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1. 发明申请

WO2004023094A3 ELECTROCHEMICAL ANALYTICAL APPARATUS AND METHOD OF USING THE SAME 审中-公开
标题翻译：电化学分析装置及其使用方法
公开(公告)号：WO2004023094A3
公开(公告)日：2004-10-07
申请号：PCT/US0327566
申请日：2003-09-03
申请人： ADVANCED TECH MATERIALS
发明人： KING MACKENZIE , STAPLES JOHN W , EVANS JOSEPH W , CLARK DANIEL O , ROBERTSON PETER M , CHATTERTON THOMAS B , HARTFORD THOMAS
IPC分类号： G01N27/28 , G01N21/05 , G01N27/27 , G01N27/30 , G01N27/42
CPC分类号： G01N27/42
摘要： The present invention relates to an electrochemical analytical apparatus for analyzing an electrochemical deposition solution, comprising a testing electrode (20), and a temperature detector (24) attached thereto for monitoring temperature of said testing electrode (20). Preferably, such temperature detector (24) is a resistance temperature detector.
摘要翻译：本发明涉及一种用于分析电化学沉积溶液的电化学分析装置，包括测试电极（20）和附着于其上的温度检测器（24），用于监测所述测试电极（20）的温度。优选地，这种温度检测器（24）是电阻温度检测器。

2. 发明申请

WO2004051216A3 ANALYSIS OF SULFATE USING CONDUCTOMETRIC END-POINT DETECTION WITH SUPPRESSION OF CATIONIC CO-PRECIPITATION 审中-公开
标题翻译：使用导电共点沉降抑制的导电终点检测的硫酸盐分析
公开(公告)号：WO2004051216A3
公开(公告)日：2005-02-03
申请号：PCT/US0337512
申请日：2003-11-20
申请人： ADVANCED TECH MATERIALS
发明人： ROBERTSON PETER M , SHAH BINOI
IPC分类号： G01N31/16 , G01N33/00
CPC分类号： G01N31/164 , Y10T436/18
摘要： The present invention provides for a method of monitoring the concentration of a sulfate salt present in a solution. In accordance with this aspect of the present invention, the concentration of sulfate salt present in the solution is monitored by titrating a known concentration of a barium salt solution with a test sample of the solution containing an unknown amount of sulfate salt under conductivity titration conditions.
摘要翻译：本发明提供了一种监测溶液中存在的硫酸盐浓度的方法。根据本发明的这个方面，通过在电导率滴定条件下用含有未知量的硫酸盐的溶液的测试样品滴定已知浓度的钡盐溶液来监测溶液中存在的硫酸盐的浓度。

3. 发明申请

WO03014720A9 INTERFERENCE CORRECTION OF ADDITIVES CONCENTRATION MEASUREMENTS IN METAL ELECTROPLATING SOLUTIONS 审中-公开
标题翻译：金属电镀解决方案中添加剂浓度测量的干扰校正
公开(公告)号：WO03014720A9
公开(公告)日：2004-05-06
申请号：PCT/US0225324
申请日：2002-08-09
申请人： ADVANCED TECH MATERIALS
发明人： ROBERTSON PETER M
IPC分类号： G01N27/416 , G01N27/42 , G01N27/26
CPC分类号： G01N27/4163 , G01N27/4161 , G01N27/42
摘要： The present invention relates to a method and apparatus for determining concentrations of various organic additives in metal electroplating solutions, by utilizing a mathematical correction model in combination with the conventional PCGA chrono-potentiometric analysis method, to eliminate the interaction between the observed electrochemical behavior of various organic additives, and to achieve accurate concentration determination of such additives.
摘要翻译：本发明涉及一种通过结合常规PCGA计时分析方法利用数学校正模型来确定金属电镀溶液中各种有机添加剂浓度的方法和装置，以消除观察到的各种电化学行为之间的相互作用有机添加剂，并且可以精确地确定这些添加剂的浓度。

4. 发明专利

AU2003265902A1 ELECTROCHEMICAL ANALYTICAL APPARATUS AND METHOD OF USING THE SAME 未知
公开(公告)号：AU2003265902A1
公开(公告)日：2004-03-29
申请号：AU2003265902
申请日：2003-09-03
申请人： ADVANCED TECH MATERIALS
发明人： ROBERTSON PETER M , CHATTERTON THOMAS B , HARTFORD THOMAS , KING MACKENZIE , STAPLES JOHN W , EVANS JOSEPH W , CLARK DANIEL O
IPC分类号： G01N27/28

5. 发明专利

AU1966701A Method and apparatus for determination of additives in metal plating baths 未知
公开(公告)号：AU1966701A
公开(公告)日：2001-04-30
申请号：AU1966701
申请日：2000-10-17
申请人： ADVANCED TECH MATERIALS
发明人： ROBERTSON PETER M
IPC分类号： G01N1/00 , C25D21/12 , G01N27/30 , G01N27/416 , G01N27/42 , G01N27/26
摘要： An apparatus and method for the indirect determination of concentrations of additives in metal plating electrolyte solutions, particularly organic additives in Cu-metalization baths for semiconductor manufacturing. The apparatus features a reference electrode housed in an electrically isolated chamber and continuously immersed in the base metal plating solution (without the additive to be measured). An additive concentration determination method comprises electroplating a test electrode at a constant or known current in a mixing chamber wherein the base metal plating solution is mixed with small volumes of the sample and various calibration solutions containing the additive to be measured. Plating potentials between the electrodes are measured and plotted for each of the solution mixtures, and data are extrapolated to determine the concentration of the additive in the sample. A multi-cycle method determines the concentration of both accelerator and suppressor organic additives in Cu plating solution in a single test suite.

