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1. 发明申请

WO1985001414A1 METHOD OF MAKING A PRINTED CIRCUIT BOARD 审中-公开
标题翻译：制作印刷电路板的方法
公开(公告)号：WO1985001414A1
公开(公告)日：1985-03-28
申请号：PCT/US1984001457
申请日：1984-09-17
申请人： ALLIED CORPORATION
发明人： ALLIED CORPORATION , KANE, Robert, P. , KURTZ, Bruce, E.
IPC分类号： H05K03/00
CPC分类号： H05K3/102 , H05K1/0306 , H05K3/107 , H05K3/4069 , H05K2201/09118 , H05K2201/09827 , H05K2201/09981 , H05K2203/0108 , H05K2203/0278 , H05K2203/1131
摘要： Method for making an electrically conductive path on the wall of a passage through a substrate. It is especially useful for connecting electrically conductive paths (25) on opposite sides of a circuit board (20). The method is characterized by the steps of forming a tapered passage (21) through the substrate (20) that connects to at least one conductive path on each side of the substrate (20), filling the tapered passage (21) with an electrically conductive powder (10), applying pressure with a tapered die (30) to compact the powder (11) against the wall of the passage (21) without blocking the passage, and then heating the compacted powder (11) to a temperature that increases the conductivity and ductility of the compacted powder (11) and its adhesion to the substrate (20) without adversely affecting the shape or condition of the substrate (20).
摘要翻译：在通过基底的通道的壁上制造导电路径的方法。用于连接电路板（20）的相对侧上的导电路径（25）是特别有用的。该方法的特征在于以下步骤：通过连接到基板（20）的每一侧上的至少一个导电路径的基板（20）形成锥形通道（21），用导电的方式填充锥形通道（21）粉末（10），用锥形模具（30）施加压力以将粉末（11）压靠在通道（21）的壁上而不阻塞通道，然后将压实的粉末（11）加热至增加压实粉末（11）的导电性和延展性及其对基材（20）的粘合性而不会不利地影响基材（20）的形状或状况。

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