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1. 发明申请

WO2009079874A1 METHODS AND APPARATUS FOR CLEANING SEMICONDUCTOR WAFERS 审中-公开
标题翻译：清洗半导体波形的方法和装置
公开(公告)号：WO2009079874A1
公开(公告)日：2009-07-02
申请号：PCT/CN2007/071210
申请日：2007-12-10
申请人： ACM RESEARCH (SHANGHAI) INC. , NUCH, Voha , WANG, David , MA, Yue , CHEN, Fufa , WANG, Jian , HUANG, Yunwen , XIE, Liangzhi , HE, Chuan
发明人： NUCH, Voha , WANG, David , MA, Yue , CHEN, Fufa , WANG, Jian , HUANG, Yunwen , XIE, Liangzhi , HE, Chuan
IPC分类号： H01L21/30
CPC分类号： H01L21/67051
摘要： An apparatus for cleaning and conditioning the surface of a semiconductor substrate such as wafer includes a rotatable chuck, a chamber, a rotatable tray for collecting cleaning solution with one or more drain outlets, multiple receptors for collecting multiple cleaning solutions, a first motor to drive chuck, and a second motor to drive the tray. The drain outlet in the tray can be positioned directly above its designated receptor located under the drain outlet. The cleaning solution collected by the tray can be guided into designated receptor. One characteristic of the apparatus is having a robust and precisely controlled cleaning solution recycle with minimum cross contamination.
摘要翻译：用于清洁和调理诸如晶片的半导体衬底的表面的设备包括可转动卡盘，腔室，用于收集具有一个或多个排出口的清洁溶液的可旋转托盘，用于收集多个清洁溶液的多个受体，用于驱动的第一马达卡盘和第二马达驱动托盘。托盘中的排水出口可以位于排水出口下方的指定接收器的正上方。由托盘收集的清洁溶液可以被引导到指定的受体中。该设备的一个特征是具有坚固且精确控制的清洁溶液循环，具有最小的交叉污染。

2. 发明申请

WO2009055992A1 PLATING APPARATUS FOR METALLIZATION ON SEMICONDUCTOR WORKPIECE 审中-公开
标题翻译：用于金属化半导体工件的镀层设备
公开(公告)号：WO2009055992A1
公开(公告)日：2009-05-07
申请号：PCT/CN2007/071008
申请日：2007-11-02
申请人： ACM RESEARCH (SHANGHAI) INC. , MA, Yue , WANG, Xi , HUANG, Yunwen , PANG, Zhenxu , NUCH, Voha , WANG, David
发明人： MA, Yue , WANG, Xi , HUANG, Yunwen , PANG, Zhenxu , NUCH, Voha , WANG, David
IPC分类号： C25D17/00 , C25D7/12 , C25D21/04 , H01L21/288
CPC分类号： C25D17/00 , C25D17/001 , C25D17/10 , C25D21/04
摘要： The present invention provides a plating apparatus with multiple anode zones and cathode zones. The electrolyte flow field within each zone is controlled individually with independent flow control devices. A gas bubble collector whose surface is made into pleated channels is implemented for gas removal by collecting small bubbles, coalescing them, and releasing the residual gas. A buffer zone built within the gas bubble collector further allows unstable microscopic bubbles to dissolve.
摘要翻译：本发明提供具有多个阳极区和阴极区的电镀装置。每个区域内的电解液流场都由独立的流量控制装置单独控制。其表面形成打褶通道的气泡收集器通过收集小气泡，聚结并释放残留气体来实现气体去除。内置在气泡收集器内的缓冲区还允许不稳定的微小气泡溶解。

