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1. 发明专利

JP2007014990A Method and apparatus for laser beam machining 审中-公开
标题翻译：激光束加工的方法和装置
公开(公告)号：JP2007014990A
公开(公告)日：2007-01-25
申请号：JP2005199414
申请日：2005-07-07
申请人： Aisin Seiki Co Ltd , アイシン精機株式会社
发明人： SAITO SHIRO
IPC分类号： B23K26/36 , B23K26/08 , B23K26/16 , H01S3/00
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for laser beam machining which enable abrasion machining and cleaning machining by means of a single optical system only without using another optical system other than a system for abrasion machining. SOLUTION: The method for laser beam machining comprises a step for generating a laser beam for carrying out abrasion machining, a step for carrying out abrasion machining by irradiating a required abrasion machining pattern by a laser beam at a first irradiation speed which gives the fluence capable of abrasion machining on the surface of a workpiece, and a step for removing stuck debris by irradiating the region including the area of the abrasion pattern and its neighborhood by a laser beam at a second irradiation speed for giving the fluence which is sufficiently low so as not to carry out abrasion machining but is sufficient to remove the debris produced in the abrasion machining process. By this method, the abrasion machining and the cleaning machining can be carried out using the same optical system. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种用于激光束加工的方法和装置，其仅通过单个光学系统进行磨蚀加工和清洁加工，而不使用除了用于磨蚀加工的系统之外的另一光学系统。解决方案：激光束加工的方法包括产生用于进行磨削加工的激光束的步骤，通过以第一照射速度通过激光束照射所需的磨蚀加工图案进行磨削加工的步骤，该步骤给出能够在工件表面上进行磨损加工的能量密度，以及通过用激光束以第二照射速度照射包括磨耗图案及其附近区域的区域来除去卡住的碎屑的步骤，以充分地产生足够的注量低，以便不进行磨损加工，但足以去除在磨损加工过程中产生的碎屑。通过该方法，可以使用相同的光学系统进行磨损加工和清洁加工。版权所有（C）2007，JPO＆INPIT

2. 发明专利

JP2008238195A Organic device processing apparatus and method for organic device processing 有权
标题翻译：有机装置加工装置及有机装置加工方法
公开(公告)号：JP2008238195A
公开(公告)日：2008-10-09
申请号：JP2007080019
申请日：2007-03-26
申请人： Aisin Seiki Co Ltd , Nagaoka Univ Of Technology , Sigma Koki Kk , Tokki Corp , アイシン精機株式会社 , シグマ光機株式会社 , トッキ株式会社 , 国立大学法人長岡技術科学大学
发明人： KAMATA HIDEKI , ICHIHARA MASAHIRO , ITO YOSHIRO , TABATA YOSHINORI , NAGAI HIROYUKI , SAITO SHIRO
IPC分类号： B23K26/00 , B23K26/04 , B23K26/06 , B23K26/08 , H01L51/50 , H05B33/10
摘要： PROBLEM TO BE SOLVED: To provide an organic device processing apparatus, which can realize processing with highly accurately shape control and has very excellent practicality. SOLUTION: In the organic device processing apparatus, a laser beam is irradiated to an organic device having a substrate and two or more stacked layers, provided on the substrate, including at least an organic film layer among a first electrode film layer, an organic film layer, a second electrode film layer, and a protective layer, to conduct wiring pattern processing or opening processing. The apparatus includes a laser oscillation mechanism for machining for outputting a machining laser beam irradiated to the organic device, a reflectance measuring mechanism for detecting reflected light of a measuring laser beam irradiated to the organic device in a processing site and for measuring the reflectance of the organic device in a site to be machined, and an output regulating mechanism for regulating the output of the machining laser beam based on the reflectance of the machining site of the organic device. COPYRIGHT: (C)2009,JPO&INPIT
摘要翻译：要解决的问题：提供一种能够以高精度的形状控制实现加工并且具有非常优异的实用性的有机装置处理装置。解决方案：在有机器件处理设备中，激光束被照射到具有衬底和设置在衬底上的两个或更多层叠层的有机器件，该衬底至少包括第一电极膜层中的有机膜层，有机膜层，第二电极膜层和保护层，以进行布线图案处理或打开处理。该装置包括用于输出照射到有机器件的加工激光束的加工用激光振荡机构，用于检测在加工部位照射到有机装置的测定激光的反射光的反射率测定机构，有机装置，以及根据有机装置的加工部位的反射率来调节加工用激光束的输出的输出调节机构。版权所有（C）2009，JPO＆INPIT

