal substrate and a catalyst layer containing iridium oxide formed on the conductive metal substrate wherein the amount of coating of iridium per time for the catalyst layer is 2g/m2 or more, the coating is baked in a relatively high temperature region of 430 degrees Celsius - 480 degrees Celsius to form the catalyst layer containing amorphous iridium oxide and the catalyst layer containing the amorphous iridium oxide is post-baked in a further high temperature region of 520 degrees Celsius - 600 degrees Celsius to crystallize almost all amount of iridium oxide in the catalyst layer.
摘要翻译：本发明的目的在于提供一种用于氧发生的高负荷耐久阳极及其制造方法，其包括制造电解金属箔如电解铜箔，铝液接触和连续电镀锌钢板以及金属萃取在高负荷电解条件下具有优异的耐久性。本发明的特征在于一种用于氧气产生的阳极及其制造方法，该阳极包括导电金属基底和在导电金属基底上形成的含有氧化铱的催化剂层，其中催化剂层每次涂覆铱的量为2g / m2以上时，在430〜480摄氏度的较高温度区域进行涂布，形成含有非晶质氧化铱的催化剂层，并且将含有非晶质氧化铱的催化剂层在更高温区域进行后烘烤 520摄氏度-600摄氏度以结晶催化剂层中几乎所有量的氧化铱。

9. 发明申请

WO2013100165A2 ANODE FOR OXYGEN GENERATION AND MANUFACTURING METHOD FOR THE SAME 审中-公开
标题翻译：用于氧气生成和制造方法的阳极
公开(公告)号：WO2013100165A2
公开(公告)日：2013-07-04
申请号：PCT/JP2012084263
申请日：2012-12-25
申请人： PERMELEC ELECTRODE LTD
发明人： CAO YI , KATO AKIHIRO , HIRAO KAZUHIRO , FURUSAWA TAKASHI
IPC分类号： C25B11/04
CPC分类号： C25B11/0473 , C25B1/02 , C25B1/04 , C25B11/0478 , Y02E60/366
摘要： The present invention aims to provide an anode for oxygen generation and a manufacturing method for the same used for industrial electrolyses including manufacturing of electrolytic metal foils such as electrolytic copper foil, aluminum liquid contact and continuously electrogalvanized steel plate, and metal extraction. The present invention features an anode for oxygen generation and a manufacturing method for the same comprising a conductive metal substrate and a catalyst layer containing iridium oxide formed on the conductive metal substrate wherein the coating is baked in a low temperature region of 370°C - 400°C in an oxidation atmosphere to form the catalyst layer containing amorphous iridium oxide and the catalyst layer containing amorphous iridium oxide is post-baked in a further high temperature region of 520°C - 600°C in an oxidation atmosphere to crystallize almost all amount of iridium oxide in the catalyst layer.
摘要翻译：本发明的目的在于提供一种氧气生成用阳极及其制造方法，其包括电解铜箔，铝液接触，连续电镀锌钢板等电解金属箔的制造以及金属萃取。本发明的特征在于用于产生氧气的阳极及其制造方法，其包括导电金属基板和在导电金属基板上形成的含有氧化铱的催化剂层，其中涂层在370℃-400℃的低温区域中烘烤在氧化气氛中形成含有无定形氧化铱的催化剂层，将含有非晶态氧化铱的催化剂层在氧化气氛中在520℃〜600℃的另外的高温区域进行后烘烤，结晶几乎全部量的氧化铱在催化剂层中。

10. 发明申请

WO2013100162A3 ANODE FOR OXYGEN GENERATION AND MANUFACTURING METHOD FOR THE SAME 审中-公开
标题翻译：用于氧气生成和制造方法的阳极
公开(公告)号：WO2013100162A3
公开(公告)日：2013-10-10
申请号：PCT/JP2012084260
申请日：2012-12-25
申请人： PERMELEC ELECTRODE LTD
发明人： CAO YI , KATO AKIHIRO , HIRAO KAZUHIRO , FURUSAWA TAKASHI
IPC分类号： C25B11/04
CPC分类号： C25B11/0473 , C23C14/325 , C25B1/02 , C25B1/04 , C25B11/0431 , C25B11/0478 , C25B11/0484 , Y02E60/366
摘要： The present invention aims to provide an anode for oxygen generation and a manufacturing method for the same used for industrial electrolyses including manufacturing of electrolytic metal foils such as electrolytic copper foil, aluminum liquid contact and continuously electrogalvanized steel plate, and metal extraction. The present invention features an anode for oxygen generation and a manufacturing method for the same comprising a conductive metal substrate and a catalyst layer containing iridium oxide formed on the conductive metal substrate wherein the coating is baked in a high temperature region of 410°C - 450°C in an oxidation atmosphere to form the catalyst layer co-existing amorphous and crystalline iridium oxide and the catalyst layer co-existing the amorphous and crystalline iridium oxide is post-baked in a further high temperature region of 520°C - 560°C in an oxidation atmosphere to crystallize almost all amount of iridium oxide in the catalyst layer.
摘要翻译：本发明的目的在于提供一种氧气生成用阳极及其制造方法，其包括电解铜箔，铝液接触，连续电镀锌钢板等电解金属箔的制造以及金属萃取。本发明的特征在于用于产生氧气的阳极及其制造方法，其包括导电金属基板和在导电金属基板上形成的含有氧化铱的催化剂层，其中该涂层在410℃-450℃的高温区域中烘烤在氧化气氛中形成催化剂层共存的无定形和结晶氧化铱，并且共存的无定形和结晶氧化铱的催化剂层在520℃-560℃的另外的高温区域中进行后烘在氧化气氛中使催化剂层中几乎所有量的氧化铱结晶。

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