3. 发明申请

WO2009026765A1 METHOD AND APPARATUS FOR THERMAL TREATMENT OF SEMICONDUCTOR WORKPIECES 审中-公开
标题翻译：半导体工件热处理方法和装置
公开(公告)号：WO2009026765A1
公开(公告)日：2009-03-05
申请号：PCT/CN2007/070582
申请日：2007-08-29
申请人： ACM RESEARCH (SHANGHAI) INC. , MA, Yue , HE, Chuan , PANG, Zhenxu , WANG, David , NUCH, Voha
发明人： MA, Yue , HE, Chuan , PANG, Zhenxu , WANG, David , NUCH, Voha
IPC分类号： H01L21/324 , F27D9/00 , C30B31/12
CPC分类号： H01L21/324 , F27B17/0025 , H01L21/67109 , H01L21/6719
摘要： An apparatus and method for rapid and uniform thermal treatment of semiconductor workpieces in two closely arranged thermal treatment chambers with a retractable door between them are provided. The retractable door moves in between two thermal treatment chambers during heating or cooling process, and additional heating and cooling sources are provided for double-side thermal treatment of the semiconductor workpieces.
摘要翻译：提供了一种用于在两个紧密布置的热处理室中快速均匀地热处理半导体工件的装置和方法，其间具有可伸缩门。可伸缩门在加热或冷却过程中在两个热处理室之间移动，并且为半导体工件的双面热处理提供附加的加热和冷却源。

4. 发明申请

WO2009114965A1 ELECTROCHEMICAL DEPOSITION SYSTEM 审中-公开
标题翻译：电化学沉积系统
公开(公告)号：WO2009114965A1
公开(公告)日：2009-09-24
申请号：PCT/CN2008/070531
申请日：2008-03-19
申请人： ACM RESEARCH (SHANGHAI) INC. , MA, Yue , HE, Chuan , PANG, Zhenxu , SHI, Guangtao , XIA, Jiexu , NUCH, Voha , WANG, Hui
发明人： MA, Yue , HE, Chuan , PANG, Zhenxu , SHI, Guangtao , XIA, Jiexu , NUCH, Voha , WANG, Hui
IPC分类号： C25D7/12 , C25D19/00 , C25D17/00 , H01L21/00
CPC分类号： H01L21/6723 , C25D5/48 , C25D5/50 , C25D17/00 , C25D17/001 , C25D17/02 , C25D17/04 , C25D21/02 , H01L21/67178
摘要： An electrochemical deposition system which has a 3-D stacked architecture comprises a factory interface (10) for receiving semiconductor wafers, a mainframe (11) comprising a mainframe transfer robot (102,106) and a plurality of wafer holder assemblies (105) which disposed on the top thereof, a plurality of electroplating cells (107) disposed within the mainframe, a plurality of cleaning cells (107) disposed within the mainframe and located below the electroplating cells, a plurality of thermal treatment chambers disposed in between the mainframe and the factory interface, and a fluid distribution system fluidly connected to the electroplating cells and the cleaning cells, wherein the mainframe transfer robot transfers semiconductor wafers from the factory interface and within electroplating cells, the cleaning cell, the thermal chambers and delivery and storage cassettes. As a result, the system of present invention is expandable to accommodate newly-added processing units without over much increased footprint.
摘要翻译：具有3-D堆叠结构的电化学沉积系统包括用于接收半导体晶片的工厂接口（10），包括主机传送机器人（102,106）和多个晶片保持器组件（105）的主机（11）其顶部，设置在主机内的多个电镀电池（107），设置在主机内并位于电镀单元下方的多个清洁电池（107），设置在主机和工厂之间的多个热处理室界面和流体连接到电镀单元和清洁单元的流体分配系统，其中主机传送机器人从工厂接口和电镀单元，清洁单元，热室和输送和存储盒中传送半导体晶片。结果，本发明的系统可扩展以适应新增的处理单元，而不会增加足够的占地面积。