3. 发明专利

JP2007118054A Method and apparatus for laser beam machining 审中-公开
标题翻译：激光束加工的方法和装置
公开(公告)号：JP2007118054A
公开(公告)日：2007-05-17
申请号：JP2005315103
申请日：2005-10-28
申请人： Aisin Seiki Co Ltd , Sigma Koki Kk , アイシン精機株式会社 , シグマ光機株式会社
发明人： SAITO SHIRO , NAGAI HIROYUKI , TABATA YOSHINORI
IPC分类号： B23K26/08 , B23K26/06 , G02B27/28
CPC分类号： B23K26/0652
摘要： PROBLEM TO BE SOLVED: To provide a method and an apparatus for laser beam machining, by which method and apparatus, the edge and the bottom of a hole, a groove, etc. are not undulated even when polarized ultra-short light pulse laser is convergedly radiated with low fluence. SOLUTION: The apparatus for laser beam machining comprises a laser generator 1 for generating the polarized ultra-short light pulse laser L, a rotary polarization control element 2 for radiating the ultra-short light pulse laser in the state that the plane of polarization is turning by turning the plane of polarization of the ultra-short light pulse laser L, and a laser radiating means 3 for convergedly irradiating a workpiece material 5 with the ultra-short light pulse laser radiated from the rotary polarization control element 2 with low fluence in the state that the plane of polarization radiated from the rotary polarization control element 2 is turning. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：为了提供一种用于激光束加工的方法和装置，通过该方法和装置，即使偏振超短光，孔，凹槽等的边缘和底部也不起伏脉冲激光以低注量会聚辐射。解决方案：激光束加工装置包括用于产生极化超短光脉冲激光L的激光发生器1，用于在超短光脉冲激光器的平面的状态下照射超短光脉冲激光器的旋转偏振控制元件2 通过转动超短光脉冲激光器L的偏振平面来转动极化;以及激光照射装置3，用于从具有低旋转偏振控制元件2辐射的超短光脉冲激光器会聚地照射工件材料5 从旋转偏振光控制元件2辐射的偏振面转动的状态下的注量。版权所有（C）2007，JPO＆INPIT

4. 发明专利

JP2006007284A Microfabrication method using ultrashort pulsed laser 审中-公开
标题翻译：使用超声波脉冲激光的微波加热方法
公开(公告)号：JP2006007284A
公开(公告)日：2006-01-12
申请号：JP2004188838
申请日：2004-06-25
申请人： Aisin Seiki Co Ltd , アイシン精機株式会社
发明人： SAITO SHIRO
IPC分类号： B23K26/00 , B81C99/00
摘要： PROBLEM TO BE SOLVED: To provide a microfabrication method having a high machining speed using ultrashort pulsed laser. SOLUTION: The microfabrication method comprises a step of roughing the surface of a solid material and a step of irradiating the solid material surface with ultrashort pulsed laser of a wavelength λ at a low fluence to form a periodic micro structure on that surface. In the simple method of roughing the solid material surface and irradiating it with the ultrashort pulsed laser of the wavelength λ at the low fluence, a high speed machining is made possible for the periodic micro structure having a size of approximately the wavelength λ or smaller of the laser emitted. Also, when the rough surface has grain-oriented scratches, the periodic micro structure can be controlled in the direction of the scratches. COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：要解决的问题：提供使用超短脉冲激光器具有高加工速度的微细加工方法。解决方案：微加工方法包括使固体材料的表面粗糙化的步骤和以低能量密度以波长λ的超短脉冲激光照射固体材料表面以在该表面上形成周期性微结构的步骤。在粗糙化固体材料表面并以低能量密度的波长λ的超短脉冲激光器照射的简单方法中，对于具有大致波长λ或更小的大小的周期性微结构，可以进行高速加工激光发射。此外，当粗糙表面具有晶粒取向的划痕时，可以沿划痕的方向控制周期性微观结构。版权所有（C）2006，JPO＆NCIPI