6. 发明专利

AU2003297924A1 ELECTRODE ASSEMBLY AND METHOD OF USING THE SAME 未知
公开(公告)号：AU2003297924A1
公开(公告)日：2004-07-29
申请号：AU2003297924
申请日：2003-12-12
申请人： ADVANCED TECH MATERIALS
发明人： ROBERTSON PETER M
IPC分类号： G01N27/38 , G01N27/26 , G01F1/64 , G01N17/00

7. 发明专利

AU2003295862A8 Analysis of sulfate using conductometric end-point detection with suppression of cationic co-precipitation 未知
公开(公告)号：AU2003295862A8
公开(公告)日：2004-06-23
申请号：AU2003295862
申请日：2003-11-20
申请人： ADVANCED TECH MATERIALS
发明人： ROBERTSON PETER M , SHAH BINOI
IPC分类号： G01N31/16 , G01N33/00
摘要： The present invention provides for a method of monitoring the concentration of a sulfate salt present in a solution. In accordance with this aspect of the present invention, the concentration of sulfate salt present in the solution is monitored by titrating a known concentration of a barium salt solution with a test sample of the solution containing an unknown amount of sulfate salt under conductivity titration conditions.

8. 发明专利

AU2003295862A1 ANALYSIS OF SULFATE USING CONDUCTOMETRIC END-POINT DETECTION WITH SUPPRESSION OF CATIONIC CO-PRECIPITATION 未知
公开(公告)号：AU2003295862A1
公开(公告)日：2004-06-23
申请号：AU2003295862
申请日：2003-11-20
申请人： ADVANCED TECH MATERIALS
发明人： ROBERTSON PETER M , SHAH BINOI
IPC分类号： G01N31/16
摘要： The present invention provides for a method of monitoring the concentration of a sulfate salt present in a solution. In accordance with this aspect of the present invention, the concentration of sulfate salt present in the solution is monitored by titrating a known concentration of a barium salt solution with a test sample of the solution containing an unknown amount of sulfate salt under conductivity titration conditions.

9. 发明专利

AU2003265902A8 Electrochemical analytical apparatus and method of using the same 未知
公开(公告)号：AU2003265902A8
公开(公告)日：2004-03-29
申请号：AU2003265902
申请日：2003-09-03
申请人： ADVANCED TECH MATERIALS
发明人： KING MACKENZIE , CLARK DANIEL O , HARTFORD THOMAS , CHATTERTON THOMAS B , EVANS JOSEPH W , ROBERTSON PETER M , STAPLES JOHN W
IPC分类号： G01N27/28 , G01N21/05 , G01N27/27 , G01N27/30 , G01N27/42

10. 发明专利

AU2003238873A1 METHOD FOR DETERMINING CONCENTRATIONS OF ADDITIVES IN ACID COPPER ELECTROCHEMICAL DEPOSITION BATHS 未知
公开(公告)号：AU2003238873A1
公开(公告)日：2003-12-31
申请号：AU2003238873
申请日：2003-06-04
申请人： ADVANCED TECH MATERIALS
发明人： BHELLA RICHARD , PRICE DAVID , HAN JIANWEN , ETTERMAN RONNI M , ROBERTSON PETER M
IPC分类号： G01N27/416 , G01N27/42 , C25D21/14
摘要： The present invention relates to a method for determining concentration of brightener and leveler contained in an aqueous acid metal electroplating solution, which minimizes the interference between the effects of the brightener and the effects of the leveler, by firstly determining the concentration of the brightener at a first set of measurement conditions, and secondly determining the concentration of the leveler at a second set of measurement conditions, provided that the first set of measurement conditions differ from the second set of measurement conditions on either (1) the rotation speed of a rotating disc electrode used for measuring plating potential of said aqueous acid metal electroplating solution, or (2) the electroplating duration at which the plating potential of said aqueous acid metal electroplating solution is measured, that the rotation speed of the first set of measurement conditions is lower than the rotation speed of the second set of measurement conditions, and that the electroplating duration of the first set of measurement conditions is shorter than that of the second set of measurement conditions. The rotation speed of the first set of measurement conditions is approximately from about 0 rpm to about 4000 rpm, while the rotation speed of the second set of measurement conditions is approximately from about 300 rpm to about 1250 rpm. The electroplating duration of the first set of measurement conditions is approximately from about 1 second to about 20 seconds, and the electroplating duration of the second set of measurement conditions is approximately from about 1 second to about 25 seconds.

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