5. 发明申请

WO2003042433A1 ELECTROPOLISHING ASSEMBLY AND METHODS FOR ELECTROPOLISHING CONDUCTIVE LAYERS 审中-公开
标题翻译：电镀组件和电导电导层的方法
公开(公告)号：WO2003042433A1
公开(公告)日：2003-05-22
申请号：PCT/US2002/036567
申请日：2002-11-13
申请人： ACM RESEARCH, INC. , WANG, Hui , YIH, Peihau , AFNAN, Muhammed , NUCH, Voha , GUTMAN, Felix
发明人： WANG, Hui , YIH, Peihau , AFNAN, Muhammed , NUCH, Voha , GUTMAN, Felix
IPC分类号： C25B9/00
CPC分类号： H01L21/6708 , B23H3/00 , C25D17/001 , C25F7/00 , H01L21/2885 , H01L21/6838 , H01L21/68707
摘要： In one aspect of the present invention, an exemplary apparatus and method are provided for electropolishing a conductive film on a wafer (1004). An apparatus includes a wafer chuck (1002) for holding a wafer, an actuator (1000) for rotating the wafer chuck, and a nozzle (1010) configured to electropolish the wafer. The apparatus may further include a conductive ring or a shroud (1006). A method of electropolishing a conductive film on a wafer includes rotating a wafer chuck with sufficient speed such that electrolyte fluid incident upon the wafer flows on the surface of the wafer towards the edge of the wafer.
摘要翻译：在本发明的一个方面，提供了一种用于对晶片（1004）上的导电膜进行电解抛光的示例性装置和方法。一种装置包括用于保持晶片的晶片卡盘（1002），用于旋转晶片卡盘的致动器（1000）以及用于电镀抛光晶片的喷嘴（1010）。该装置还可以包括导电环或护罩（1006）。在晶片上电抛光导电膜的方法包括以足够的速度旋转晶片卡盘，使得入射到晶片上的电解液在晶片的表面上流向晶片的边缘。

6. 发明申请

WO2004053942A3 MEASURING ALIGNMENT BETWEEN A WAFER CHUCK AND POLISHING/PLATING RECEPTACLE 审中-公开
公开(公告)号：WO2004053942A3
公开(公告)日：2004-06-24
申请号：PCT/US2003/039221
申请日：2003-12-09
申请人： ACM RESEARCH, INC. , WANG, Hui , NUCH, Voha
发明人： WANG, Hui , NUCH, Voha
IPC分类号： H01L21/461 , B23H11/00 , C25D5/02
摘要： An apparatus for electropolishing and/or electroplating metal layers on a semiconductor wafer includes a receptacle having a plurality of section walls (figure 1). The apparatus includes a wafer chuck configured to hold the semiconductor wafer and the position the semiconductor wafer within the receptacle with a surface of the semiconductor wafer adjacent to top portions of the plurality of section walls. The apparatus also includes a first plurality of sensors configured to measure alignment between the center of one of the plurality of section walls to the center of the wafer chuck, and thus the center of the semiconductor wafer.

7. 发明申请

WO2003087436A1 ELECTROPOLISHING AND/OR ELECTROPLATING APPARATUS AND METHODS 审中-公开
标题翻译：电镀和/或电镀装置和方法
公开(公告)号：WO2003087436A1
公开(公告)日：2003-10-23
申请号：PCT/US2003/010725
申请日：2003-04-08
申请人： ACM RESEARCH, INC. , WANG, Hui , NUCH, Voha , GUTMAN, Felix , AFNAN, Muhammed , CHOKSHI, Himanshu, J. , VAN KERKWYK, Mark, Jacobus , KOEHLER, Damon, L. , YIH, Peihaur , NGUYEN, My, Hoang , CHANG, Ru, Kao , HO, Frederick
发明人： WANG, Hui , NUCH, Voha , GUTMAN, Felix , AFNAN, Muhammed , CHOKSHI, Himanshu, J. , VAN KERKWYK, Mark, Jacobus , KOEHLER, Damon, L. , YIH, Peihaur , NGUYEN, My, Hoang , CHANG, Ru, Kao , HO, Frederick
IPC分类号： C25D5/48
CPC分类号： H01L21/6708 , C25D7/12 , C25D17/001 , C25F7/00 , H01L21/2885 , H01L21/67051 , H01L21/67769 , H01L21/6838 , H01L21/68707
摘要： In one aspect of the present invention, exemplary apparatus and methods are provided for electropolishing and/or electroplating processes for semiconductor wafers. One exemplary apparatus includes a cleaning module having an edge clean assembly (930) to remove metal residue on the bevel or edge portion of a wafer (901). The edge cleaning apparatus includes a nozzle head (1030) configured to supply a liquid and a gas to a major surface of the wafer, and supplies the gas radially inward of the location the liquid is supplied to reduce the potential of the liquid from flowing radially inward to the metal film formed on the wafer.
摘要翻译：在本发明的一个方面，提供了用于半导体晶片的电解抛光和/或电镀工艺的示例性装置和方法。一个示例性设备包括具有边缘清洁组件（930）以去除晶片（901）的斜面或边缘部分上的金属残留物的清洁模块。边缘清洁装置包括：喷嘴头（1030），其被构造成将液体和气体供应到晶片的主表面，并且将气体径向向内供给到供应液体的位置，以减小液体的径向径向流动向内到形成在晶片上的金属膜。