5. 发明专利

JP2003294699A Fluorescence reading apparatus 审中-公开
标题翻译：荧光读取装置
公开(公告)号：JP2003294699A
公开(公告)日：2003-10-15
申请号：JP2002092956
申请日：2002-03-28
申请人： Aisin Seiki Co Ltd , アイシン精機株式会社
发明人： KANAI SHIGETOMO , MOMIYAMA MASAYOSHI , SAITO SHIRO
IPC分类号： G01N27/447
摘要： PROBLEM TO BE SOLVED: To provide a fluorescence emission reading apparatus capable of detecting the fluorescence emission image of a gel for migration with high quality, even if gels are not uniform or an impurity is mixed or even through the use of the gel for migration having a low transparency. SOLUTION: The fluorescence reading apparatus is constituted of the gel 1 for migration in which sample fragments having molecular weight separated by electrophoresis and labelled with fluorescence are distributed, a gel cassette 7 for holding the gel 1 for migration, a semiconductor laser 2 for exciting fluorescent substances, a resonant scanner 4 (scanning device) for scanning a side surface of the gel 1 for migration in one axial direction with exciting light from a semiconductor laser 2, a diffuser 5 for diffusing in the direction of an optical axis the exciting light used for scanning in the axial direction between the resonant scanner 4 and the gel 1 for migration, a CCD camera 3 (fluorescence detector) for detecting fluorescence of the gel 1 for migration, and a detecting filter 6 for transmitting only the fluorescence by cutting the exciting light between the gel 1 for migration and the CCD camera 3. COPYRIGHT: (C)2004,JPO
摘要翻译：要解决的问题：为了提供能够以高质量检测凝胶的荧光发射图像的荧光发射读取装置，即使凝胶不均匀或杂质混合甚至通过使用凝胶用于具有低透明度的迁移。解决方案：荧光读取装置由用于迁移的凝胶1构成，其中通过电泳分离分子量并用荧光标记的样品片段分布，用于保持用于迁移的凝胶1的凝胶盒7，半导体激光器2 对于激发荧光物质，用于扫描凝胶1的侧表面的谐振扫描器4（扫描装置）用于沿着一个轴向沿着来自半导体激光器2的激发光的迁移，用于在光轴方向上扩散的扩散器5 用于在谐振扫描器4和凝胶1之间沿轴向扫描以进行迁移的激光，用于检测用于迁移的凝胶1的荧光的CCD照相机3（荧光检测器），以及用于仅透过荧光的检测滤光片6 切割用于迁移的凝胶1和CCD相机3之间的激发光。版权所有（C）2004，JPO

6. 发明专利

JP2006095546A Laser beam processing method 审中-公开
标题翻译：激光束处理方法
公开(公告)号：JP2006095546A
公开(公告)日：2006-04-13
申请号：JP2004282345
申请日：2004-09-28
申请人： Aisin Seiki Co Ltd , アイシン精機株式会社
发明人： SAITO SHIRO , YOSHIDA MUTSUMI
IPC分类号： B23K26/16
摘要： PROBLEM TO BE SOLVED: To provide a laser beam processing method with which the formation and the removal of a protecting film for preventing a debris are easily performed for a short time.
SOLUTION: The laser beam processing method is provided with; a process for forming a wax-film 6 on the surface to be processed in a material 3 to be processed; a process for laser beam-processing by condensing and emitting the laser beam onto a zone to be processed on the surface to be processed from the wax-film 6 side; and a process for removing the wax-film 6. In this way, even in the case that the debris occurs in the laser beam processing, this debris is piled/stuck on the surface of the wax-film surrounding the processing part. Since the wax-film is removed after laser beam processing, the debris is removed together with the wax-film and the processing accuracy/processing quality are improved. The formation and the removal of the wax-film are simply performed, and the necessary time in the formation and the removal of the protecting film, is short.
COPYRIGHT: (C)2006,JPO&NCIPI
摘要翻译：解决的问题：提供一种激光束处理方法，其中用于防止碎片的保护膜的形成和去除容易在短时间内进行。
解决方案：提供激光束处理方法; 在待处理材料3中的待加工表面上形成蜡膜6的方法; 通过从蜡膜6侧将激光束聚集并发射到待处理表面上的待加工区域上进行激光束处理的方法; 以及去除蜡膜6的方法。以这种方式，即使在激光束处理中发生碎屑的情况下，也将该碎屑堆积/粘贴在处理部周围的蜡膜的表面上。由于在激光束处理后去除了蜡膜，因此与蜡膜一起除去碎屑，提高了加工精度/加工质量。简单地进行蜡膜的形成和去除，并且保护膜的形成和去除所需的时间短。版权所有（C）2006，JPO＆NCIPI

7. 发明专利

JP2002295536A BRAKE DEVICE FOR VEHICLE 失效
公开(公告)号：JP2002295536A
公开(公告)日：2002-10-09
申请号：JP2001092276
申请日：2001-03-28
申请人： AISIN SEIKI , AISIN TAKAOKA LTD
发明人： SAITO SHIRO , WADA TAKAHISA
IPC分类号： F16D55/22 , F16D66/00
摘要： PROBLEM TO BE SOLVED: To reduce braking harsh noise (face inside screech) induced by vibration in peripheral direction of a disk rotor at specific frequency zone by restraining axial runout of the disk rotor induced by the peripheral direction of the disk rotor at the braking time. SOLUTION: In braking device for a vehicle configured to brake rotation of the disk rotor 30 by interposing and supporting the disk rotor 30 with both pads 11, 12 (both primary pads) of a main brake 10, it is configured so as to interpose and support the disk rotor 30 with both pads 21, 22 (both secondary pads) of a subsidiary brake 20 in a position displaced by 70 to 110 degrees toward peripheral direction of the rotor with respect with center of braking in terms of both of the pads of the main brake 10 and then to brake the rotation of the disk rotor 30.

