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    • 1. 发明申请
    • SYSTEM FOR DELIVERY OF REAGENTS FROM SOLID SOURCES THEREOF
    • 用于从其固体来源递送试剂的系统
    • WO2006101767A2
    • 2006-09-28
    • PCT/US2006/008530
    • 2006-03-09
    • ADVANCED TECHNOLOGY MATERIALS, INC.MARGANSKI, Paul, J.DIETZ, James, I.SWEENEY, Joseph, D.
    • MARGANSKI, Paul, J.DIETZ, James, I.SWEENEY, Joseph, D.
    • B01J16/00
    • B01J7/00B01J2219/00094B01J2219/00141B01J2219/00146C23C14/48C23C14/564C23C16/4405C23C16/4481
    • A system (10) for delivery of reagent from a solid source thereof, comprising a structure (16, 22, 24) arranged to retain a solid source material (30) in confinement by at least a portion of the structure, for heating and generation of vapor from the solid source material by volatilization thereof, a heat source (82) arranged to heat the solid source material for such volatilization, and a vapor dispensing assembly (52, 54) arranged to discharge the vapor from the system. A high conductance valve (1510) is also described, suitable for use as a dispensing control valve for a reagent storage and dispensing vessel, e.g., a vessel containing a semiconductor manufacturing reagent that is dispensed at low pressure. The high conductance valve includes a valve body (1512) in which inlet and outlet passages are substantially perpendicular to one another, with their interior extremities communicating with a valve chamber (1536) containing a selectively positionable valve element movable between a fully open and fully closed position. Valve flow coefficient (C V ) values on the order of 2.7 to 2.9 are achievable by such high conductance valve, enabling the valve to achieve superior dispensing operation even in extremely low pressure regimes, e.g., below 20 torr.
    • 一种用于从其固体源输送试剂的系统(10),包括结构(16,22,24),所述结构被布置成通过所述结构的至少一部分约束地固定固体源材料(30),用于加热和产生 通过其固体来源于固体源材料的蒸汽,布置成加热用于这种挥发的固体源材料的热源(82)和布置成从系统排出蒸气的蒸气分配组件(52,54)。 还描述了适用于试剂储存和分配容器的分配控制阀的高电导阀(1510),例如包含在低压下分配的半导体制造试剂的容器。 高电导阀包括阀体(1512),入口和出口通道基本上彼此垂直,其内端与阀室(1536)连通,该阀室包含可选择性定位的阀元件,阀元件可在完全打开和完全关闭之间移动 位置。 通过这种高电导阀可以实现2.7至2.9级的阀流量系数(C VAL)值,即使在极低压力条件下也能实现优异的分配操作,例如低于20托 。