8. 发明申请

WO2016041151A1 COATER WITH AUTOMATIC CLEANING FUNCTION AND COATER AUTOMATIC CLEANING METHOD 审中-公开
标题翻译：具有自动清洁功能和涂层自动清洗方法
公开(公告)号：WO2016041151A1
公开(公告)日：2016-03-24
申请号：PCT/CN2014/086644
申请日：2014-09-16
申请人： ACM RESEARCH (SHANGHAI) INC.
发明人： WANG, Hui , CHEN, Fuping , WANG, Wenjun , YANG, Hongchao , NUCH, Voha , CHEN, Fufa , WANG, Jian , ZHANG, Xiaoyan , YANG, Shu
IPC分类号： H01L21/00
CPC分类号： G03F7/162 , H01L21/67086 , H01L21/6715 , H01L21/68742
摘要： A coater with automatic cleaning function and a coater automatic cleaning method. The coater (100,200,300,400,500,600,700,800) includes a coater chamber (101,201,301,401,501,601,701,801) capable of being filled up with cleaning solution, a substrate chuck (102,202,302,402,502,602,702,802) holding and positioning a substrate (103,203,303,403,503,603,703,803), and at least one shroud (108,208,308,408,508) capable of moving up for preventing photoresist from splashing out of the coater chamber (101,201,301,401,501,601,701,801), or moving down and immersing into the cleaning solution for cleaning. The coater (100,200,300,400,500,600,700,800) automatic cleaning method includes the following steps: turning off a liquid outlet valve (118,218,318,418A,418B,518,532,618,718,818) of the coater (100,200,300,400,500,600,700,800); filling up a coater chamber (101,201,301,401,501,601,701,801) with cleaning solution; after photoresist in the coater chamber (101,201,301,401,501,601,701,801) being dissolved into the cleaning solution, turning on the liquid outlet valve (118,218,318,418A,418B,518,532,618,718,818) and draining the cleaning solution out of the coater chamber (101,201,301,401,501,601,701,801).
摘要翻译：具有自动清洗功能的涂布机和涂布机的自动清洗方法。涂布机（100,200,300,400,500,600,700,800）包括能够填充清洁溶液的涂布机室（101,201,301,401,501,601,701,801），保持和定位基板（103,203,303,403,503,603,703,803）的基板卡盘（102,202,302,402,502,602,702,802）以及能够向上移动以防止的基板（108,208,308,408,508）从涂膜室（101,201,301,401,501,601,701,801）喷出的光致抗蚀剂，或者向下移动并浸入清洁溶液中以进行清洁。涂布机（100,200,300,400,500,600,700,800）自动清洗方法包括以下步骤：关闭涂布机的液体出口阀（118,218,318,418A，418B，518,532,618,718,818）（100,200,300,400,500,600,700,800）; 用清洁液填充涂布室（101,201,301,401,501,601,701,801）; 在涂布机室（101,201,301,401,501,601,701,801）中的光致抗蚀剂溶解在清洁溶液中之后，打开液体出口阀（118,218,318,418A，418B，518,532,618,718,818）并将清洁溶液排出涂布机室（101,201,301,401,501,601,701,801）。

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