8. 发明专利

JP2007111810A Cutting blade tool 审中-公开
标题翻译：切割刀具
公开(公告)号：JP2007111810A
公开(公告)日：2007-05-10
申请号：JP2005304355
申请日：2005-10-19
申请人： Aisin Seiki Co Ltd , アイシン精機株式会社
发明人： SAITO SHIRO , MIYATA FUMIO
IPC分类号： B23B27/00 , B23K26/00 , B23K101/20
摘要： PROBLEM TO BE SOLVED: To provide a cutting blade tool without requiring an oscillator or the like. SOLUTION: The cutting blade tool 1 has a rake face 11 and a flank 12 and is used for cutting metal. A periodic microstructure 16 by ultrashort light pulse laser irradiation is formed on the rake face 11 and/or the flank 12 of the cutting blade tool 1. COPYRIGHT: (C)2007,JPO&INPIT
摘要翻译：要解决的问题：提供一种切割刀具，而不需要振荡器等。解决方案：切割刀具1具有前刀面11和侧面12，并用于切割金属。通过超短光脉冲激光照射的周期性微结构16形成在切割刀具1的前刀面11和/或侧面12上。版权所有（C）2007，JPO＆INPIT

9. 发明专利

JP2007000886A COLD JOINING METHOD FOR SOLID MATERIAL 审中-公开
公开(公告)号：JP2007000886A
公开(公告)日：2007-01-11
申请号：JP2005181872
申请日：2005-06-22
申请人： AISIN SEIKI
发明人： NAGAI HIROYUKI , SAITO SHIRO , YOSHIDA MASAHIRO , YOSHIDA MUTSUMI
IPC分类号： B23K20/00 , B23K20/02 , B23K20/14 , B23K20/24 , B23K26/12 , B23K26/36 , B23K103/04
摘要： PROBLEM TO BE SOLVED: To provide a cold joining method having high joining strength. SOLUTION: The method for subjecting two solid materials 13a, 13b to cold joining comprises: a microstructure forming step where an ultrashort pulse laser L is polarization-controlled at a low fluence, and is emitted to the joining faces of the two solid materials 13a, 13b, so as to form a periodic microstructure on the joining faces; and a pressurizing step where the joining faces of the two solid materials with the periodic microstructure formed are butted, so as to be pressurized. By the periodic microstructure, the effectual joining area increases, physical bonding strength by the engagement of the periodic microstructure is added to chemical bonding strength, thus joining strength can be increased. COPYRIGHT: (C)2007,JPO&INPIT

10. 发明专利

JP2004279306A Fluorescence reading apparatus and gel cassette 审中-公开
公开(公告)号：JP2004279306A
公开(公告)日：2004-10-07
申请号：JP2003073459
申请日：2003-03-18
申请人： Aisin Seiki Co Ltd , アイシン精機株式会社
发明人： KANAI SHIGETOMO , SAITO SHIRO
IPC分类号： G01N21/64 , G01N21/03 , G01N27/447
摘要： PROBLEM TO BE SOLVED: To provide a fluorescence reading apparatus capable of obtaining fluorescence detection images with a small background noise, even if a gel cassette manufactured from a material having a large self-fluorescence is used and the gel cassette used for the fluorescence reading apparatus. SOLUTION: In the fluorescence reading apparatus 10A, since a black urethane layer 25 is applied to a side face, on which a side face opening 24 of the gel cassette 7 (two plates 21, 22 for constituting the gel cassette) is formed, an excitation light from a semiconductor laser 2 is absorbed by the black urethane layer 25 and will not reach the gel cassette 7 (two plates 21, 22 for constituting the gel cassette); and the gel cassette 7 (two plates 21, 22 for constituting the gel cassette) will not emit fluorescence, even if two plates 21, 22 for constituting the gel cassette 7 are manufactured from a transparent resin with a large self-fluorescence such as polycarbonate, acrylate, etc. COPYRIGHT: (C)2005,JPO&NCIPI

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