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    • 5. 发明申请
    • CONNECTORIZED COCHLEAR IMPLANT SYSTEMS AND METHODS
    • 连接的COCHLEAR植入系统和方法
    • WO2014035379A1
    • 2014-03-06
    • PCT/US2012/052718
    • 2012-08-28
    • ADVANCED BIONICS AGHARTLEY, Lee F.MISHRA, Lakshmi N.
    • HARTLEY, Lee F.MISHRA, Lakshmi N.
    • A61N1/05A61N1/08A61N1/36H04R25/00
    • A61N1/36032A61N1/0541A61N1/36036A61N1/372A61N1/37217A61N1/375A61N1/378A61N1/3787H04R25/606H04R25/608H04R2460/03
    • An exemplary system includes 1 ) a cochlear implant module configured to be implanted within a patient and comprising cochlear implant circuitry configured to apply electrical stimulation representative of one or more audio signals to the patient, and 2) a modular connector coupled to the cochlear implant module by way of a cable and configured to be implanted within the patient. The modular connector may be removably connected to an implantable antenna in order to facilitate communicative coupling of the implantable antenna to the cochlear implant circuitry. In this configuration, the cochlear implant circuitry may wirelessly communicate with a sound processor located external to the patient. The modular connector may alternatively be removably connected to an implantable sound processor. In this configuration, the cochlear implant circuitry and the implantable sound processor may communicate one with another by way of a wired connection. Corresponding systems and methods are also disclosed.
    • 示例性系统包括:1)耳蜗植入模块,其被配置为植入患者体内,并且包括被配置成将表示一个或多个音频信号的电刺激施加到患者的耳蜗植入电路,以及2)耦合到所述耳蜗植入模块 通过电缆并被配置为植入患者体内。 模块化连接器可以可移除地连接到可植入天线,以便促进可植入天线与耳蜗植入电路的通信耦合。 在该配置中,人工耳蜗植入电路可以与位于患者外部的声音处理器无线地通信。 可选地,模块化连接器可移除地连接到可植入声音处理器。 在该配置中,耳蜗植入电路和可植入声音处理器可以通过有线连接与另一个通信。 还公开了相应的系统和方法。
    • 7. 发明申请
    • CONNECTORIZED COCHLEAR IMPLANT SYSTEMS AND METHODS
    • 连接的COCHLEAR植入系统和方法
    • WO2014035592A1
    • 2014-03-06
    • PCT/US2013/052929
    • 2013-07-31
    • ADVANCED BIONICS AG
    • PLATZ, RainerHARTLEY, Lee F.MISHRA, Lakshmi N.
    • A61N1/05A61N1/08A61N1/36H04R25/00A61N5/06
    • A61N1/36032A61N1/0541A61N1/36036A61N1/372A61N1/37217A61N1/375A61N1/378A61N1/3787H04R25/606H04R25/608H04R2460/03
    • An exemplary system includes 1) a cochlear implant module configured to be implanted within a patient and comprising cochlear implant circuitry configured to apply electrical stimulation representative of one or more audio signals to the patient, 2) an implantable sound processor module configured to be implanted within the patient and comprising sound processor circuitry configured to optically transmit data and/or power to the cochlear implant circuitry, and 3) an optical connector assembly configured to facilitate removable coupling of the implantable sound processor module to the cochlear implant module by way of the optical connector assembly. The optical connector assembly comprises one or more optical fibers configured to facilitate the optical transmission of the data and/or the power from the sound processor circuitry to the cochlear implant circuitry while the implantable sound processor module is removably coupled to the cochlear implant module by way of the optical connector assembly.
    • 示例性系统包括:1)耳蜗植入模块,被配置为植入患者体内,并且包括构造成将表示一个或多个音频信号的电刺激施加到患者的耳蜗植入电路,2)可植入声音处理器模块, 所述患者并且包括被配置为向所述耳蜗植入电路光学传输数据和/或电力的声音处理器电路,以及3)光学连接器组件,其被配置为便于通过所述光学器件将所述可植入声音处理器模块可移除地耦合到所述耳蜗植入物模块 连接器组件。 光学连接器组件包括一个或多个光纤,其被配置为便于将数据的光学传输和/或从声音处理器电路的功率传输到耳蜗植入电路,同时可植入声音处理器模块通过方式可拆卸地耦合到耳蜗植入物模块 的光连接器组件。